摘要:
An EEPROM in which a select transistor to which any memory cell not selected is turned off to inhibit electron injections into the floating gate of the memory cell not selected. The memory cells of the EEPROM are arranged in rows and columns in a substrate. The memory cells forming each column are connected in series. The two endmost memory cells are connected to two select transistors, respectively. The bit lines are connected to a data latch/sense amplifier, which is connected to a column decoder. The column decoder controls the bit lines. A row decoder controls select gates and control gates. A voltage-boosting circuit generates a high voltage, which is applied to the substrate and the select gates to erase data in the EEPROM, and to the control gates to write data into the EEPROM. A low-voltage controller generates a low voltage, which is applied to the select gates for turning off the select transistors of the column not selected, thereby to prevent data-writing.
摘要:
In a reduced projection type step- and repeat-exposure apparatus of the present invention, the angle of inclination of an exposure area on the wafer is first detected, and then corrected on the basis of the detected value. This measurement corrects the inclination of the exposure area. Hence, high precision patterning can be realized, even if an optical system having a small focus margin is used.
摘要:
After data is written into a desired memory cell of a memory cell array, a booster circuit verifies the threshold voltage of the memory cell in which data is written. An erase timing signal generation circuit connected to a control circuit generates a timing signal for a short period of time when a memory cell having a threshold voltage higher than the power supply voltage. An erasing voltage generation circuit applies a negative erasing voltage to the memory cell in which data is written for a short period of time according to the timing signal supplied from the erase timing signal generation circuit to slightly lower the threshold voltage of the memory cell so as to prevent the excessive writing.
摘要:
A method of manufacturing a nonvolatile semiconductor memory device having a gate oxide layer including a relatively thin silicon dioxide layer. This gate oxide layer including the thin silicon dioxide layer is formed by the steps of forming the gate oxide film on a semiconductor element region in a silicon substrate; removing a portion of the gate oxide film to expose a portion of the silicon substrate; implanting impurity ions in the exposed portion of the substrate to an extent that a peak concentration of the impurity ions exceeds a solid solution limit at a temperature of the following thermal annealing step; activating the implanted impurity by thermal annealing so as to form a high impurity concentration layer and thermally oxidizing a surface of the high impurity concentration layer to form the thin silicon dioxide layer.
摘要:
A method for producing a semiconductor device comprises a step of forming a first gate insulation layer on a portion of a single crystal silicon substrate and forming a floating gate of polycrystalline silicon on the first gate insulation layer, a step of forming an oxide layer on the exposed portion of the substrate and on the floating gate, and a step of forming a control gate on the floating gate through the oxide layer. In the formation of the oxide layer, a nitride pattern layer is formed on the floating gate, the entire structure is oxidized by using the nitride pattern layer as a mask, thus forming a protective layer on the exposed portion of the substrate, the nitride pattern layer is removed, and the entire structure is again oxidized, thus forming a second gate insulation layer on the floating gate.
摘要:
According to one embodiment, a memory system includes a nonvolatile semiconductor storage able to hold data, a temperature measurement section configured to measure the temperature of the semiconductor storage, a temperature varying section configured to change the temperature of the semiconductor storage, and a control circuit including a transmitter configured such that data received from a host is transferred to the semiconductor storage, and a temperature storage configured to store temperature information received from the temperature measurement section.
摘要:
In a memory device, a plurality of memory cells are connected to bit line pairs. A precharge circuit is controlled by a chip enable signal during a stand-by state and by an address transition detector signal during an active state, to charge the bit line pairs up to a given power source voltage.
摘要:
A semiconductor memory device has at least one memory cell which includes first and second tunnel diodes connected in series in a forward-bias direction between first and second power source terminals. The first and second power source terminals are held at constant potentials. A switching MOS transistor is connected at one end to a connection point between the first and second tunnel diodes. The potential at the connection point between the first and second tunnel diodes is determined by the potential at the other end of the switching MOS transistor.
摘要:
According to one embodiment, a memory system includes a nonvolatile semiconductor storage able to hold data, a temperature measurement section configured to measure the temperature of the semiconductor storage, a temperature varying section configured to change the temperature of the semiconductor storage, and a control circuit including a transmitter configured such that data received from a host is transferred to the semiconductor storage, and a temperature storage configured to store temperature information received from the temperature measurement section.
摘要:
A memory cell transistor includes a semiconductor substrate, a N-type source region, a N-type drain region, a control gate and a P.sup.+ -type emitter region, which is formed in the surface region of the drain region. An insulating film overlies the source region, the drain region, the emitter region, and the control gate. A contact hole is formed in the insulating film so that the surface of the emitter region is exposed. An emitter electrode is formed in and around the contact hole. A PNP vertical bipolar transistor is constituted by the semiconductor substrate serving as a collector region, a P.sup.+ -type buried layer serving as a collector contact, and the drain region serving as a base region.