公开(公告)号：US20180269140A1

公开(公告)日：2018-09-20

申请号：US15544552

申请日：2015-12-25

申请人： Mitsubishi Electric Corporation

发明人： Kazuhiro TADA ,  Kei YAMAMOTO ,  Mariko TAKAHARA

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L23/49568 ,  H01L21/565 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/48 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/29 ,  H01L24/32 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3716 ,  H01L2224/37639 ,  H01L2224/37655 ,  H01L2224/40137 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/85439 ,  H01L2224/85455 ,  H01L2224/92157 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/10253 ,  H01L2924/10254 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01032 ,  H01L2924/014 ,  H01L2924/013 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/2076 ,  H01L2924/00

摘要： A lead frame extends from inside a sealing resin to outside the sealing resin, and is placed to make contact with a main surface of an insulating sheet opposite to a heat dissipation plate. A semiconductor element is jointed to at least a portion of a main surface of the lead frame opposite to the insulating sheet within the sealing resin. The surface of the insulating sheet in contact with the lead frame is inclined and lowered to move away from the lead frame in an end region including at least a portion of an outermost end in plan view of the insulating sheet. The sealing resin enters a region between the lead frame and the insulating sheet in the end region. The lead frame is flat at least within the sealing resin.

公开(公告)号：US20160115343A1

公开(公告)日：2016-04-28

申请号：US14896235

申请日：2014-01-10

申请人： MITSUBISHI ELECTRIC CORPORATION

发明人： Mariko TAKAHARA ,  Kenji MIMURA ,  Yurie NAKAMURA ,  Motoki MASAKI

IPC分类号： C09D163/00 ,  B29C41/02 ,  H01L21/48 ,  B29C41/00 ,  C08K3/38 ,  H01L23/373

CPC分类号： C09D163/00 ,  B29C41/003 ,  B29C41/02 ,  B29K2101/10 ,  B29K2105/16 ,  B29K2509/04 ,  B29K2995/0013 ,  B29L2031/34 ,  C01B21/064 ,  C01B21/0648 ,  C08K3/38 ,  C08K2003/385 ,  H01L21/4871 ,  H01L23/3737 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/29 ,  H01L2224/29499 ,  H01L2224/32245

摘要： A thermosetting resin composition containing a thermosetting resin and an inorganic filler, in which the inorganic filler contains secondary sintered particles (A) formed of primary particles of boron nitride, which have an aspect ratio of 10 to 20, and secondary sintered particles (B) formed of the primary particles of boron nitride, which have an aspect ratio of 2 to 9. The thermosetting resin composition can produce a thermal conductive sheet that has excellent filling property of the inorganic filler, and excellent thermal conductivity, adhesiveness and electrical insulating properties.

摘要翻译： 一种含有热固性树脂和无机填料的热固性树脂组合物，其中无机填料含有由纵横比为10至20的一次氮化硼颗粒形成的二次烧结颗粒（A）和二次烧结颗粒（B） 由长径比为2〜9的氮化硼的一次粒子形成。热固性树脂组合物可以制造出具有优异的无机填料填充性，导热性，粘合性，电绝缘性优异的导热片。