Nitride semiconductor device, nitride semiconductor wafer, and method for manufacturing nitride semiconductor layer
    5.
    发明授权
    Nitride semiconductor device, nitride semiconductor wafer, and method for manufacturing nitride semiconductor layer 有权
    氮化物半导体器件,氮化物半导体晶片,以及氮化物半导体层的制造方法

    公开(公告)号:US08692287B2

    公开(公告)日:2014-04-08

    申请号:US13222200

    申请日:2011-08-31

    IPC分类号: H01L33/00

    摘要: According to one embodiment, a nitride semiconductor device includes: a stacked foundation layer, and a functional layer. The stacked foundation layer is formed on an AlN buffer layer formed on a silicon substrate. The stacked foundation layer includes AlN foundation layers and GaN foundation layers being alternately stacked. The functional layer includes a low-concentration part, and a high-concentration part provided on the low-concentration part. A substrate-side GaN foundation layer closest to the silicon substrate among the plurality of GaN foundation layers includes first and second portions, and a third portion provided between the first and second portions. The third portion has a Si concentration not less than 5×1018 cm−3 and has a thickness smaller than a sum of those of the first and second portions.

    摘要翻译: 根据一个实施例,氮化物半导体器件包括:堆叠的基底层和功能层。 堆叠的基底层形成在形成在硅衬底上的AlN缓冲层上。 堆叠的基础层包括AlN基底层和GaN基底层交替堆叠。 功能层包括低浓度部分和设置在低浓度部分上的高浓度部分。 多个GaN基底层中最靠近硅衬底的衬底侧GaN基底层包括第一和第二部分,以及设置在第一和第二部分之间的第三部分。 第三部分的Si浓度不小于5×1018cm-3,其厚度小于第一和第二部分的总和。