AlInGaP LED Having Reduced Temperature Dependence
    1.
    发明申请
    AlInGaP LED Having Reduced Temperature Dependence 有权
    具有降低温度依赖性的AlInGaP LED

    公开(公告)号:US20070131961A1

    公开(公告)日:2007-06-14

    申请号:US11672003

    申请日:2007-02-06

    IPC分类号: H01L33/00 H01L21/00

    摘要: To increase the lattice constant of AlInGaP LED layers to greater than the lattice constant of GaAs for reduced temperature sensitivity, an engineered growth layer is formed over a substrate, where the growth layer has a lattice constant equal to or approximately equal to that of the desired AlInGaP layers. In one embodiment, a graded InGaAs or InGaP layer is grown over a GaAs substrate. The amount of indium is increased during growth of the layer such that the final lattice constant is equal to that of the desired AlInGaP active layer. In another embodiment, a very thin InGaP, InGaAs, or AlInGaP layer is grown on a GaAs substrate, where the InGaP, InGaAs, or AlInGaP layer is strained (compressed). The InGaP, InGaAs, or AlInGaP thin layer is then delaminated from the GaAs and relaxed, causing the lattice constant of the thin layer to increase to the lattice constant of the desired overlying AlInGaP LED layers. The LED layers are then grown over the thin InGaP, InGaAs, or AlInGaP layer.

    摘要翻译: 为了将AlInGaP LED层的晶格常数提高到大于GaAs的晶格常数以降低温度敏感性,在衬底上形成工程化生长层,其中生长层具有等于或近似等于所需的晶格常数的晶格常数 AlInGaP层。 在一个实施例中,在GaAs衬底上生长渐变的InGaAs或InGaP层。 在层的生长期间铟的量增加,使得最终晶格常数等于所需的AlInGaP活性层的量。 在另一实施例中,在GaAs衬底上生长非常薄的InGaP,InGaAs或AlInGaP层,其中InGaP,InGaAs或AlInGaP层被应变(压缩)。 然后,InGaP,InGaAs或AlInGaP薄层从GaAs分层并且弛豫,导致薄层的晶格常数增加到期望的上覆AlInGaP LED层的晶格常数。 然后在薄的InGaP,InGaAs或AlInGaP层上生长LED层。

    A1lnGaP LED having reduced temperature dependence
    2.
    发明申请
    A1lnGaP LED having reduced temperature dependence 有权
    AlInGaP LED具有降低的温度依赖性

    公开(公告)号:US20060220031A1

    公开(公告)日:2006-10-05

    申请号:US11100080

    申请日:2005-04-05

    IPC分类号: H01L33/00

    摘要: To increase the lattice constant of AlInGaP LED layers to greater than the lattice constant of GaAs for reduced temperature sensitivity, an engineered growth layer is formed over a substrate, where the growth layer has a lattice constant equal to or approximately equal to that of the desired AlInGaP layers. In one embodiment, a graded InGaAs or InGaP layer is grown over a GaAs substrate. The amount of indium is increased during growth of the layer such that the final lattice constant is equal to that of the desired AlInGaP active layer. In another embodiment, a very thin InGaP, InGaAs, or AlInGaP layer is grown on a GaAs substrate, where the InGaP, InGaAs, or AlInGaP layer is strained (compressed). The InGaP, InGaAs, or AlInGaP thin layer is then delaminated from the GaAs and relaxed, causing the lattice constant of the thin layer to increase to the lattice constant of the desired overlying AlInGaP LED layers. The LED layers are then grown over the thin InGaP, InGaAs, or AlInGaP layer.

    摘要翻译: 为了将AlInGaP LED层的晶格常数提高到大于GaAs的晶格常数以降低温度敏感性,在衬底上形成工程化生长层,其中生长层具有等于或近似等于所需的晶格常数的晶格常数 AlInGaP层。 在一个实施例中,在GaAs衬底上生长渐变的InGaAs或InGaP层。 在层的生长期间铟的量增加,使得最终晶格常数等于所需的AlInGaP活性层的量。 在另一实施例中,在GaAs衬底上生长非常薄的InGaP,InGaAs或AlInGaP层,其中InGaP,InGaAs或AlInGaP层被应变(压缩)。 然后,InGaP,InGaAs或AlInGaP薄层从GaAs分层并且弛豫,导致薄层的晶格常数增加到期望的上覆AlInGaP LED层的晶格常数。 然后在薄的InGaP,InGaAs或AlInGaP层上生长LED层。

    Reverse polarization light emitting region for a semiconductor light emitting device
    4.
    发明申请
    Reverse polarization light emitting region for a semiconductor light emitting device 有权
    用于半导体发光器件的反向偏振发光区域

    公开(公告)号:US20060197100A1

    公开(公告)日:2006-09-07

    申请号:US11226185

    申请日:2005-09-13

    IPC分类号: H01L33/00 H01L29/22

    CPC分类号: H01L33/32 H01L33/16

    摘要: A semiconductor light emitting device includes a light emitting layer disposed between an n-type region and a p-type region. The light emitting layer may be a wurtzite III-nitride layer with a thickness of at least 50 angstroms. The light emitting layer may have a polarization reversed from a conventional wurtzite III-nitride layer, such that across an interface between the light emitting layer and the p-type region, the wurtzite c-axis points toward the light emitting layer. Such an orientation of the c-axis may create a negative sheet charge at an interface within or at the edge of the p-type region, providing a barrier to charge carriers in the light emitting layer.

