Nitride semiconductor device, nitride semiconductor wafer, and method for manufacturing nitride semiconductor layer
    4.
    发明授权
    Nitride semiconductor device, nitride semiconductor wafer, and method for manufacturing nitride semiconductor layer 有权
    氮化物半导体器件,氮化物半导体晶片,以及氮化物半导体层的制造方法

    公开(公告)号:US08692287B2

    公开(公告)日:2014-04-08

    申请号:US13222200

    申请日:2011-08-31

    IPC分类号: H01L33/00

    摘要: According to one embodiment, a nitride semiconductor device includes: a stacked foundation layer, and a functional layer. The stacked foundation layer is formed on an AlN buffer layer formed on a silicon substrate. The stacked foundation layer includes AlN foundation layers and GaN foundation layers being alternately stacked. The functional layer includes a low-concentration part, and a high-concentration part provided on the low-concentration part. A substrate-side GaN foundation layer closest to the silicon substrate among the plurality of GaN foundation layers includes first and second portions, and a third portion provided between the first and second portions. The third portion has a Si concentration not less than 5×1018 cm−3 and has a thickness smaller than a sum of those of the first and second portions.

    摘要翻译: 根据一个实施例,氮化物半导体器件包括:堆叠的基底层和功能层。 堆叠的基底层形成在形成在硅衬底上的AlN缓冲层上。 堆叠的基础层包括AlN基底层和GaN基底层交替堆叠。 功能层包括低浓度部分和设置在低浓度部分上的高浓度部分。 多个GaN基底层中最靠近硅衬底的衬底侧GaN基底层包括第一和第二部分,以及设置在第一和第二部分之间的第三部分。 第三部分的Si浓度不小于5×1018cm-3,其厚度小于第一和第二部分的总和。

    NITRIDE SEMICONDUCTOR DEVICE, NITRIDE SEMICONDUCTOR WAFER, AND METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR LAYER
    10.
    发明申请
    NITRIDE SEMICONDUCTOR DEVICE, NITRIDE SEMICONDUCTOR WAFER, AND METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR LAYER 有权
    氮化物半导体器件,氮化物半导体器件和制造氮化物半导体层的方法

    公开(公告)号:US20130062612A1

    公开(公告)日:2013-03-14

    申请号:US13407169

    申请日:2012-02-28

    IPC分类号: H01L29/20 H01L21/20

    摘要: According to one embodiment, a nitride semiconductor device includes a foundation layer, a first stacked intermediate layer, and a functional layer. The foundation layer includes an AlN buffer layer formed on a substrate. The first stacked intermediate layer is provided on the foundation layer. The first stacked intermediate layer includes a first AlN intermediate layer provided on the foundation layer, a first AlGaN intermediate layer provided on the first AlN intermediate layer, and a first GaN intermediate layer provided on the first AlGaN intermediate layer. The functional layer is provided on the first stacked intermediate layer. The first AlGaN intermediate layer includes a first step layer in contact with the first AlN intermediate layer. An Al composition ratio in the first step layer decreases stepwise in a stacking direction from the first AlN intermediate layer toward the first step layer.

    摘要翻译: 根据一个实施例,氮化物半导体器件包括基底层,第一堆叠中间层和功能层。 基底层包括形成在基底上的AlN缓冲层。 第一堆叠中间层设置在基础层上。 第一堆叠中间层包括设置在基底层上的第一AlN中间层,设置在第一AlN中间层上的第一AlGaN中间层和设置在第一AlGaN中间层上的第一GaN中间层。 功能层设置在第一堆叠中间层上。 第一AlGaN中间层包括与第一AlN中间层接触的第一阶梯层。 第一层中的Al组成比在层叠方向上从第一AlN中间层朝向第一阶层逐渐降低。