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10 条记录 (耗时 0.036 秒)

    Bonding an optical element to a light emitting device
    1.
    发明申请
    Bonding an optical element to a light emitting device 有权
    将光学元件结合到发光器件

    公开(公告)号：US20060105478A1

    公开(公告)日：2006-05-18

    申请号：US10987241

    申请日：2004-11-12

    申请人： Michael Camras ,  William Imler ,  Franklin Wall ,  Frank Steranka ,  Michael Krames ,  Helena Ticha ,  Ladislav Tichy

    发明人： Michael Camras ,  William Imler ,  Franklin Wall ,  Frank Steranka ,  Michael Krames ,  Helena Ticha ,  Ladislav Tichy

    IPC分类号： H01L21/00

    CPC分类号： H05B33/0857 ,  H01L25/0753 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A device is provided with at least one light emitting device (LED) die mounted on a submount with an optical element subsequently thermally bonded to the LED die. The LED die is electrically coupled to the submount through contact bumps that have a higher temperature melting point than is used to thermally bond the optical element to the LED die. In one implementation, a single optical element is bonded to a plurality of LED dice that are mounted to the submount and the submount and the optical element have approximately the same coefficients of thermal expansion. Alternatively, a number of optical elements may be used. The optical element or LED die may be covered with a coating of wavelength converting material. In one implementation, the device is tested to determine the wavelengths produced and additional layers of the wavelength converting material are added until the desired wavelengths are produced.

    摘要翻译： 设备具有至少一个发光器件（LED）裸片，该发光器件（LED）裸片安装在具有随后热粘合到LED管芯上的光学元件的基座上。 LED管芯通过接触凸块电连接到副安装座，接触凸块具有比用于将光学元件热粘合到LED管芯的温度高的熔点。 在一个实现中，单个光学元件被结合到安装到基座上的多个LED芯片，并且基座和光学元件具有大致相同的热膨胀系数。 或者，可以使用多个光学元件。 光学元件或LED管芯可以用波长转换材料的涂层覆盖。 在一个实施方案中，测试该器件以确定产生的波长，并且添加波长转换材料的附加层，直到产生所需的波长。

    Illumination Device with a Wavelength Converting Element Held by a Support Structure Having an Aperture
    2.
    发明申请
    Illumination Device with a Wavelength Converting Element Held by a Support Structure Having an Aperture 有权
    具有波长转换元件的照明装置由具有孔径的支撑结构持有

    公开(公告)号：US20080290362A1

    公开(公告)日：2008-11-27

    申请号：US11754210

    申请日：2007-05-25

    申请人： Li Zhang ,  Franklin Wall ,  Richard S. Kern ,  Jeffrey D. Kmetec

    发明人： Li Zhang ,  Franklin Wall ,  Richard S. Kern ,  Jeffrey D. Kmetec

    IPC分类号： H01L33/00

    CPC分类号： H01L33/507 ,  H01L33/483 ,  H01L33/58

    摘要： An illumination device includes a light source, such as one or more light emitting diodes and a wavelength converting element that is mounted on an opaque support structure. The support structure includes an aperture with which the wavelength converting element is aligned so that the converted light is emitted through the aperture. The wavelength converting element may be a rigid structure, such as a luminescent ceramic and the aperture may be a hole through the support structure. The support structure may hold the wavelength converting element so that it is physically separated from the light source, or alternatively, the support structure may place the wavelength converting element in physical contact with the light source.

    摘要翻译： 照明装置包括诸如一个或多个发光二极管的光源和安装在不透明支撑结构上的波长转换元件。 支撑结构包括孔径，波长转换元件与孔对准，使得转换的光通过孔径发射。 波长转换元件可以是刚性结构，例如发光陶瓷，并且孔可以是穿过支撑结构的孔。 支撑结构可以保持波长转换元件，使得其与光源物理分离，或者替代地，支撑结构可以将波长转换元件与光源物理接触。

    Beam shutter in LED package
    5.
    发明申请
    Beam shutter in LED package 失效
    光束快门在LED封装

    公开(公告)号：US20060175626A1

    公开(公告)日：2006-08-10

    申请号：US11053091

    申请日：2005-02-07

    申请人： Franklin Wall

    发明人： Franklin Wall

    IPC分类号： H01L33/00

    CPC分类号： H01L33/60 ,  F21S41/141 ,  F21Y2115/10 ,  H01L33/58

    摘要： A beam shutter is disclosed that is affixed to an LED die submount or circuit board to sharply define the emitted pattern. The beam shutter may be a solid piece of aluminum or any other opaque material to block a portion of the light emitted from the LED die. The beam shutter is particularly advantageous for shaping the LED light for car headlamps.

