Sputtering apparatus and method of manufacturing electronic device
    1.
    发明授权
    Sputtering apparatus and method of manufacturing electronic device 有权
    溅射装置及其制造方法

    公开(公告)号:US09322092B2

    公开(公告)日:2016-04-26

    申请号:US13606346

    申请日:2012-09-07

    摘要: It is an object of this invention to prevent a deposited film from adhering to an exhaust chamber so as to suppress the generation of particles. A sputtering apparatus (1) includes a shutter accommodation unit (23) which is detachably placed in an exhaust chamber (8) and accommodates a shutter (19) in a retracted state, and shield members (40a, 40b) which at least partially cover the exhaust port of the exhaust chamber (8), and are at least partially formed around an opening portion of the shutter accommodation unit (23).

    摘要翻译: 本发明的目的是防止沉积的膜粘附到排气室,以抑制颗粒的产生。 溅射装置(1)包括一个可拆卸地放置在排气室(8)中并容纳处于缩回状态的挡板(19)的挡板容纳单元(23),以及遮蔽构件(40a,40b) 排气室(8)的排气口,并且至少部分地形成在活门容纳单元(23)的开口部分周围。

    Deposition apparatus and electronic device manufacturing method
    2.
    发明授权
    Deposition apparatus and electronic device manufacturing method 有权
    沉积装置和电子装置的制造方法

    公开(公告)号:US08663437B2

    公开(公告)日:2014-03-04

    申请号:US12781903

    申请日:2010-05-18

    摘要: A deposition apparatus includes a shutter storage unit which is connected to a processing chamber via an opening and stores a shutter in the retracted state into an exhaust chamber, and a shield member which is formed around the opening of the shutter storage unit and covers the exhaust port of the exhaust chamber. The shield member has, at a position of a predetermined height between the opening of the shutter storage unit and a deposition unit, the first exhaust path which communicates with the exhaust port of the exhaust chamber.

    摘要翻译: 沉积装置包括快门存储单元,其经由开口连接到处理室,并将处于缩回状态的快门存储到排气室中;以及屏蔽构件,其围绕快门存储单元的开口形成并覆盖排气 排气室的端口。 在挡板存储单元的开口和沉积单元之间的预定高度的位置处具有与排气室的排气口连通的第一排气路径。

    DEPOSITION APPARATUS AND ELECTRONIC DEVICE MANUFACTURING METHOD
    3.
    发明申请
    DEPOSITION APPARATUS AND ELECTRONIC DEVICE MANUFACTURING METHOD 有权
    沉积装置和电子装置制造方法

    公开(公告)号:US20100224482A1

    公开(公告)日:2010-09-09

    申请号:US12781903

    申请日:2010-05-18

    IPC分类号: C23C14/34

    摘要: A deposition apparatus includes a shutter storage unit which is connected to a processing chamber via an opening and stores a shutter in the retracted state into an exhaust chamber, and a shield member which is formed around the opening of the shutter storage unit and covers the exhaust port of the exhaust chamber. The shield member has, at a position of a predetermined height between the opening of the shutter storage unit and a deposition unit, the first exhaust path which communicates with the exhaust port of the exhaust chamber.

    摘要翻译: 沉积装置包括快门存储单元,其经由开口连接到处理室,并将处于缩回状态的快门存储到排气室中;以及屏蔽构件,其围绕快门存储单元的开口形成并覆盖排气 排气室的端口。 在挡板存储单元的开口和沉积单元之间的预定高度的位置处具有与排气室的排气口连通的第一排气路径。

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SPUTTERING APPARATUS
    4.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SPUTTERING APPARATUS 审中-公开
    制造半导体器件和溅射装置的方法

    公开(公告)号:US20100326818A1

    公开(公告)日:2010-12-30

    申请号:US12842732

    申请日:2010-07-23

    IPC分类号: C23C14/35 C23C14/34

    摘要: The invention provides a method of manufacturing a semiconductor device and a sputtering apparatus which improve the composition of a film formed by a metal and a reactive gas without increasing the number of steps. An embodiment includes the steps of: placing a substrate on a substrate holder in a process chamber; and sputtering a target in the process chamber by applying electric power thereto while feeding a first reactive gas and a second reactive gas having higher reactivity than that of the first reactive gas into the process chamber, to form a film containing a target material on the substrate. The step of forming a film is conducted by feeding at least the first reactive gas from a first gas feed opening formed near the target, and by feeding the second reactive gas from a second gas feed opening formed at a position with the distance from the target larger than that of the first gas feed opening.

