LED with a coupling-out structure

    公开(公告)号:US06661033B2

    公开(公告)日:2003-12-09

    申请号:US10331924

    申请日:2002-12-30

    IPC分类号: H01L3300

    CPC分类号: H01L33/38 H01L33/14 H01L33/20

    摘要: On an upper side there is a structured output coupling layer with flanks which are aligned at an angle between 60° and 88° with respect to a layer plane and which form boundaries for output coupling areas provided for the emergence of radiation and offset from one another. The output coupling areas are formed as flat truncated cones and can be rippled or zigzagged at the flanks, in order to increase the probability that the radiation produced strikes an outer interface of the output coupling layer more steeply than at a limiting angle of total reflection.

    Method for roughening a surface of a body, and optoelectronic component
    3.
    发明申请
    Method for roughening a surface of a body, and optoelectronic component 审中-公开
    用于粗糙化身体表面的方法和光电子部件

    公开(公告)号:US20060151428A1

    公开(公告)日:2006-07-13

    申请号:US10541298

    申请日:2003-12-18

    IPC分类号: C23F1/00 H01L33/00

    摘要: A method for roughening a surface of a body (1), having the following steps of: coating the surface with a mask layer (2), applying preformed mask bodies (3) on the mask layer (2), etching through the mask layer (2) at locations not covered by mask bodies (3), and etching the body (1) at locations of its surface that are free of the mask layer (2).

    摘要翻译: 一种用于使体(1)的表面粗糙化的方法,具有以下步骤:用掩模层(2)涂覆表面,将预成型的掩模体(3)施加到掩模层(2)上,通过掩模层 (2)在未被掩模体(3)覆盖的位置处,并且在其表面的没有掩模层(2)的位置处蚀刻主体(1)。

    Optoelectronic Semiconductor Chip
    5.
    发明申请
    Optoelectronic Semiconductor Chip 审中-公开
    光电半导体芯片

    公开(公告)号:US20110297982A1

    公开(公告)日:2011-12-08

    申请号:US13061514

    申请日:2009-07-23

    IPC分类号: H01L33/60

    摘要: A semiconductor chip is specified, comprising an active layer provided for emitting an electromagnetic radiation, and a two-dimensional arrangement of structural units, which is disposed downstream of the active layer in a main emission direction of the semiconductor chip. The structural units are arranged in an arbitrary statistical distribution. Such an arrangement of structural units makes it possible to realize a semiconductor chip having a directional emission characteristic.

    摘要翻译: 规定了半导体芯片,其包括设置用于发射电磁辐射的有源层和在半导体芯片的主发射方向上设置在有源层下游的结构单元的二维排列。 结构单元布置在任意统计分布中。 这种结构单元的布置使得可以实现具有定向发射特性的半导体芯片。

    Optoelectronic component
    8.
    发明授权
    Optoelectronic component 有权
    光电元件

    公开(公告)号:US08624289B2

    公开(公告)日:2014-01-07

    申请号:US12680637

    申请日:2008-09-10

    申请人: Ralph Wirth

    发明人: Ralph Wirth

    IPC分类号: H01L27/15

    摘要: An optoelectronic component comprising the following features is disclosed, at least one semiconductor body (1) provided for emitting electromagnetic radiation of a first wavelength range, an inner radiation-permeable shaped body (2), into which the semiconductor body (1) is embedded, a wavelength-converting layer (6) on an outer side (5) of the inner shaped body (2), said layer comprising a wavelength conversion substance (8) suitable for converting radiation of the first wavelength range into radiation of a second wavelength range, which is different from the first wavelength range, a coupling-out lens (10), into which the inner shaped body (2) and the wavelength-converting layer (6) are embedded, wherein the coupling-out lens (10) has an inner side enclosed by an inner hemisphere area having a radius Rconversion, and an outer side enclosing an outer hemisphere area having a radius Router, and the radii Rconverstion and Router meet the Weierstrass condition: Router≧Rconversion*nlens/nair, where nlens is the refractive index of the coupling-out lens and nair is the refractive index of the surroundings of the coupling-out lens.

    摘要翻译: 公开了一种包括以下特征的光电子部件:设置用于发射第一波长范围的电磁辐射的至少一个半导体本体(1),嵌入半导体本体(1)的内辐射透射成形体(2) ,所述内部成形体(2)的外侧(5)上的波长转换层(6),所述层包括适于将第一波长范围的辐射转换成第二波长的辐射的波长转换物质(8) 与第一波长范围不同的范围,内置成形体(2)和波长转换层(6)嵌入其中的耦合透镜(10),其中,耦合透镜(10) 具有由具有半径R转换的内半球区域封闭的内侧和封闭具有半径路由器的外半球区域的外侧,并且半径Rconverstion和路由器满足Weierstrass条件:Router> = Rconversion * nlens / nair,其中nlens是耦合透镜的折射率,nair是耦合透镜的周围的折射率。

    Optoelectronic semiconductor component with current spreading layer
    9.
    发明授权
    Optoelectronic semiconductor component with current spreading layer 有权
    具有电流扩散层的光电半导体元件

    公开(公告)号:US08501513B2

    公开(公告)日:2013-08-06

    申请号:US11992706

    申请日:2006-09-14

    IPC分类号: H01L33/00

    摘要: An optoelectronic semiconductor component comprising a semiconductor body (10) and a current spreading layer (3) is specified. The current spreading layer (3) is applied to the semiconductor body (10) at least in places. In this case, the current spreading layer (3) contains a metal (1) that forms a transparent electrically conductive metal oxide (2) in the current spreading layer, and the concentration (x) of the metal (1) decreases from that side of the current spreading layer (3) which faces the semiconductor body (10) toward that side of said current spreading layer which is remote from the semiconductor body (10). A method for producing such a semiconductor component is also disclosed.

    摘要翻译: 规定了包括半导体本体(10)和电流扩展层(3)的光电半导体部件。 至少在某个地方将电流扩展层(3)施加到半导体本体(10)。 在这种情况下,电流扩散层(3)包含在电流扩散层中形成透明导电金属氧化物(2)的金属(1),并且金属(1)的浓度(x)从该侧减小 (10)面向半导体本体(10)的电流扩展层(3)的电流扩散层(3)的电流扩展层(5)。 还公开了一种用于制造这种半导体部件的方法。