FUNCTIONALIZED HIGHLY BRANCHED MELAMINE-POLYAMINE POLYMERS
    2.
    发明申请
    FUNCTIONALIZED HIGHLY BRANCHED MELAMINE-POLYAMINE POLYMERS 审中-公开
    功能齐全的高分子量的甲酰胺聚合物

    公开(公告)号:US20120252987A1

    公开(公告)日:2012-10-04

    申请号:US13516426

    申请日:2010-12-15

    IPC分类号: C08G73/02 C07D251/70

    摘要: The present invention relates to a method for producing amphiphilic functionalized highly branched melamine-polyamine polymers by condensing melamine and optionally a melamine derivate having at least one different amine having at least two primary amino groups and optionally also with urea and/or at least one urea derivative and/or with at least one at least difunctional diisocyanate or polyisocyanate and/or at least one carbolic acid having at least two carboxyl groups or at least one derivative thereof, optionally quaternizing a portion of the amino groups of the polymer thereby obtained, reacting the polymer thus obtained with at least one compound capable of undergoing a condensation or addition reaction with amino groups, and optionally quaternizing at least part of the amino groups of the polymer obtained in the first step. The invention further relates to the amphiphilic functionalized highly branched melamine-polyamine polymers that can be obtained by the method according to the invention, and to the use thereof as surface active agents.

    摘要翻译: 本发明涉及通过将三聚氰胺和任选地具有至少一种具有至少两个伯氨基的不同胺和任选地还含有尿素和/或至少一种尿素的三聚氰胺衍生物缩合制备两亲官能化的高度支化的三聚氰胺 - 聚胺聚合物的方法 衍生物和/或与至少一种至少二官能二异氰酸酯或多异氰酸酯和/或至少一种具有至少两个羧基基团的至少一种碳酸或至少一种衍生物,任选季铵化所得聚合物的一部分氨基,从而使 由此获得的聚合物与至少一种能够与氨基进行缩合或加成反应的化合物,以及任选季铵化至少部分第一步获得的聚合物的氨基。 本发明还涉及通过本发明的方法获得的两亲官能化的高度支化的三聚氰胺 - 聚胺聚合物及其作为表面活性剂的用途。

    PROCESS FOR THE ALKOXYLATION OF AMINO GROUP CONTAINING POLYMERS
    5.
    发明申请
    PROCESS FOR THE ALKOXYLATION OF AMINO GROUP CONTAINING POLYMERS 有权
    含氨基聚合物的烷氧基化方法

    公开(公告)号:US20100286342A1

    公开(公告)日:2010-11-11

    申请号:US12743754

    申请日:2008-11-17

    IPC分类号: C08F8/00

    摘要: The present invention relates to a process for the alkoxylation of a first polymer comprising at least one monomer unit having NH groups and optionally NH2 groups, wherein the first polymer has a molecular weight Mw of at least 500 g/mol, comprising the steps of (a) reacting the first polymer with alkylene oxide in a reaction mixture comprising a solvent until the average degree of alkoxylation of each NH group and each optional NH2 group, calculated as two NH groups, is from 0.75 to 1.25; (b) adding a second polymer of formula (I), wherein R is a linear or branched alkyl group having from 1 to 20 carbon atoms, each R′ is independently a linear or branched alkyl group having from 1 to 20 carbon atoms or hydrogen, each n is independently from 1 to 5 and m is from 5 to 40, to the reaction mixture of step (a); (c) at least partially removing the solvent from the reaction mixture of step (b); and (d) further reacting the reaction mixture of step (c) with alkylene oxide at a given temperature until the average degree of alkoxylation of each NH group and each optional NH2 group, calculated as two NH groups, of the first polymer is from 2 to 40. The present invention also relates to a polymer composition obtainable from that process and the use of such a polymer composition.

    摘要翻译: 本发明涉及第一聚合物的烷氧基化方法,其包括至少一个具有NH基团和任选的NH 2基团的单体单元,其中第一聚合物的分子量Mw至少为500g / mol,包括步骤( a)在包含溶剂的反应混合物中使第一聚合物与烯化氧反应,直到每个NH基团和每个任选的NH 2基团的平均烷氧基化程度计算为两个NH基团为0.75至1.25; (b)添加式(I)的第二聚合物,其中R是具有1至20个碳原子的直链或支链烷基,每个R'独立地是具有1至20个碳原子的直链或支链烷基或氢 相对于步骤(a)的反应混合物,每个n独立地为1至5,m为5至40。 (c)至少部分地从步骤(b)的反应混合物中除去溶剂; 和(d)在给定温度下使步骤(c)的反应混合物与烯化氧进一步反应,直到第一聚合物的两个NH基团计算的每个NH基团和每个任选的NH 2基团的平均烷氧基化程度为2 本发明还涉及可从该方法获得的聚合物组合物和这种聚合物组合物的用途。

    PROCESS FOR REMOVING A BULK MATERIAL LAYER FROM A SUBSTRATE AND A CHEMICAL MECHANICAL POLISHING AGENT SUITABLE FOR THIS PROCESS
    10.
    发明申请
    PROCESS FOR REMOVING A BULK MATERIAL LAYER FROM A SUBSTRATE AND A CHEMICAL MECHANICAL POLISHING AGENT SUITABLE FOR THIS PROCESS 审中-公开
    从基板上移除大块材料层的方法和适用于本工艺的化学机械抛光剂

    公开(公告)号:US20120235081A1

    公开(公告)日:2012-09-20

    申请号:US13510830

    申请日:2010-11-25

    IPC分类号: C09K13/00 B44C1/22 H01L21/306

    摘要: A process for removing a bulk material layer from a substrate and planarizing the exposed surface by CMP by (1) providing an CMP agent exhibiting at the end of the chemical mechanical polishing, without the addition of supplementary materials, the same SER as at its start and a lower MRR than at its start,—an SER which is lower than the initial SER and an MRR which is the same or essentially the same as the initial MRR or a lower SER and a lower MRR than at its start; (2) contacting the surface of the bulk material layer with the CMP agent; (3) the CMP of the bulk material layer with the CMP agent; and (4) continuing the CMP until all material residuals are removed from the exposed surface; and a CMP agent and their use for manufacturing electrical and optical devices.

    摘要翻译: (1)提供在化学机械抛光结束时显示的CMP试剂,而不添加补充材料,与其开始时相同的SER的方法,用于从基底去除体材料层并通过CMP平坦化暴露表面的方法 和比开始时更低的MRR - SER低于初始SER,MRR与初始MRR相同或基本相同或较低的SER和较低的MRR比开始时更低; (2)使本体材料层的表面与CMP剂接触; (3)散装材料层的CMP与CMP剂; 和(4)继续CMP,直到从暴露表面去除所有材料残留物; 和CMP剂及其用于制造电气和光学器件的用途。