公开(公告)号：US06357106B1

公开(公告)日：2002-03-19

申请号：US09257268

申请日：1999-02-25

申请人： Mitsumasa Oku ,  Takashi Akiguchi ,  Shinji Murakami ,  Yutaka Harada ,  Norihito Tsukahara ,  Mitsunori Yokomakura ,  Kenichi Sato

发明人： Mitsumasa Oku ,  Takashi Akiguchi ,  Shinji Murakami ,  Yutaka Harada ,  Norihito Tsukahara ,  Mitsunori Yokomakura ,  Kenichi Sato

IPC分类号： H01F4110

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H01F5/003 ,  H01F27/40 ,  H01F41/041 ,  H01L21/4867 ,  H01L24/32 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/095 ,  H05K3/222 ,  H05K3/321 ,  H05K3/4685 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2203/1453 ,  Y10T29/4902 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2224/05599

摘要： A method for mounting parts, and an IC card and its manufacturing method. The method reduces the number of steps, increases productivity, lowers costs, and miniaturizes the chip. A first electrode of the IC chip for processing signals received from a coil is connected to an internal end of a coil pattern formed on a first substrate, and an external end of the coil pattern and a second electrode of the IC chip are connected via a jumper wire.

摘要翻译： 一种安装部件的方法，以及IC卡及其制造方法。 该方法减少了步骤数量，提高了生产率，降低了成本，并且使芯片小型化。 用于处理从线圈接收的信号的IC芯片的第一电极连接到形成在第一基板上的线圈图案的内端，线圈图案的外端和IC芯片的第二电极经由 跳线

公开(公告)号：US20050006749A1

公开(公告)日：2005-01-13

申请号：US10916445

申请日：2004-08-12

申请人： Nozomi Shimoishizaka ,  Ryuichi Sahara ,  Yoshifumi Nakamura ,  Takahiro Kumakawa ,  Shinji Murakami ,  Yutaka Harada

发明人： Nozomi Shimoishizaka ,  Ryuichi Sahara ,  Yoshifumi Nakamura ,  Takahiro Kumakawa ,  Shinji Murakami ,  Yutaka Harada

IPC分类号： H01L23/12 ,  H01L23/31 ,  H01L23/485 ,  H01L21/4763 ,  H01L23/02 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L23/3114 ,  H01L23/3171 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05571 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05541 ,  H01L2224/05005

摘要： A low elasticity layer (20) having an opening in an electrode arranging area where element electrodes are disposed is provided on a main surface of a semiconductor substrate (10). On the low elasticity layer (20), lands (32) serving as external electrodes are disposed, and pads (30) on the element electrodes, the lands (32) and metal wires (31) for connecting them are integrally formed as a metal wiring pattern (33). A solder resist film (50) having an opening for exposing a part of each land (32) is formed, and a metal ball (40) is provided on the land (32) in the opening. The low elasticity layer (20) absorbs thermal stress and the like caused in heating or cooling the semiconductor device, so as to prevent disconnection of the metal wires (31).

摘要翻译： 在半导体衬底（10）的主表面上设置有在电极配置区域中设置有元件电极的开口的低弹性层（20）。 在低弹性层（20）上设置用作外部电极的焊盘（32），并且元件电极上的焊盘（30），用于连接的焊盘（32）和金属丝（31）一体地形成为金属 接线图案（33）。 形成具有用于暴露每个焊盘（32）的一部分的开口的阻焊膜（50），并且金属球（40）设置在开口中的焊盘（32）上。 低弹性层（20）吸收在加热或冷却半导体器件时引起的热应力等，以防止金属线（31）的断开。

公开(公告)号：US06812573B2

公开(公告)日：2004-11-02

申请号：US09886971

申请日：2001-06-25

申请人： Nozomi Shimoishizaka ,  Ryuichi Sahara ,  Yoshifumi Nakamura ,  Takahiro Kumakawa ,  Shinji Murakami ,  Yutaka Harada

发明人： Nozomi Shimoishizaka ,  Ryuichi Sahara ,  Yoshifumi Nakamura ,  Takahiro Kumakawa ,  Shinji Murakami ,  Yutaka Harada

