摘要:
A high-temperature solder alloy is a Bi—Sn based solder alloy containing at least 90 mass % of Bi, further containing 1-5 mass % of Sn, at least one element selected from Sb and/or Ag each in an amount of 0.5-5 mass %, and preferably further containing 0.0004-0.01 mass % of P.
摘要:
A high-temperature solder alloy is a Bi—Sn based solder alloy containing at least 90 mass % of Bi, further containing 1-5 mass % of Sn, at least one element selected from Sb and/or Ag each in an amount of 0.5-5 mass %, and preferably further containing 0.0004-0.01 mass % of P.
摘要:
A method for soldering a surface-mount component onto a circuit board. The melting of die-bonding solder material is prevented by using a mounting solder material when soldering a surface-mount component formed using the die-bonding solder material onto a printed circuit board. The surface-mount component, formed using (Sn—Sb)-based solder material having high melting point, the (Sn—Sb)-based solder material containing Cu but not more than a predetermined quantity of Cu constituent and a main ingredient thereof being Sn, is soldered on a board terminal portion of a circuit board using (Sn—Ag—Cu—Bi)-based solder material or (Sn—Ag—Cu—Bi—In)-based solder material as the mounting solder material and with the solder material being applied on the terminal portion. Since solidus temperature of the die-bonding solder material is 243 degrees C. and liquidus temperature of the mounting solder material is about 215 through 220 degrees C., the melting of die-bonding solder material is prevented even at the heating temperature (240 degrees C. or less) of a reflow furnace.
摘要:
The melting of die-bonding solder material is prevented even when soldering a surface-mount component formed using the die-bonding solder material on a printed circuit board using a mounting solder material.The surface-mount component formed using (Sn—Sb)-based solder material having high melting point as the solder material for die pad, the (Sn—Sb)-based solder material containing Cu not more than a predetermined quantity of Cu constituent and a main ingredient thereof being Sn, is soldered on a board terminal portion of a circuit board using (Sn—Ag—Cu—Bi)-based solder material as the mounting solder material with the solder material being applied on the terminal portion. Since solidus temperature of the die-bonding solder material is 243 degrees C. and liquidus temperature of the mounting solder material is about 215 through 220 degrees C., the melting of die-bonding solder material is prevented even at the heating temperature (240 degrees C. or less) of a reflow furnace.
摘要:
An image forming apparatus includes an image forming device to form a cleaning toner image in a cleaning region on a cleaning sheet and a check toner image in a check region on the cleaning sheet. The image forming apparatus further includes a fixing device including a first rotator and a heater to heat the first rotator to a cleaning temperature that is lower than a fixing temperature to which the first rotator is heated in a print job and higher than a cold offset temperature at which toner adheres to the first rotator by cold offset. Each of the cleaning region and the check region has a length greater than a circumferential length of the first rotator. The cleaning region and the check region are disposed at a leading section and a trailing section of the cleaning sheet in a cleaning sheet conveyance direction, respectively.
摘要:
A fixing device includes a heat conductor disposed opposite an inner circumferential surface of an endless belt to heat the endless belt. A nip formation pad is disposed opposite the inner circumferential surface of the endless belt and presses the endless belt against a pressing rotary body to form a fixing nip between the endless belt and the pressing rotary body through which a recording medium bearing a toner image is conveyed. A support is disposed opposite an inner circumferential surface of the heat conductor and contacts an abutment face of the nip formation pad to support the nip formation pad against pressure from the pressing rotary body. A heat insulator is interposed between the heater and the nip formation pad and the support to shield the nip formation pad and the support from the heater.
摘要:
A vehicle has a rotary magnetic field member which is rotatably supported at a position near the surface of a roadway along which the vehicle runs and rotatingly driven by a driving device. The rotary magnetic field member has magnetic poles of different polarities alternately arranged around its circumference. The vehicle also has an electrical power collector for receiving electrical power from an electrical power supply associated with the roadway. The received electrical power is supplied under the control of a controller to the driving device thereby rotatably driving the rotary magnetic field member. The rotary magnetic field member when rotated relative to the roadway made of an electrically conductive non-magnetic material, forms a varying magnetic field in cooperation with the roadway, thereby generating propulsion force for propelling the vehicle and force for suspending the vehicle, so that the vehicle is propelled in a floating state. It is therefore possible to reduce friction between wheels of the vehicle and the roadway and, hence, to suppress wear of the wheels. In a high-speed transportation system of the invention, the electrical power collector picks up electrical power from the electrical power supply and the rotary magnetic field member is rotatingly driven by the power picked up by the electrical power collector.
摘要:
A key holder which includes a body and a key pivotably mounted on the body and movable between an operating position in which the key is disposed outside of the body and a non-operating position in which the key is housed within the body. The key holder may also include a biasing member for maintaining the key at the operating position thereof or the non-operating position thereof and the key may include a stopper member disposed thereon which is engageable with the body to maintain the key at the non-operating position thereof.
摘要:
A powder storage container is provided. The powder storage container includes a container body, a discharge port, a conveyer, a stirrer, a return port, and a partition wall. The container body is configured to contain powder. The powder contained in the container body is dischargeable through the discharge port. The conveyer is configured to convey the powder to the discharge port. The stirrer is configured to stir the powder contained in the container body by rotating. The return port is disposed outside a rotational locus of the stirrer in a radial direction, and the powder conveyed by the conveyer is returnable through the return port toward the stirrer. The partition wall is disposed between the stirrer and the return port with at least a part of the partition wall positioned above the return port.
摘要:
A process unit includes a rotatable image bearer to bear a toner image on a surface thereof; a developer bearer to supply developer to the image bearer and including a first range, a second range different in property from the first range and adjacent to the first range on an outer side in an axial direction via a first boundary, and a second boundary on an outer side of the first boundary in the axial direction; a cleaning member to remove residual developer from the image bearer; and an abutment part disposed to contact the surface of the image bearer to remove a foreign substance from the image bearer. The abutment part is disposed astride at least one of a first position on the image bearer corresponding to the first boundary, and a second position on the image bearer corresponding to the second boundary.