公开(公告)号：US20100000087A1

公开(公告)日：2010-01-07

申请号：US12555305

申请日：2009-09-08

Applicant: Yasuhiro WATANABE ,  Michimasa TAKAHASHI ,  Masakazu AOYAMA ,  Takenobu NAKAMURA ,  Hiroyuki YANAGISAWA

Inventor： Yasuhiro WATANABE ,  Michimasa TAKAHASHI ,  Masakazu AOYAMA ,  Takenobu NAKAMURA ,  Hiroyuki YANAGISAWA

IPC: H05K3/02

CPC classification number: H05K1/113 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/114 ,  H05K3/243 ,  H05K3/28 ,  H05K3/282 ,  H05K3/4614 ,  H05K2201/0391 ,  H05K2201/10674 ,  H05K2203/0574 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  H01L2224/0401

Abstract: This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad 60B on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, land 60A in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.

Abstract translation: 本发明提供了一种通过提高可靠性而获得电连接性和功能性的多层印刷线路板，特别是可提高落下试验的可靠性。 在要安装部件的焊料垫60B上没有形成耐腐蚀层，以获得柔性。 因此，如果在相关产品掉线时从外部接收到冲击，则可以缓冲影响，以保护所安装的组件不被移除。 另一方面，即使构成操作键的碳柱重复接触，也可能不形成耐腐蚀层的焊盘60A不会发生接触故障。

公开(公告)号：US20110308079A1

公开(公告)日：2011-12-22

申请号：US13219169

申请日：2011-08-26

Applicant: Michimasa TAKAHASHI ,  Masakazu AOYAMA

Inventor： Michimasa TAKAHASHI ,  Masakazu AOYAMA

IPC: H05K3/00

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/4652 ,  H05K3/4664 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  Y10T29/49124 ,  Y10T29/49165

Abstract: A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

Abstract translation: 弹性刚性布线板包括柔性基板，该柔性基板包括形成在柔性基板上的柔性基板和导体图案，邻近柔性基板设置的非柔性基板，覆盖柔性基板和非柔性基板的绝缘层，以及 暴露柔性板的一个或多个部分，形成在绝缘层上的导体图案，以及将柔性板的导体图案和导体图案连接在绝缘层上的镀层。

公开(公告)号：US20090020326A1

公开(公告)日：2009-01-22

申请号：US12146032

申请日：2008-06-25

Applicant: Michimasa TAKAHASHI ,  Masakazu AOYAMA

Inventor： Michimasa TAKAHASHI ,  Masakazu AOYAMA

IPC: H01R12/04 ,  H05K3/00

CPC classification number: H05K3/4691 ,  H05K1/0366 ,  H05K3/0052 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/091 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/1536

Abstract: A wiring board and method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate.

Abstract translation: 布线基板及布线基板的形成方法。 布线板包括第一基板和具有比第一基板的安装面积小的安装面积的第二基板。 基底衬底层压在第一衬底和第二衬底之间，使得第一衬底延伸超过第二衬底的边缘，以及形成在第一衬底或第二衬底中的至少一个衬底中的至少一个通孔。 夹在第一基板和第二基板之间的基底基板的一部分的厚度大于未被夹在第一基板和第二基板之间的基底部分的厚度。

公开(公告)号：US20120008296A1

公开(公告)日：2012-01-12

申请号：US13239707

申请日：2011-09-22

Applicant: Masakazu AOYAMA ,  Hidetoshi Noguchi

Inventor： Masakazu AOYAMA ,  Hidetoshi Noguchi

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K1/142 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/09145 ,  Y10T29/49155 ,  Y10T29/49162

Abstract: A wiring board including a first rigid wiring board having an accommodation portion and a conductor, a second rigid wiring board accommodated in the accommodation portion of the first rigid wiring board and having a conductor electrically connected to the conductor of the first rigid wiring board, and an insulation layer formed on the first rigid wiring board and the second rigid wiring board. The accommodation portion of the first rigid wiring board has wall surfaces tapering from a first surface of the first rigid wiring board to a second surface on the opposite side of the first surface, and the second rigid wiring board has side surfaces tapering such that the side surfaces of the second rigid wiring board substantially fit into the wall surfaces of the accommodation portion of the first rigid wiring board.

Abstract translation: 一种布线板，包括具有容纳部分和导体的第一刚性布线板，容纳在第一刚性布线板的容纳部分中并且具有电连接到第一刚性布线板的导体的导体的第二刚性布线板，以及 绝缘层，形成在第一刚性布线板和第二刚性布线板上。 第一刚性布线板的容纳部分具有从第一刚性布线板的第一表面到第一表面的相反侧的第二表面逐渐变细的壁表面，并且第二刚性布线板具有渐缩的侧表面，使得侧面 第二刚性布线板的表面基本上装配在第一刚性布线板的容纳部分的壁表面中。

公开(公告)号：US20120008297A1

公开(公告)日：2012-01-12

申请号：US13239733

申请日：2011-09-22

Applicant: Masakazu AOYAMA ,  Hidetoshi NOGUCHI

Inventor： Masakazu AOYAMA ,  Hidetoshi NOGUCHI

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K1/142 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/09145 ,  Y10T29/49155 ,  Y10T29/49162

Abstract: A wiring board including a first rigid wiring board including a conductor and having an accommodation portion, the accommodation portion having wall surfaces, a second rigid wiring board accommodated in the accommodation portion and including a conductor electrically connected to the conductor of the first rigid wiring board, the second rigid wiring board having side surfaces, an insulation layer formed on the first rigid wiring board and the second rigid wiring board, and a metal film having a solid pattern formed directly on a boundary portion formed between the wall surfaces of the accommodation portion and the side surfaces of the second rigid wiring board.

Abstract translation: 一种布线板，包括：第一刚性布线板，包括导体并具有容纳部分，所述容纳部分具有壁表面;第二刚性布线板，容纳在所述容纳部分中，并且包括导体，电连接到所述第一刚性布线板的导体 具有侧表面的第二刚性布线板，形成在第一刚性布线板和第二刚性布线板上的绝缘层和直接形成在容纳部分的壁表面之间的边界部分上的实心图案的金属膜 和第二刚性布线板的侧面。