IPC分类号： H01L2348

CPC分类号： H01L23/3114 ,  H01L23/3171 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05571 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05541 ,  H01L2224/05005

摘要： A low elasticity layer (20) having an opening in an electrode arranging area where element electrodes are disposed is provided on a main surface of a semiconductor substrate (10). On the low elasticity layer (20), lands (32) serving as external electrodes are disposed, and pads (30) on the element electrodes, the lands (32) and metal wires (31) for connecting them are integrally formed as a metal wiring pattern (33). A solder resist film (50) having an opening for exposing a part of each land (32) is formed, and a metal ball (40) is provided on the land (32) in the opening. The low elasticity layer (20) absorbs thermal stress and the like caused in heating or cooling the semiconductor device, so as to prevent disconnection of the metal wires (31).

摘要翻译： 在半导体衬底（10）的主表面上设置有在电极配置区域中设置有元件电极的开口的低弹性层（20）。 在低弹性层（20）上设置用作外部电极的焊盘（32），并且元件电极上的焊盘（30），用于连接的焊盘（32）和金属丝（31）一体地形成为金属 布线图案（33）。 形成具有用于暴露每个焊盘（32）的一部分的开口的阻焊膜（50），并且金属球（40）设置在开口中的焊盘（32）上。 低弹性层（20）吸收在加热或冷却半导体器件时引起的热应力等，以防止金属线（31）的断开。

公开(公告)号：US06313532B1

公开(公告)日：2001-11-06

申请号：US09381381

申请日：1999-09-20

申请人： Nozomi Shimoishizaka ,  Ryuichi Sahara ,  Yoshifumi Nakamura ,  Takahiro Kumakawa ,  Shinji Murakami ,  Yutaka Harada

发明人： Nozomi Shimoishizaka ,  Ryuichi Sahara ,  Yoshifumi Nakamura ,  Takahiro Kumakawa ,  Shinji Murakami ,  Yutaka Harada

IPC分类号： H01L2348

CPC分类号： H01L23/3114 ,  H01L23/3171 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05571 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05541 ,  H01L2224/05005

摘要： A low elasticity layer (20) having an opening in an electrode arranging area where element electrodes are disposed is provided on a main surface of a semiconductor substrate (10). On the low elasticity layer (20), lands (32) serving as external electrodes are disposed, and pads (30) on the element electrodes, the lands (32) and metal wires (31) for connecting them are integrally formed as a metal wiring pattern (33). A solder resist film (50) having an opening for exposing a part of each land (32) is formed, and a metal ball (40) is provided on the land (32) in the opening. The low elasticity layer (20) absorbs thermal stress and the like caused in heating or cooling the semiconductor device, so as to prevent disconnection of the metal wires (31).

摘要翻译： 在半导体衬底（10）的主表面上设置有在电极配置区域中设置有元件电极的开口的低弹性层（20）。 在低弹性层（20）上设置用作外部电极的焊盘（32），并且元件电极上的焊盘（30），用于连接的焊盘（32）和金属丝（31）一体地形成为金属 布线图案（33）。 形成具有用于暴露每个焊盘（32）的一部分的开口的阻焊膜（50），并且金属球（40）设置在开口中的焊盘（32）上。 低弹性层（20）吸收在加热或冷却半导体器件时引起的热应力等，以防止金属线（31）的断开。

公开(公告)号：US06772953B2

公开(公告)日：2004-08-10

申请号：US09775185

申请日：2001-02-01

申请人： Keiichi Iiyama ,  Takashi Noda ,  Shinji Murakami ,  Yutaka Harada ,  Takuya Oka ,  Masaru Tanichi

发明人： Keiichi Iiyama ,  Takashi Noda ,  Shinji Murakami ,  Yutaka Harada ,  Takuya Oka ,  Masaru Tanichi

IPC分类号： G06K1906

CPC分类号： G06K19/07735 ,  G06K19/07749 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2924/00011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/01033

摘要： An electronic circuit module formed of an antenna coil and an integrated circuit provided on a circuit board is provided inside a hollow resin case formed of a first part and a second part. A first slit leading into the hollow portion is provided in one side face of the resin case formed of the first and second parts joined to each other. Since the electronic circuit module is not exposed to high temperatures and high pressure during the manufacturing process, defects such as the breakage of the integrated circuit or the disconnection of the antenna coil can be avoided. Since the slit leading into the hollow portion is provided, the hollow portion does not swell by the temperature increase. In addition, pinholes do not tend to be formed during the joining of the first and second parts. Thus, a contactless data carrier with an excellent electrostatic withstand voltage characteristic can be provided.

