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1.发明授权Method of preparing an insoluble polymer film on a substrate from a soluble polymer containing labile solubilizing groups 失效从含有不稳定增溶基团的可溶性聚合物制备底物上不溶性聚合物膜的方法公开(公告)号：US07399504B2
公开(公告)日：2008-07-15
申请号：US10936010
申请日：2004-09-08
申请人： Mitchell Gene Dibbs , Michael Inbasekaran , Paul Henson Townsend, III , Kenneth L. Foster , Shaoguang S. Feng , David J. Brennan , Q. Jason Niu , James P. Godschalx , Dean M. Welsh , Ray E. Drumright
发明人： Mitchell Gene Dibbs , Michael Inbasekaran , Paul Henson Townsend, III , Kenneth L. Foster , Shaoguang S. Feng , David J. Brennan , Q. Jason Niu , James P. Godschalx , Dean M. Welsh , Ray E. Drumright
CPC分类号： H01L51/0043 , H01L51/0003 , H01L51/0035 , H01L51/0039 , H01L51/0059
摘要： The present invention relates to a method for preparing polymeric films, preferably electroactive films, with enhanced physical properties by the steps of applying to a substrate a solution of a polymer containing pendant labile solubilizing groups, then removing the solvent and a sufficient concentration of the labile solubilizing groups render the polymer less soluble in the solvent than before the labile groups were removed. It is believed that the removal of pendant soluble groups a) permits optimization of the semiconducting backbone for charge transport performance, b) allows direct control of microstructure in the final film, and c) renders the final film more robust during subsequent process steps needed to construct multilayer devices.
摘要翻译： 本发明涉及通过以下步骤制备具有增强的物理性能的聚合物薄膜，优选电活性薄膜的方法：向基材施加含有不稳定增溶基团的聚合物溶液，然后除去溶剂和足够浓度的不稳定 增溶基团使得聚合物在除去不稳定基团之前较不溶于溶剂。 据信去除侧链可溶性基团a）允许优化用于电荷传输性能的半导电骨架，b）允许直接控制最终膜中的微结构，以及c）使后续工艺步骤中的最终膜更坚固， 构建多层设备。
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2.发明授权Multifunctional unsymmetrically substituted monomers and polyarylene compositions therefrom 有权多功能不对称取代的单体和聚亚芳基组合物公开(公告)号：US07381850B2
公开(公告)日：2008-06-03
申请号：US10549382
申请日：2004-04-01
IPC分类号： C07C49/537 , C08F36/00 , H01L29/08
CPC分类号： H01L21/02118 , C07C17/266 , C07C45/29 , C07C45/30 , C07C45/68 , C07C45/74 , C07C49/683 , C07C49/753 , C08G2261/312 , H01L21/02282 , H01L21/312 , H01L21/31695 , C07C25/24 , C07C49/813 , C07C49/796
摘要： A monomer suitable for use in forming low dielectric constant films in semiconductor devices comprising i) two dienophile groups (A-functional groups) attached to a single aromatic ring and ii) a second ring structure comprising two conjugated carbon-to-carbon double bonds and a leaving group L (B-functional group), characterized in that said single aromatic ring is directly covalently attached to one of the double bonded carbons of the B functional group or to a fused aromatic ring containing two such double bonded carbons of the B-functional group, and one A-functional group of one monomer is capable of reaction under cycloaddition reaction conditions with the B-functional group of a second monomer to thereby form a polymer.
摘要翻译： 一种适用于在半导体器件中形成低介电常数膜的单体，其包括：i）与单个芳香环相连的两个亲电子基团（A-官能团）和ii）包含两个共轭碳 - 碳双键的第二环结构和 离去基团L（B-官能团），其特征在于所述单芳环直接共价连接到B官能团的双键键合碳之一或含有两个这样的双键结合碳的稠合芳环上， 官能团和一个单体的一个A官能团能够在环加成反应条件下与第二单体的B官能团反应，从而形成聚合物。
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3.发明授权Multifunctional monomers and their use in making cross-linked polymers and porous films 有权多功能单体及其在制备交联聚合物和多孔膜中的应用公开(公告)号：US07635741B2
公开(公告)日：2009-12-22
申请号：US10365938
申请日：2003-02-12
CPC分类号： H01L23/5329 , C07C45/30 , C07C45/46 , C07C45/48 , C07C45/65 , C07C45/66 , C07C45/68 , C07C45/81 , C07C49/683 , C07C49/753 , C07C49/84 , C07D309/38 , H01L2924/0002 , Y10T428/249953 , C07C49/233 , H01L2924/00
摘要： This invention is a monomer comprising at least two dienophile groups and at least two ring structures which ring structures are characterized by the presence of two conjugated carbon-to-carbon double bonds and the presence of a leaving group L, wherein L is characterized that when the ring structure reacts with a dienophile in the presence of heat or other energy sources, L is removed to form an aromatic ring structure. This invention is also curable oligomers and polymers and highly cross-linked polymers made with such monomers. Moreover, this invention is a method of making porous films by combining such monomers or their oligomers with a porogen, curing the polymer and removing the porogen.
