公开(公告)号：US20230072275A1

公开(公告)日：2023-03-09

申请号：US17799255

申请日：2021-02-10

Applicant: NICHIA CORPORATION

Inventor： Takafumi SUGIYAMA ,  Kaname SAITO ,  Takashi NAMIE ,  Takuya SUZUKI

IPC: H01S5/02315 ,  H01S5/024 ,  H01S5/02255 ,  H01S5/0239

Abstract: A light emission module includes a first light emission unit that includes a first light emission device and emits first light. The first light emission device includes a plurality of first light emission portions, each including a light emission surface, where light from a plurality of first light emission elements is emitted, a heat dissipation surface provided opposite to the light emission surface, and a connection portion being positioned between the light emission surface and the heat dissipation surface and including a wiring mounting surface where the light emission elements are electrically connected. The light emission module further includes a first optical member that reflects the first light, a housing including a base member where the first light emission unit and the first optical member are disposed and a lid member surrounding the light emission device surrounding the first light emission unit and the first optical member that are disposed on the base member, and a heat sink being connected to the heat dissipation surface and including a mounting surface where the first light emission device is mounted. The wiring mounting surface extends upward upper than a first upper surface of the housing, and a portion of the wiring mounting surface is exposed to the outside of the housing.

公开(公告)号：US20240380172A1

公开(公告)日：2024-11-14

申请号：US18652513

申请日：2024-05-01

Applicant: NICHIA CORPORATION ,  FURUKAWA ELECTRIC CO., LTD.

Inventor： Takashi NAMIE ,  Kazuma KOZURU

IPC: H01S5/02255 ,  H01S5/02251 ,  H01S5/02253 ,  H01S5/40

Abstract: A light-emitting device includes a substrate having a mounting surface, a semiconductor laser element supported by the mounting surface, a first mirror member supported by the mounting surface and having a first reflective surface, and a second mirror member supported by a support member and spaced apart from the first mirror member, and having a second reflective surface at least a part of which is positioned above at least a part of the first reflective surface. The semiconductor laser element is configured to emit a laser beam toward the first reflective surface in a first direction, the first reflective surface reflects the laser beam to change a traveling direction of the laser beam to a second direction, and the second reflective surface reflects the laser beam reflected by the first reflective surface to change the traveling direction of the laser beam to a third direction.

公开(公告)号：US20180182928A1

公开(公告)日：2018-06-28

申请号：US15854525

申请日：2017-12-26

Applicant: NICHIA CORPORATION

Inventor： Takashi NAMIE

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/58 ,  H01S5/40 ,  H01L33/62 ,  H01S5/022 ,  H01S5/042

CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01S5/005 ,  H01S5/02212 ,  H01S5/02216 ,  H01S5/02276 ,  H01S5/02288 ,  H01S5/02292 ,  H01S5/02296 ,  H01S5/0425 ,  H01S5/4018 ,  H01S5/4025 ,  H01L2924/00014

Abstract: A light-emitting device includes: a package made of a metal material and defining a recess, the package comprising a side wall defining a side of the recess; a plurality of light-emitting elements disposed in the recess; and a cover member disposed so as to close an opening of the recess, the cover member including: a light-transmitting member having a primary surface, a ceramic member having a loop-shape and having a first surface and a second surface opposite the first surface, the first surface bonded to the primary surface of the light-transmitting member via a bonding material, and a metal member having a loop-shape and including: a first portion bonded to the second surface of the ceramic member, and a second portion located outward of the first portion in a plan view and joined to an upper surface of the side wall of the package.

公开(公告)号：US20230243494A1

公开(公告)日：2023-08-03

申请号：US18161148

申请日：2023-01-30

Applicant: NICHIA CORPORATION

Inventor： Takashi NAMIE

IPC: F21V23/04 ,  F21V9/30 ,  F21V5/04 ,  F21V3/06 ,  F21V9/20

CPC classification number: F21V23/0457 ,  F21V9/30 ,  F21V5/04 ,  F21V3/0625 ,  F21V9/20 ,  F21Y2115/30

Abstract: A light-emitting module includes: a plurality of light-emitting elements located on a mounting surface; one or more optical members configured to control light emitted from each of the plurality of light-emitting elements, and allow output light and monitor light for controlling an output of the output light to exit; and a detection unit configured to detect the monitor light. The one or more optical members include a first optical member on which the light emitted from the plurality of light-emitting elements is incident. The plurality of light-emitting elements comprises a plurality of first light-emitting elements, which are, among the plurality of light-emitting elements, all light-emitting elements that are configured to emit light incident on the first optical member. The detection unit includes: a first condensing lens configured to condense the monitor light, and a light-receiving element configured to receive the monitor light exiting from the first condensing lens.