摘要翻译： 在由第一部分和第二部分形成的中空树脂壳体内部设置由天线线圈和设置在电路板上的集成电路形成的电子电路模块。 导入中空部的第一狭缝设置在由彼此连接的第一部分和第二部分形成的树脂壳体的一个侧面中。 由于电子电路模块在制造过程中不暴露于高温高压下，因此可以避免诸如集成电路的断裂或天线线圈的断开等缺陷。 由于设置有通向中空部的狭缝，所以中空部不会因温度升高而膨胀。 此外，在第一和第二部分的接合期间，不会形成针孔。 因此，可以提供具有优异的静电耐受电压特性的非接触式数据载体。

公开(公告)号：US11274172B2

公开(公告)日：2022-03-15

申请号：US13005916

申请日：2011-01-13

申请人： Shinji Murakami ,  Ken Okanishi ,  Masahiko Oka

发明人： Shinji Murakami ,  Ken Okanishi ,  Masahiko Oka

IPC分类号： C08F214/18 ,  C08F214/22 ,  C08L23/02 ,  C08K3/34

摘要： The present invention provides a processing additive which can bring about improvements in moldability at Mooney viscosity levels at which the dispersibility in a melt-processable resin is high and which further can work at reduced addition levels. The present invention is a processing additive comprising a fluoropolymer having an acid value of not lower than 0.5 KOH mg/g.

公开(公告)号：US08963501B2

公开(公告)日：2015-02-24

申请号：US13131990

申请日：2009-12-02

申请人： Tetsuro Shigemizu ,  Takehiko Nishida ,  Katsuo Hashizaki ,  Masaaki Minami ,  Keiichiro Tanaka ,  Kazuyuki Adachi ,  Shinji Murakami ,  Kouji Kurayama ,  Hirofumi Fujita

发明人： Tetsuro Shigemizu ,  Takehiko Nishida ,  Katsuo Hashizaki ,  Masaaki Minami ,  Keiichiro Tanaka ,  Kazuyuki Adachi ,  Shinji Murakami ,  Kouji Kurayama ,  Hirofumi Fujita

IPC分类号： H02J7/00 ,  H01M10/44 ,  H02J7/04

CPC分类号： H01M10/441 ,  H02J7/0016 ,  H02J7/045

摘要： A voltage equalization device of a power storage device provided with battery packs in which a plurality of secondary cells are connected, power converters provided in association with the battery packs, and controllers that control the power converters, and in which the battery packs are connected in parallel via the individual power converters includes a decision portion and a voltage-adjusting portion. The decision portion obtains battery-pack information regarding the states of charge/discharge of the individual battery packs and decides, for each battery pack, whether or not to perform voltage adjustment on the basis of the battery-pack information. When the decision portion decides that the voltage adjustment is to be performed, the voltage-adjusting portion generates offset instructions for adjusting the states of charge/discharge and outputs the offset instructions to the controllers of the power converters associated with the battery packs.

摘要翻译： 一种蓄电装置的电压均衡装置，其具备连接有多个二次电池的电池组，与电池组相关联地设置的电力转换器，以及控制电力转换器的控制器，其中电池组连接 通过各个功率转换器并联包括判定部分和电压调节部分。 决定部分获得关于各个电池组的充电/放电状态的电池组信息，并且针对每个电池组确定是否基于电池组信息执行电压调节。 当决定部分决定要执行电压调节时，电压调节部分产生用于调整充电/放电状态的偏置指令，并将偏移指令输出到与电池组相关的功率转换器的控制器。

