摘要:
On one hand, a row address is provided via a buffer gate to a row address register 11, and its output is provided via a complementary signal generation circuit 15 and a predecoder 16 to a word decoder 17A. On the other hand, in response to an issuance of-an activate command a control signal AS1 is provided via a delay circuit 14 to the clock input CK of the row address register 11 as a strobe signal AS2, and AS2 is provided, to reduce timing margin, via a delay circuit 20A to the strobe signal input of the predecoder 16 as a strobe signal S2. S2 is provided via a delay circuit 20B to the strobe signal input of the word decoder 17A having RS flip-flops 2301 to 2332 or latch circuits. Each of the latch circuits consists of a NOR gate having a set input and a reset input and another NOR gate having an input coupled to receive the output of the former NOR gate and another set input to receive a multiple selection signal which is common for all the latch circuits in word decoders.
摘要:
On one hand, a row address is provided via a buffer gate to a row address register 11, and its output is provided via a complementary signal generation circuit 15 and a predecoder 16 to a word decoder 17A. On the other hand, in response to an issuance of an activate command a control signal AS1 is provided via a delay circuit 14 to the clock input CK of the row address register 11 as a strobe signal AS2, and AS2 is provided, to reduce timing margin, via a delay circuit 20A to the strobe signal input of the predecoder 16 as a strobe signal S2. S2 is provided via a delay circuit 20B to the strobe signal input of the word decoder 17A having RS flip-flops 2301 to 2332 or latch circuits. Each of the latch circuits consists of a NOR gate having a set input and a reset input and another NOR gate having an input coupled to receive the output of the former NOR gate and another set input to receive a multiple selection signal which is common for all the latch circuits in word decoders.
摘要:
A power supply line is formed over a memory cell array which has arranged a plurality of memory cells using a metal wiring layer M1 which is disposed on the side closest to the memory cell array, of all the metal wiring layers. The power supply lines are formed over the memory cell array using not only an upper metal wiring layer M2 but the metal wiring layer M1 so that the wiring resistance of the power supply lines may decrease and a sufficient amount of current can be supplied to the power supply lines. Consequently, the circuits supplied with an electric current through the power supply lines become capable of high-speed operation. This is particularly effective for the high-speed operation of the circuits arranged around the memory cell array. The power supply line formed using the lower metal wiring layer M1 is connected over the memory cell array to a power supply line which is formed using the metal wiring layer M2 on the upper layer than the metal wiring layer M1. Therefore, the netlike configuration of the power supply lines can be made with higher density compared to conventional ones.
摘要:
A semiconductor device characterized by comprising a first insulating film formed on the semiconductor substrate, a first wiring or mark formed on the first insulating film, an electrically isolated pattern formed under the first insulating film and below the first wiring or mark, a hole formed in the first insulating film to connect the first wiring or mark and the electrically isolated pattern, and a second insulating film for covering the first wiring or mark.
摘要:
A photomask has a plurality of transparent regions defined in an opaque region and classified into first and second groups. Each of the transparent regions belonging to one of the first and second groups is provided with a phase shifter, so that the phase of light transmitted through the transparent region belonging to the first group becomes different from the phase of light transmitted through the transparent region belonging to the second group. The photomask includes: a pair of first transparent regions belonging to the first group and including linear portions disposed in parallel, a virtual straight line interconnecting one ends of the first transparent regions intersecting at a right angle with the extension direction of the linear portions; and a second transparent region belonging to the second group and disposed at the center between, and in parallel to, the linear portions of the pair of first transparent regions, the second transparent region including a linear thickportion and a linear thin portion, the linear thin portion being disposed in an area between the pair of first transparent regions and continuously coupled to the linear thick portion, and a connection portion between the thick and thin portions being indented from the virtual straight line toward the area between the pair of first transparent regions.