    摘要翻译： 公开了一种光束快门，其被固定到LED管芯基座或电路板上以锐利地限定所发射的图案。 光束快门可以是实心的铝片或任何其他不透明材料，以阻挡从LED管芯发射的光的一部分。 光束快门对于汽车前照灯的LED灯的成形特别有利。

    Multiple pierce reflective angle transformer
    6.
    发明申请
    Multiple pierce reflective angle transformer 有权
    多重穿透反射角变压器

    公开(公告)号：US20070097696A1

    公开(公告)日：2007-05-03

    申请号：US11262192

    申请日：2005-10-28

    申请人： Gregory Eng ,  Mina Farr ,  Matthijs Keuper ,  Stefan Eberle ,  Franklin Wall

    发明人： Gregory Eng ,  Mina Farr ,  Matthijs Keuper ,  Stefan Eberle ,  Franklin Wall

    IPC分类号： F21V7/00

    CPC分类号： F21V7/0025 ,  F21K9/68 ,  F21V17/005 ,  F21Y2115/10 ,  H01L33/60 ,  Y10S362/80

    摘要： Collection optics are used with one or more light emitting diodes to produce, e.g., collimated light. The collection optics are produced in multiple pieces including a small reflective ring that surrounds the one or more light emitting diodes. The reflective ring may be positioned relative to the LEDs, using a mesa upon which the LEDs are mounted, as a lateral positioning guide. A separate upper reflector uses the reflective ring as a lateral positioning guide during assembly. The reflective ring and the upper reflector include reflective sidewalls that are approximately continuous when the reflective ring and upper reflector are assembled.

    摘要翻译： 收集光学器件与一个或多个发光二极管一起使用以产生例如准直光。 收集光学器件以多个片段制造，包括围绕一个或多个发光二极管的小反射环。 反射环可以相对于LED定位，使用其上安装有LED的台面作为横向定位引导件。 单独的上反射器在组装期间使用反射环作为横向定位导向器。 反射环和上反射器包括当反射环和上反射器组装时大致连续的反射侧壁。

    Method of removing the growth substrate of a semiconductor light emitting device
    8.
    发明申请
    Method of removing the growth substrate of a semiconductor light emitting device 有权
    去除半导体发光器件的生长衬底的方法

    公开(公告)号：US20060281203A1

    公开(公告)日：2006-12-14

    申请号：US11149679

    申请日：2005-06-09

    申请人： John Epler ,  Oleg Shohekin ,  Franklin Wall ,  Jonathan Wierer ,  Ling Zhou

    发明人： John Epler ,  Oleg Shohekin ,  Franklin Wall ,  Jonathan Wierer ,  Ling Zhou

    IPC分类号： H01L21/00

    CPC分类号： H01L33/0079 ,  H01L24/97 ,  H01L33/382 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A semiconductor structure formed on a growth substrate and including a light emitting layer disposed between an n-type region and a p-type region is attached to a carrier by a connection that supports the semiconductor structure sufficiently to permit removal of the growth substrate. In some embodiments, the semiconductor structure is a flip chip device. The semiconductor structure may be attached to the carrier by, for example, a metal bond that supports almost the entire lateral extent of the semiconductor structure, or by interconnects such as solder or gold stud bumps. An underfill material which supports the semiconductor structure is introduced in any spaces between the interconnects. The underfill material may be a liquid that is cured to form a rigid structure. The growth substrate may then be removed without causing damage to the semiconductor structure.