公开(公告)号：US08598843B2

公开(公告)日：2013-12-03

申请号：US13055574

申请日：2008-10-30

申请人： Takehiko Nishida ,  Tetsuro Shigemizu ,  Katsuo Hashizaki ,  Kazuyuki Adachi ,  Shinji Murakami ,  Yoshihiro Wada ,  Kouji Kurayama ,  Hirofumi Fujita

发明人： Takehiko Nishida ,  Tetsuro Shigemizu ,  Katsuo Hashizaki ,  Kazuyuki Adachi ,  Shinji Murakami ,  Yoshihiro Wada ,  Kouji Kurayama ,  Hirofumi Fujita

IPC分类号： H01M10/46

摘要： An object is to reliably conduct cell balancing operation while suppressing deterioration of batteries and maintaining operating efficiency. When the cell balance control by the cell balancing circuit 3 is started, the system control device 30 sets an on/off device corresponding to the arm where the cell balance control is conducted to the open state; and when the cell balance control is completed, and the difference between the terminal voltage of a battery pack of the arm where the cell balance control has been conducted and the terminal voltages of the battery packs of the other arms falls within a preset allowable range, sets the on/off device, which has been in the open state, to the closed state.

公开(公告)号：US20110221394A1

公开(公告)日：2011-09-15

申请号：US13059611

申请日：2009-06-30

申请人： Tetsuro Shigemizu ,  Takehiko Nishida ,  Katsuo Hashizaki ,  Hidehiko Tajima ,  Katsuaki Kobayashi ,  Kazuyuki Adachi ,  Shinji Murakami ,  Yoshihiro Wada ,  Hiroyuki Shibata ,  Kouji Kurayama

发明人： Tetsuro Shigemizu ,  Takehiko Nishida ,  Katsuo Hashizaki ,  Hidehiko Tajima ,  Katsuaki Kobayashi ,  Kazuyuki Adachi ,  Shinji Murakami ,  Yoshihiro Wada ,  Hiroyuki Shibata ,  Kouji Kurayama

IPC分类号： H02J7/04

CPC分类号： H01M10/441 ,  H01M10/482 ,  H02J7/0016 ,  H02J7/0018

摘要： A secondary cell control system includes a plurality of cells; a charging circuit section and a discharging circuit section. The charging circuit section charges cells selected from among said plurality of cells, and the discharging circuit section discharges cells selected from among said plurality of cells.

摘要翻译： 二次电池控制系统包括多个电池; 充电电路部分和放电电路部分。 所述充电电路部对从所述多个单元中选择的单元进行充电，并且所述放电电路部对从所述多个单元中选择的单元进行放电。

公开(公告)号：US20100207580A1

公开(公告)日：2010-08-19

申请号：US12677217

申请日：2008-03-31

申请人： Takehiko Nishida ,  Katsuaki Kobayashi ,  Tomoh Akiyama ,  Katsuo Hashizaki ,  Hidehiko Tajima ,  Kazuyuki Adachi ,  Shinji Murakami ,  Yoshihiro Wada ,  Hiroyuki Shibata ,  Kouji Kurayama

发明人： Takehiko Nishida ,  Katsuaki Kobayashi ,  Tomoh Akiyama ,  Katsuo Hashizaki ,  Hidehiko Tajima ,  Kazuyuki Adachi ,  Shinji Murakami ,  Yoshihiro Wada ,  Hiroyuki Shibata ,  Kouji Kurayama

IPC分类号： H02J7/00

CPC分类号： H01M10/46 ,  H01M4/505 ,  H01M10/052 ,  H01M2004/028 ,  H02J7/0057 ,  H02J7/0077 ,  H02J7/34 ,  H02J2007/0067

摘要： It is an object to provide a battery system whose life can be extended. A cell pack having at least one lithium secondary battery that uses a manganese-based cathode material and a control unit that controls charging and discharging of the cell pack are provided, and the control unit controls charging and discharging within a low-degradation voltage range that is set on the basis of a target cell degradation rate.

摘要翻译： 本发明的目的是提供一种能够延长寿命的电池系统。 提供具有使用锰系阴极材料的至少一个锂二次电池和控制电池组的充放电的控制单元的电池组，并且控制单元在低劣化电压范围内控制充放电 是基于目标细胞降解率设定的。