摘要:
A semiconductor memory device having a shift redundancy function includes a switch circuit for changeably connecting a plurality of decode signal lines decoding an address signal to a plurality of selecting lines and redundancy selecting lines, and executes a switch operation for shifting at least one of a plurality of decode lines in the direction of a first redundancy selecting line positioned at one of the ends among a plurality of selecting lines or a second switch operation for shifting at least one of the decode lines in the direction of a second redundancy selecting line positioned at the other end among the selecting lines or both of the first and second operations when any fault occurs in a plurality of selecting lines. The semiconductor memory device preferably includes two or more first redundancy selecting lines positioned at one of the ends of a plurality of selecting lines, two or more second redundancy selecting lines positioned at the other end, and first and second switch units disposed in two stages. When any fault selecting line occurs, the first switch unit executes a first switch operation for shifting at least one of the decode signal lines in the direction of the first redundancy selecting line or a second switch operation for shifting the same in the direction of the second redundancy selecting line, or the second switch unit executes a third switch operation for shifting at least one decode signal line in the direction of the first redundancy selecting line or a fourth switch operation for shifting it in the direction of the second redundancy selecting line.
摘要:
According to the present invention, the main word lines arranged in a row direction have a linear pattern shape, and in the region where sub word decoder circuits are formed, the pattern of the main word lines has a shape whereby the pattern branches and splits into a plurality of lines and then reconverges, in the direction of the row. In the region where the line splits, relatively small island-shaped patterns of the conducting layer are located, forming nodes which have a difference electric potential from the main word lines. The main word lines are constituted by a first metal conducting layer, similarly to the prior art. In other words, small island-shaped metal layer patterns, which are electrically different from the main word lines are formed inside the conducting metal layer pattern constituting the main word lines, similarly to island formed in the middle of a river, for example.
摘要:
A method for fabricating a dynamic random access memory comprises the steps of forming a diffusion region in a semiconductor substrate, providing an insulation layer on the semiconductor substrate, forming a contact hole in the insulation layer to expose the diffusion region at the contact hole, depositing a semiconductor layer on the insulation layer in the amorphous state such that the semiconductor layer establishes an intimate contact with the exposed diffusion region via the contact hole, patterning the semiconductor layer to form a capacitor electrode, depositing a dielectric film on the capacitor electrode such that said dielectric film covers the capacitor electrode; and depositing a semiconductor material to form an opposing electrode such that the opposing electrode buries the capacitor electrode underneath while establishing an intimate contact with the dielectric film that covers the capacitor electrode.
摘要:
Micro-structures comprising at least a structural member, which is liable to be bent under an external force and formed so as to leave a space between the member and another member liable to be bent and/or other rigid component, are successfully treated using a treating liquid, without suffering permanent deformation resulting from the use of the treating liquid, by removing the micro-structures from the liquid to an environment having a pressure less than the atmospheric pressure; or displacing the micro-structures from the treating liquid to another treating liquid having a smaller surface tension than that of the former liquid, and then removing the micro-structures from the latter liquid; or drying the micro-structures removed from the treating liquid by exposing the same to vapor of a liquid having a smaller surface tension than that of the treating liquid; or removing the micro-structures from the treating liquid to the atmosphere, and drying them using an energy beam of high intensity or an ultrasonic wave. Micro-structures are also disclosed which comprise at least a member liable to be bent but are capable of avoiding permanent deformation of the member resulting from a treatment using a liquid.
摘要:
A memory device has a data line (DATA-BUS) for connection to a memory cell, a reference line (Reference-BUS) for reference, a precharge circuit (101), a load circuit (102), and an amplifier circuit (103). The precharge circuit is connected to the data line and the reference line and configured to precharge the data line and the reference line. The load circuit is connected to the data line and the reference line and configured to apply a first constant current to the data line and apply a second constant current which is smaller than the first constant current to the reference line. The amplification circuit is connected to the data line and the reference line and configured to amplify a differential voltage between the data line and the reference line.