摘要翻译： 本发明是包含至少两个亲双烯体基团和至少两个环结构的单体，其中环结构的特征在于存在两个共轭碳 - 碳双键和存在离去基团L，其中L的特征在于当 环结构在热或其他能量源的存在下与亲二烯体反应，除去L以形成芳环结构。 本发明也是可固化的低聚物和聚合物以及用这种单体制备的高度交联的聚合物。 此外，本发明是通过将这些单体或其低聚物与致孔剂组合，固化聚合物和除去致孔剂来制备多孔膜的方法。
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公开(公告)号：US20080142930A1
公开(公告)日：2008-06-19
申请号：US12035047
申请日：2008-02-21
申请人： Eric Connor , James P. Godschalx , Craig J. Hawker , James L. Hedrick , Victor Yee-Way Lee , Teddie P. Magbitang , Robert D. Miller , Q. Jason Niu , Willi Volksen
发明人： Eric Connor , James P. Godschalx , Craig J. Hawker , James L. Hedrick , Victor Yee-Way Lee , Teddie P. Magbitang , Robert D. Miller , Q. Jason Niu , Willi Volksen
CPC分类号： H01L21/02203 , B29C67/202 , C08J9/0014 , C08J9/26 , C08J2201/046 , C08J2365/00 , H01L21/02118 , H01L21/312 , H01L21/31695
摘要： A low-k organic dielectric material having stable nano-sized porous is provided as well as a method of fabricating the same. The porous low-k organic dielectric material is made from a composition of matter having a vitrification temperature (Tv-comp) which includes a b-staged thermosetting resin having a vitrification temperate (Tv-resin), a pore generating material, and a reactive additive. The reactive additive lowers Tv-comp below Tv-resin.
摘要翻译： 提供了具有稳定的纳米尺寸多孔的低k有机介电材料及其制造方法。 多孔低k有机介电材料由具有玻璃化温度（Tv-comp）的物质组合物制成，其包括具有玻璃化温度（Tv-树脂），孔产生材料和反应性的B阶热固性树脂 添加剂。 反应性添加剂降低Tv-resin以下的Tv-comp。
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公开(公告)号：US07368483B2
公开(公告)日：2008-05-06
申请号：US10827694
申请日：2004-04-19
申请人： Eric Connor , James P. Godschalx , Craig J. Hawker , James L. Hedrick , Victor Yee-Way Lee , Teddie P. Magbitang , Robert D. Miller , Q. Jason Niu , Willi Volksen
发明人： Eric Connor , James P. Godschalx , Craig J. Hawker , James L. Hedrick , Victor Yee-Way Lee , Teddie P. Magbitang , Robert D. Miller , Q. Jason Niu , Willi Volksen
CPC分类号： H01L21/02203 , B29C67/202 , C08J9/0014 , C08J9/26 , C08J2201/046 , C08J2365/00 , H01L21/02118 , H01L21/312 , H01L21/31695
摘要： A low-k organic dielectric material having stable nano-sized porous is provided as well as a method of fabricating the same. The porous low-k organic dielectric material is made from a composition of matter having a vitrification temperature (Tv-comp) which includes a b-staged thermosetting resin having a vitrification temperate (Tv-resin), a pore generating material, and a reactive additive. The reactive additive lowers Tv-comp below Tv-resin.
摘要翻译： 提供了具有稳定的纳米尺寸多孔的低k有机介电材料及其制造方法。 多孔低k有机介电材料由具有玻璃化温度（Tv-comp）的物质组合物制成，其包括具有玻璃化温度（Tv-树脂），孔产生材料和反应性的B阶热固性树脂 添加剂。 反应性添加剂降低Tv-resin以下的Tv-comp。
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6.发明授权Composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom 有权含有可交联基质前体和孔的组合物和由其制备的多孔基质公开(公告)号：US06887910B2
公开(公告)日：2005-05-03
申请号：US10283552
申请日：2002-10-29
申请人： Kenneth J. Bruza , James P. Godschalx , Edward O. Shaffer, II , Dennis W. Smith, Jr. , Paul H. Townsend, III , Kevin J. Bouck , Qing Shan J. Niu
发明人： Kenneth J. Bruza , James P. Godschalx , Edward O. Shaffer, II , Dennis W. Smith, Jr. , Paul H. Townsend, III , Kevin J. Bouck , Qing Shan J. Niu
IPC分类号： G02F1/1333 , C08F32/04 , C08F36/22 , C08F38/00 , C08J9/26 , C08L25/06 , C08L65/00 , H01L21/312 , C08J9/02
CPC分类号： H01L21/02126 , C08J9/26 , C08J2365/00 , C08L25/06 , C08L65/00 , H01L21/02118 , H01L21/02203 , H01L21/02282 , H01L21/312 , C08L2666/04 , C08L25/00 , C08L2666/06
摘要： A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tg of greater than 300° C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.