    摘要翻译: 本发明提供一种制造半导体器件和溅射装置的方法,该方法改善由金属和反应性气体形成的膜的组成而不增加步骤数。 实施例包括以下步骤:将衬底放置在处理室中的衬底保持器上; 并且在将第一反应气体和具有比第一反应气体的反应性高的第二反应气体供给到处理室的同时向处理室中施加电力而溅射靶,以在基板上形成含有靶材料的膜 。 形成膜的步骤是通过从形成在靶附近的第一气体供给口至少供给第一反应性气体,并且通过从形成在距离靶的距离的位置形成的第二气体供给口 大于第一气体供给口的尺寸。

    Unlocking member arranging structure for vehicles
    5.
    发明授权
    Unlocking member arranging structure for vehicles 有权
    解锁车辆安排结构

    公开(公告)号:US07134706B2

    公开(公告)日:2006-11-14

    申请号:US11037072

    申请日:2005-01-19

    IPC分类号: B62D25/00

    摘要: In a vehicle wherein a functional part arranged in a body cover is supported by a body frame and a lid which makes it possible to lock a closed state covering the functional part can be openably fitted to the body cover in a position matching the functional part. Thus, the risk of undesirable tampering with the unlocking member is to be minimized and the risk for the unlocking member to be influenced by external disturbance such as unfavorable weather is to be avoided as far as possible. A cover member in which a lid is arranged in a secluded position is openably disposed on a body cover, and an unlocking member for releasing the lid from the locked state is disposed on the body cover so as to be covered by a cover member in a closed state.

    摘要翻译: 在车身罩中布置的功能部件由车身框架支撑的车辆中,能够将覆盖功能部件的关闭状态锁定的盖子能够与功能部件相匹配的位置可开启地安装在车身罩上。 因此,尽可能地避免对解锁构件的不期望的篡改的风险,并且尽可能避免解锁构件受诸如不利天气的外部干扰的影响的风险。 盖体设置在隐蔽位置的盖构件可开放地设置在主体盖上,并且用于将盖从锁定状态释放的解锁构件设置在主体盖上,以便被盖构件覆盖 关闭状态。

    Electrostatic attraction mechanism, surface processing method and surface processing device
    6.
    发明授权
    Electrostatic attraction mechanism, surface processing method and surface processing device 失效
    静电吸引机构,表面处理方法及表面处理装置

    公开(公告)号:US06922325B2

    公开(公告)日:2005-07-26

    申请号:US09895403

    申请日:2001-07-02

    申请人: Nobuo Yamaguchi

    发明人: Nobuo Yamaguchi

    CPC分类号: H01L21/6831 H01L21/6833

    摘要: Electrostatic attraction is performed on a plate-shaped object 9 in that an attraction power source 3 applies a voltage to a pair of attraction terminals 23, 24 mounted inside a dielectric block 22, the surface of which is an attraction surface, thereby inducing static electricity in an attraction surface. The attraction power source 3 adjusts the surface potential of a plate-shaped object 9 by independently controlling voltages applied to the respective attraction terminals 23, 24. Processing is carried out on the surface of the plate-shaped object 9 while the injection of charged particles into the plate-shaped object 9 is suppressed. A control part 6 which controls the attraction power source 3 records, in a recording part 62, data obtained by measuring in advance the surface potential of the plate-shaped object 9 while respectively changing the voltage applied to the attraction terminals 23, 24, and controls the attraction power source 3 with a pattern selected in accordance with this data.

    摘要翻译: 对板状物体9进行静电吸引,因为吸引用电源3向安装在介质块22的内部的一对吸引端子23,24施加电压,其表面是吸引面,从而引起静电 在吸引力的表面。 吸引电源3通过独立地控制施加到各吸引端子23,24的电压来调整板状物体9的表面电位。 在将带电粒子注入板状物体9的同时,在板状物体9的表面上进行加工。 控制吸引力源3的控制部6在记录部62中记录通过预先测量板状物体9的表面电位而获得的数据,同时分别改变施加到吸引端子23,24的电压和 利用根据该数据选择的图案来控制吸引力源3。

    Fluorescent display device with position selecting and column/row
selecting grids
    8.
    发明授权
    Fluorescent display device with position selecting and column/row selecting grids 失效
    具有位置选择和列/行选择网格的荧光显示设备

    公开(公告)号:US4223244A

    公开(公告)日:1980-09-16

    申请号:US951388

    申请日:1978-10-16

    CPC分类号: H01J31/15

    摘要: A fluorescent display device having pattern display sections each composed of phosphor-coated anodes arranged in the form of a matrix, at least a filament for emitting electrons when heated, the anodes being selectively bombarded with electrons emitted from the cathode to produce a visual display, position-selecting grids provided between the filament and the pattern display sections, column-selecting grids or row-selecting grids provided opposite to the columns or rows of the anodes, and a frame member provided, on its surface facing the filament, with the position-selecting grids and on its surface facing the pattern display section with the column-selecting grids or the row-selecting grids, the frame member being made of insulating material at least where necessary. With the provision of the frame member, the device of the present invention can be assembled easily, securely and correctly, and can produce a high-quality display.