公开(公告)号：US20180058642A1

公开(公告)日：2018-03-01

申请号：US15678375

申请日：2017-08-16

Applicant: NICHIA CORPORATION

Inventor： Hironobu SHIBATA ,  Soichiro MIURA ,  Takashi NAMIE

IPC: F21K9/64 ,  F21V19/00 ,  F21V7/22

CPC classification number: F21K9/64 ,  F21V7/041 ,  F21V7/22 ,  F21V9/00 ,  F21V13/08 ,  F21V19/0025 ,  F21Y2115/30

Abstract: A light emitting device includes a semiconductor laser element configured to emit a first light, a wavelength converting member configured to emit a second light upon being irradiated by the first light, and a support member defining a through-hole allowing an optical path of the first light to pass through. The through-hole is defined by, in order from a light incident side to a light emitting side with respect to the first light, a lower portion with opening width decreasing from the light incident side to the light emitting side, and an upper portion where the wavelength converting member is fixed. The semiconductor laser element is disposed at a location allowing the first light to enter the lower portion of the through-hole while also allowing a part of the first light to be reflected at a wall defining the lower portion of the through-hole.

公开(公告)号：US20240142084A1

公开(公告)日：2024-05-02

申请号：US18547861

申请日：2021-10-20

Applicant: NICHIA CORPORATION

Inventor： Takashi NAMIE ,  Tatsuya KANAZAWA ,  Masanobu TANAKA

IPC: F21V7/09 ,  F21V5/04

CPC classification number: F21V7/09 ,  F21V5/04 ,  F21Y2115/30

Abstract: A light-emitting module includes: first and second light-emitting devices each including semiconductor laser elements that emit laser beams with an interval in a slow axis direction of the laser beams; a first optical unit that includes one or more first reflective members provided with reflective surfaces on which laser beams are incident and that makes the interval of the laser beams smaller and emits the laser beams; a second optical unit that includes second reflective members provided with reflective surfaces on which laser beams are incident and that reflects, two times or more, laser beams emitted with an interval in a fast axis direction and emits the laser beams with a smaller interval and with a smaller width in the fast axis direction of the laser beams; and a condenser lens that gathers laser beams having traveled through the first optical unit and the second optical unit.

公开(公告)号：US20170063032A1

公开(公告)日：2017-03-02

申请号：US15248318

申请日：2016-08-26

Applicant: NICHIA CORPORATION

Inventor： Naoto MORIZUMI ,  Takashi NAMIE ,  Takashi NAKAGAWA ,  Daisuke KOMODA ,  Hiroaki SHOZUI

IPC: H01S5/022 ,  H01S5/30

CPC classification number: H01S5/02208 ,  F21S41/14 ,  F21S41/16 ,  F21S41/192 ,  F21S43/13 ,  F21S43/195 ,  H01S5/005 ,  H01S5/02212 ,  H01S5/02272 ,  H01S5/02288 ,  H01S5/02296 ,  H01S5/02469 ,  H01S5/3013

Abstract: A semiconductor laser device includes a base, a semiconductor laser element, a lid, a support member, a wavelength converting member, a holding member, and a buffer material. The lid has a recess formed in an upper portion of the lid, and a through-hole formed in the bottom of the recess. The support member is disposed in the recess and has a through-hole. A diameter of the through-hole of the support member is smaller than that of the through-hole of the lid. A coefficient of thermal expansion of the support member is different from that of the lid. The wavelength converting member is supported in the through-hole of the support member. The holding member is fixed to the lid and holds the support member. The buffer material is disposed in at least a part of a space to between the lateral surfaces of the recess and the support member.

Abstract translation: 半导体激光装置包括基底，半导体激光元件，盖，支撑构件，波长转换构件，保持构件和缓冲材料。 盖具有形成在盖的上部中的凹部和形成在凹部的底部中的通孔。 支撑构件设置在凹部中并具有通孔。 支撑构件的通孔的直径小于盖的通孔的直径。 支撑构件的热膨胀系数与盖的热膨胀系数不同。 波长转换部件被支撑在支撑部件的通孔中。 保持构件固定在盖上并保持支撑构件。 缓冲材料设置在空间的至少一部分到凹部的侧表面和支撑构件之间。