    摘要翻译: 半导体发光器件包括设置在n型区域和p型区域之间的发光层。 发光层可以是厚度至少为50埃的纤锌矿III族氮化物层。 发光层可以具有与常规的纤锌矿III族氮化物层相反的偏振,使得在发光层和p型区域之间的界面上,纤锌矿c轴指向发光层​​。 c轴的这种取向可以在p型区域的边缘内或边缘处的界面处产生负片材电荷,为发光层中的载流子提供阻挡。

    III-V light emitting device
    5.
    发明申请
    III-V light emitting device 审中-公开
    III-V发光装置

    公开(公告)号:US20070069225A1

    公开(公告)日:2007-03-29

    申请号:US11237215

    申请日:2005-09-27

    IPC分类号: H01L33/00 H01L29/22

    摘要: A semiconductor structure includes an n-type region, a p-type region, and a III-nitride light emitting layer disposed between the n-type region and the p-type region. The III-nitride light emitting layer has a lattice constant greater than 3.19 Å. Such a semiconductor structure may be grown on a substrate including a host and a seed layer bonded to the host. In some embodiments, a bonding layer bonds the host to the seed layer. The seed layer may be thinner than a critical thickness for relaxation of strain in the semiconductor structure, such that strain in the semiconductor structure is relieved by dislocations formed in the seed layer, or by gliding between the seed layer and the bonding layer an interface between the two layers. In some embodiments, the host may be separated from the semiconductor structure and seed layer by etching away the bonding layer.

    摘要翻译: 半导体结构包括设置在n型区域和p型区域之间的n型区域,p型区域和III族氮化物发光层。 III族氮化物发光层的晶格常数大于3.19埃。 这样的半导体结构可以在包含与主体结合的主体和种子层的基板上生长。 在一些实施方案中,结合层将主体结合到种子层。 种子层可以比用于缓和半导体结构中的应变的临界厚度薄,使得半导体结构中的应变由种子层中形成的位错或通过在种子层和结合层之间滑动而消除, 两层。 在一些实施例中,可以通过蚀刻掉粘合层来将主体与半导体结构和种子层分离。

    Substrate for growing a III-V light emitting device
    8.
    发明申请
    Substrate for growing a III-V light emitting device 有权
    用于生长III-V发光器件的衬底

    公开(公告)号:US20070072324A1

    公开(公告)日:2007-03-29

    申请号:US11237164

    申请日:2005-09-27

    IPC分类号: H01L21/00 H01G9/20

    摘要: A substrate including a host and a seed layer bonded to the host is provided, then a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region is grown on the seed layer. In some embodiments, a bonding layer bonds the host to the seed layer. The seed layer may be thinner than a critical thickness for relaxation of strain in the semiconductor structure, such that strain in the semiconductor structure is relieved by dislocations formed in the seed layer, or by gliding between the seed layer and the bonding layer an interface between the two layers. In some embodiments, the host may be separated from the semiconductor structure and seed layer by etching away the bonding layer.

    摘要翻译: 提供了包括与主体结合的主体和种子层的基板,然后在种子层上生长包括设置在n型区域和p型区域之间的发光层的半导体结构。 在一些实施方案中,结合层将主体结合到种子层。 种子层可以比用于缓和半导体结构中的应变的临界厚度薄,使得半导体结构中的应变由种子层中形成的位错或通过在种子层和结合层之间滑动而消除, 两层。 在一些实施例中,可以通过蚀刻掉粘合层来将主体与半导体结构和种子层分离。

    Semiconductor light emitting devices with graded compositon light emitting layers
    10.
    发明申请
    Semiconductor light emitting devices with graded compositon light emitting layers 有权
    具有分级组合发光层的半导体发光器件

    公开(公告)号:US20060091404A1

    公开(公告)日:2006-05-04

    申请号:US10977867

    申请日:2004-10-29

    摘要: A III-nitride light emitting layer in a semiconductor light emitting device has a graded composition. The composition of the light emitting layer may be graded such that the change in the composition of a first element is at least 0.2% per angstrom of light emitting layer. Grading in the light emitting layer may reduce problems associated with polarization fields in the light emitting layer. The light emitting layer may be, for example InxGa1-xN, AlxGa1-xN, or InxAlyGa1-x-yN.

    摘要翻译: 半导体发光器件中的III族氮化物发光层具有渐变组成。 发光层的组成可以分级,使得第一元素的组成的变化为每发光层的至少0.2%。 在发光层中的分级可以减少与发光层中的极化场相关的问题。 发光层可以是例如在N 1 Ga 1-x N,Al x Ga 1-x N 2 > N,或在<! - SIPO - >中。