    摘要翻译： 在生长衬底上形成的包括设置在n型区域和p型区域之间的发光层的半导体结构通过足以支持半导体结构以允许去除生长衬底的连接而附着到载体上。 在一些实施例中，半导体结构是倒装芯片器件。 半导体结构可以通过例如支撑几乎整个半导体结构的整个横向范围的金属接合，或者通过诸如焊料或金柱凸起的互连来附接到载体。 支撑半导体结构的底部填充材料被引入互连之间的任何空间。 底部填充材料可以是固化以形成刚性结构的液体。 然后可以去除生长衬底而不会对半导体结构造成损害。

    RGB thermal isolation substrate
    9.
    发明申请
    RGB thermal isolation substrate 有权
    RGB热隔离衬底

    公开(公告)号：US20060243986A1

    公开(公告)日：2006-11-02

    申请号：US11118898

    申请日：2005-04-29

    申请人： Franklin Wall

    发明人： Franklin Wall

    IPC分类号： H01L33/00

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00014

    摘要： A submount for red, green, and blue LEDs is described where the submount has thermally isolated trenches and/or holes in the submount so that the high heat generated by the green/blue AlInGaN LEDs is not conducted to the red AllnGaP LEDs. The submount contains conductors to interconnect the LEDs in a variety of configurations. In one embodiment, the AllnGaP LEDs are recessed in the submount so all LEDs have the same light exit plane. The submount may be used for LEDs generating other colors, such as yellow, amber, orange, and cyan.

    摘要翻译： 描述了用于红色，绿色和蓝色LED的基座，其中子安装座在底座中具有热隔离的沟槽和/或孔，使得由绿色/蓝色AlInGaN LED产生的高热不传导到红色的AllnGaP LED。 底座包含用于以各种配置互连LED的导体。 在一个实施例中，AllnGaP LED凹入到底座中，因此所有LED具有相同的光出射平面。 底座可用于产生其他颜色的LED，例如黄色，琥珀色，橙色和青色。

    LED lamp heat sink
    10.
    发明申请
    LED lamp heat sink 有权
    LED灯泡散热器

    公开(公告)号：US20050111234A1

    公开(公告)日：2005-05-26

    申请号：US10723711

    申请日：2003-11-26

    申请人： Paul Martin ,  Franklin Wall

    发明人： Paul Martin ,  Franklin Wall

    IPC分类号： F21V29/00 ,  F21K99/00 ,  F21S2/00 ,  F21V7/04 ,  F21V7/10 ,  F21V9/00 ,  F21V29/02 ,  F21Y101/02 ,  H01L33/00

    CPC分类号： F21V29/74 ,  F21K9/233 ,  F21S6/003 ,  F21S8/026 ,  F21V7/0091 ,  F21V17/101 ,  F21V17/164 ,  F21V29/004 ,  F21V29/505 ,  F21V29/67 ,  F21V29/673 ,  F21V29/75 ,  F21V29/77 ,  F21V29/773 ,  F21V29/83 ,  F21Y2115/10

    摘要： An LED lamp includes an exterior shell that has the same form factor as a conventional incandescent light bulb, such as a PAR type bulb. The LED lamp includes an optical reflector that is disposed within the shell and that directs the light emitted from one or more LEDs. The optical reflector and shell define a space that is used to channel air to cool the device. The LED is mounted on a heat sink that is disposed within the shell. A fan moves air over the heat sink and through the spaced defined by the optical reflector and the shell. The shell includes one or more apertures that serve as air inlet or exhaust apertures. One or more apertures defined by the optical reflector and shell at the opening of the shell can also be used as air exhaust or inlet apertures.

    摘要翻译： LED灯包括具有与常规白炽灯泡（例如PAR型灯泡）相同形状因数的外壳。 LED灯包括设置在外壳内并引导从一个或多个LED发出的光的光学反射器。 光学反射器和壳体限定了用于引导空气冷却设备的空间。 LED安装在设置在外壳内的散热器上。 风扇将空气移动到散热器上方并通过光学反射器和外壳限定的间隔。 壳体包括用作空气入口或排气孔的一个或多个孔。 由光学反射器和壳体在壳体的开口处限定的一个或多个孔也可以用作排气孔或入口孔。