摘要翻译： 可以处理合适的可交联的基质前体和孔，以形成具有大于300℃的T N的多孔交联基质。多孔基质材料的介电常数比 相应的无孔基体材料，使得多孔基质材料对于包括集成电路，多芯片模块和平板显示装置的各种电子应用特别有吸引力。
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公开(公告)号：US06359091B1
公开(公告)日：2002-03-19
申请号：US09447012
申请日：1999-11-22
申请人： James P. Godschalx , Kenneth J. Bruza , Qing Shan J. Niu , Clark H. Cummins , Paul H. Townsend, III
发明人： James P. Godschalx , Kenneth J. Bruza , Qing Shan J. Niu , Clark H. Cummins , Paul H. Townsend, III
IPC分类号： C08F3800
CPC分类号： H01L23/5329 , C08G61/00 , C08G61/10 , C08G2261/46 , C08G2261/80 , C08L65/00 , C08L65/02 , H01L2924/0002 , C08L2666/04 , H01L2924/00
摘要： This invention is a polyarylene composition in which resin does not undergo a significant drop in modulus at temperatures above 300° C. during cure. This feature enables one to form porous films by avoiding pore collapse and/or using a wider variety of poragen materials.
摘要翻译： 本发明是聚酰亚胺组合物，其中树脂在固化期间在高于300℃的温度下不会发生显着的模量降低。 该特征使得能够通过避免孔塌陷和/或使用更多种类的成孔材料来形成多孔膜。
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公开(公告)号：US5965679A
公开(公告)日：1999-10-12
申请号：US834677
申请日：1997-04-01
申请人： James P. Godschalx , Duane R. Romer , Ying Hung So , Zenon Lysenko , Michael E. Mills , Gary R. Buske , Paul H. Townsend, III , Dennis W. Smith, Jr. , Steven J. Martin , Robert A. DeVries
发明人： James P. Godschalx , Duane R. Romer , Ying Hung So , Zenon Lysenko , Michael E. Mills , Gary R. Buske , Paul H. Townsend, III , Dennis W. Smith, Jr. , Steven J. Martin , Robert A. DeVries
CPC分类号： C08G61/10 , C08G2261/312
摘要： An oligomer, uncured polymer or cured polymer comprising the reaction product of one or more polyfunctional compounds containing two or more cyclopentadienone groups and at least one polyfunctional compound containing two or more aromatic acetylene groups wherein at least some of the polyfunctional compounds contain three or more reactive groups. Such oligomers and uncured polymers may be cured to form cured polymers which are useful as dielectrics in the microelectronics industry, especially for dielectrics in integrated circuits.
摘要翻译： 包含含有两个或多个环戊二烯酮基团的一种或多种多官能化合物与至少一种含有两个或多个芳族乙炔基团的多官能化合物的反应产物的低聚物，未固化聚合物或固化聚合物，其中至少一些多官能化合物含有三个或更多个反应性 团体 这种低聚物和未固化的聚合物可以固化以形成固化聚合物，其可用作微电子工业中的电介质，特别是用于集成电路中的电介质。
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9.发明授权Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers 失效具有良好粘附性和韧性的低介电常数聚合物和用这种聚合物制成的制品公开(公告)号：US06790792B2
公开(公告)日：2004-09-14
申请号：US10135099
申请日：2002-04-29
IPC分类号： H01L2102
CPC分类号： C08G61/10 , C08G2261/312 , H01L23/49894 , H01L23/5329 , H01L2924/0002 , H05K1/0326 , H01L2924/00
摘要： A cured polyphenylene polymer having a glass transition temperature no greater than 465° C. An integrated circuit article having a fracture toughness as determined by the modified edge liftoff test of at least 0.3 MPa-m1/2.
摘要翻译： 玻璃化转变温度不高于465℃的固化聚苯聚合物。通过改性边缘剥离试验测定的具有至少0.3MPa-m 1/2的断裂韧性的集成电路制品。
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公开(公告)号：US06653358B2
公开(公告)日：2003-11-25
申请号：US10283551
申请日：2002-10-29
申请人： Kenneth J. Bruza , James P. Godschalx , Edward O. Shaffer, II , Dennis W. Smith, Jr. , Paul H. Townsend, III , Kevin J. Bouck , Qing Shan J. Niu
发明人： Kenneth J. Bruza , James P. Godschalx , Edward O. Shaffer, II , Dennis W. Smith, Jr. , Paul H. Townsend, III , Kevin J. Bouck , Qing Shan J. Niu
IPC分类号： C08J902
CPC分类号： H01L21/02126 , C08J9/26 , C08J2365/00 , C08L25/06 , C08L65/00 , H01L21/02118 , H01L21/02203 , H01L21/02282 , H01L21/312 , C08L2666/04 , C08L25/00 , C08L2666/06
摘要： A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tg of greater than 300° C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.
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