    摘要翻译: 一种荧光显示装置,具有图案显示部分,每个图案显示部分由以矩阵形式布置的磷光体涂覆的阳极组成,至少一个在加热时发射电子的灯丝,阳极被从阴极发射的电子选择性地轰击以产生视觉显示, 提供在灯丝和图案显示部分之间的选择栅格,与阳极列或行相对设置的列选择栅格或行选择栅格,以及在其面向灯丝的表面上设置的框架构件, - 选择栅格,并且在其具有列选择栅格或行选择栅格的图案显示部分的表面上,框架构件至少在必要时由绝缘材料制成。 通过设置框架构件,可以容易地,可靠地和正确地组装本发明的装置,并且可以产生高质量的显示。

    Electronic device manufacturing method and sputtering method
    9.
    发明授权
    Electronic device manufacturing method and sputtering method 有权
    电子器件制造方法和溅射法

    公开(公告)号:US09090974B2

    公开(公告)日:2015-07-28

    申请号:US13596734

    申请日:2012-08-28

    IPC分类号: C23C14/34 C23C14/50 H01J37/34

    摘要: An electronic device manufacturing method includes a first step of moving a substrate holder close to a first shield member and locating a first projecting portion formed on the first shield member and having a ring shape and a second projecting portion having a ring shape and formed on a second shield member installed on the surface of the substrate holder at the outer peripheral portion of a substrate at a position to engage with each other in a noncontact state, a second step of, after the first step, sputtering a target while maintaining the first projecting portion and the second projecting portion at the position to engage with each other in the noncontact state, and a third step of, after the second step, setting the first shield member in an open state and sputtering the target to perform deposition on the substrate.

    摘要翻译: 一种电子设备制造方法,包括:第一步骤,使基板保持器靠近第一屏蔽部件移动,并且定位形成在第一屏蔽部件上的具有环形的第一突出部分和具有环形的第二突出部分,并形成在 第二屏蔽构件,其安装在基板保持件的表面上,在基板的外周部分处于非接触状态下彼此接合的位置;第二步骤,在第一步骤之后,溅射靶,同时保持第一突出 部分和第二突出部分在非接触状态下彼此接合的位置,以及第三步骤,在第二步骤之后,将第一屏蔽构件设置在打开状态,并溅射靶以在基板上进行沉积。

    Reactive sputtering apparatus
    10.
    发明授权
    Reactive sputtering apparatus 有权
    反应溅射装置

    公开(公告)号:US09034152B2

    公开(公告)日:2015-05-19

    申请号:US13310230

    申请日:2011-12-02

    IPC分类号: H01J37/34 C23C14/00

    摘要: A reactive sputtering apparatus includes a chamber, a substrate holder provided in the chamber, a target holder which is provided in the chamber and configured to hold a target, a deposition shield plate which is provided in the chamber so as to form a sputtering space between the target holder and the substrate holder, and prevents a sputter particle from adhering to an inner wall of the chamber, a reactive gas introduction pipe configured to introduce a reactive gas into the sputtering space, an inert gas introduction port which introduces an inert gas into a space that falls outside the sputtering space and within the chamber, and a shielding member which prevents a sputter particle from the target mounted on the target holder from adhering to an introduction port of the reactive gas introduction pipe upon sputtering.

    摘要翻译: 反应性溅射装置包括室,设置在室中的基板保持器,设置在室中并构造成保持目标的目标保持器,设置在室中的沉积屏蔽板,以在第二区域之间形成溅射空间, 目标保持架和基板支架,防止溅射粒子附着在室内壁;反应性气体引入管,被配置为将溅射空间引入反应气体;将惰性气体引入到惰性气体导入口 落在溅射空间内部和室内的空间,以及防止溅射颗粒从溅射中安装在靶保持体上的靶的溅射粒子附着在反应性气体导入管的导入口上的屏蔽部件。