NITRIDE SEMICONDUCTOR DEVICE, NITRIDE SEMICONDUCTOR WAFER, AND METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR LAYER
    3.
    发明申请
    NITRIDE SEMICONDUCTOR DEVICE, NITRIDE SEMICONDUCTOR WAFER, AND METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR LAYER 有权
    氮化物半导体器件,氮化物半导体器件和制造氮化物半导体层的方法

    公开(公告)号:US20130062612A1

    公开(公告)日:2013-03-14

    申请号:US13407169

    申请日:2012-02-28

    IPC分类号: H01L29/20 H01L21/20

    摘要: According to one embodiment, a nitride semiconductor device includes a foundation layer, a first stacked intermediate layer, and a functional layer. The foundation layer includes an AlN buffer layer formed on a substrate. The first stacked intermediate layer is provided on the foundation layer. The first stacked intermediate layer includes a first AlN intermediate layer provided on the foundation layer, a first AlGaN intermediate layer provided on the first AlN intermediate layer, and a first GaN intermediate layer provided on the first AlGaN intermediate layer. The functional layer is provided on the first stacked intermediate layer. The first AlGaN intermediate layer includes a first step layer in contact with the first AlN intermediate layer. An Al composition ratio in the first step layer decreases stepwise in a stacking direction from the first AlN intermediate layer toward the first step layer.

    摘要翻译: 根据一个实施例,氮化物半导体器件包括基底层,第一堆叠中间层和功能层。 基底层包括形成在基底上的AlN缓冲层。 第一堆叠中间层设置在基础层上。 第一堆叠中间层包括设置在基底层上的第一AlN中间层,设置在第一AlN中间层上的第一AlGaN中间层和设置在第一AlGaN中间层上的第一GaN中间层。 功能层设置在第一堆叠中间层上。 第一AlGaN中间层包括与第一AlN中间层接触的第一阶梯层。 第一层中的Al组成比在层叠方向上从第一AlN中间层朝向第一阶层逐渐降低。

    Nitride semiconductor device, nitride semiconductor wafer, and method for manufacturing nitride semiconductor layer
    4.
    发明授权
    Nitride semiconductor device, nitride semiconductor wafer, and method for manufacturing nitride semiconductor layer 有权
    氮化物半导体器件,氮化物半导体晶片,以及氮化物半导体层的制造方法

    公开(公告)号:US08785943B2

    公开(公告)日:2014-07-22

    申请号:US13407169

    申请日:2012-02-28

    IPC分类号: H01L29/20

    摘要: According to one embodiment, a nitride semiconductor device includes a foundation layer, a first stacked intermediate layer, and a functional layer. The foundation layer includes an AlN buffer layer formed on a substrate. The first stacked intermediate layer is provided on the foundation layer. The first stacked intermediate layer includes a first AlN intermediate layer provided on the foundation layer, a first AlGaN intermediate layer provided on the first AlN intermediate layer, and a first GaN intermediate layer provided on the first AlGaN intermediate layer. The functional layer is provided on the first stacked intermediate layer. The first AlGaN intermediate layer includes a first step layer in contact with the first AlN intermediate layer. An Al composition ratio in the first step layer decreases stepwise in a stacking direction from the first AlN intermediate layer toward the first step layer.

    摘要翻译: 根据一个实施例,氮化物半导体器件包括基底层,第一堆叠中间层和功能层。 基底层包括形成在基底上的AlN缓冲层。 第一堆叠中间层设置在基础层上。 第一堆叠中间层包括设置在基底层上的第一AlN中间层,设置在第一AlN中间层上的第一AlGaN中间层和设置在第一AlGaN中间层上的第一GaN中间层。 功能层设置在第一堆叠中间层上。 第一AlGaN中间层包括与第一AlN中间层接触的第一阶梯层。 第一层中的Al组成比在层叠方向上从第一AlN中间层朝向第一阶层逐渐降低。

    Method for manufacturing a semiconductor light emitting device
    5.
    发明授权
    Method for manufacturing a semiconductor light emitting device 有权
    半导体发光元件的制造方法

    公开(公告)号:US08093083B1

    公开(公告)日:2012-01-10

    申请号:US13029416

    申请日:2011-02-17

    IPC分类号: H01L21/00 H01L33/00

    摘要: In one embodiment, a method is disclosed for manufacturing a semiconductor light emitting device. The device includes a crystal layer including a nitride semiconductor. The crystal layer contains In and Ga atoms. The method can include forming the crystal layer by supplying a source gas including a first molecule including Ga atoms and a second molecule including In atoms onto a base body. The crystal layer has a ratio xs of a number of the In atoms to a total of the In atoms and the Ga atoms being not less than 0.2 and not more than 0.4. A vapor phase supply ratio xv of In is a ratio of a second partial pressure to a total of first and second partial pressures. The first and second partial pressures are pressure of the first and second molecules and degradation species of the first and second molecules on the source gas, respectively. (1−1/xv)/(1−1/xs) is less than 0.1.

    摘要翻译: 在一个实施例中,公开了一种用于制造半导体发光器件的方法。 该器件包括包含氮化物半导体的晶体层。 晶体层含有In和Ga原子。 该方法可以包括通过将包括Ga原子的第一分子和包括In原子的第二分子的源气体供应到基体上来形成晶体层。 晶体层的In原子数与In原子的总和的比xs和Ga原子的比率不小于0.2且不大于0.4。 In的气相供给比xv是第二分压与第一和第二分压的总和的比。 第一和第二分压分别是源气体上的第一和第二分子的压力和第一和第二分子的降解物质。 (1-1 / xv)/(1-1 / xs)小于0.1。