公开(公告)号：US20220336697A1

公开(公告)日：2022-10-20

申请号：US17633081

申请日：2020-07-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas Dobner ,  Matthias Goldbach ,  Georg Bogner

IPC: H01L33/00 ,  H01L31/02 ,  H01L31/18 ,  H01L33/32 ,  H01L33/62

Abstract: In an embodiment a method for singulating components from a component composite includes providing the component composite comprising a structured substrate including component carrier bodies and connecting portions arranged between the component carrier bodies, and a base material, in which the connecting portions of the structured substrate are at least partially embedded, removing the base material in separating regions of the component composite, which include the connecting portions and singulating the component composite at the separating regions to form the components.

公开(公告)号：US20180287018A1

公开(公告)日：2018-10-04

申请号：US15764938

申请日：2016-09-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Goldbach ,  Andreas Gruendl

IPC: H01L33/50

Abstract: An optoelectronic component includes a layer configured to generate an electromagnetic radiation including a first wavelength; a second layer including a conversion material and a scattering material, wherein the conversion material is configured to shift the first wavelength of the electromagnetic radiation to a second wavelength, and the scattering material is configured to scatter the first wavelength to a greater extent than the second wavelength.

公开(公告)号：US09620694B2

公开(公告)日：2017-04-11

申请号：US15102904

申请日：2014-12-10

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Matthias Goldbach

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2224/4554

Abstract: An optoelectronic component includes a leadframe, a molded body connected to the leadframe, and an optoelectronic semiconductor chip arranged on the leadframe, wherein the leadframe includes an alignment opening, and wherein the molded body includes a recess via which the leadframe is exposed in the area of the alignment opening.

公开(公告)号：US09985178B2

公开(公告)日：2018-05-29

申请号：US15027971

申请日：2014-10-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Goldbach

IPC: H01L33/20 ,  H01L33/00 ,  H01L33/16 ,  H01L33/30 ,  H01L33/38

CPC classification number: H01L33/20 ,  H01L33/0066 ,  H01L33/0095 ,  H01L33/16 ,  H01L33/30 ,  H01L33/38 ,  H01L33/385

Abstract: The invention concerns a semiconductor chip (100) with a semiconductor body (2) having a semiconductor layer sequence, and with a substrate body (4) and at least one upper side contact (8). In projection the semiconductor chip (100) has a shape which deviates from a rectangular shape. The invention also concerns a method of separating a composite into a plurality of semiconductor chips (100) along a separation pattern (15) with the steps enabling a plurality of semiconductor chips according to the invention to be produced.

公开(公告)号：US20250096206A1

公开(公告)日：2025-03-20

申请号：US18970720

申请日：2024-12-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael BRANDL ,  Andreas Dobner ,  Matthias Goldbach ,  Sebastian Wittmann ,  Uli Hiller ,  Markus Klein ,  Thomas Schwarz ,  Andreas Waldschik ,  Michael Wittmann ,  Matthias Bruckschloegl ,  Stefan Groetsch ,  Rainer Huber ,  Peter Brick ,  Ludwig Hofbauer

IPC: H01L25/075 ,  B60K35/00 ,  H01L33/60

Abstract: An optoelectronic device, in particular an at least partially transparent pane for example of a vehicle, comprises a first layer, in particular an intermediate layer arranged between a cover layer and a carrier layer, at least one electronic or optoelectronic component, which is at least partially or completely embedded in the first layer and at least one structured conductor layer. A first portion of the conductor layer is arranged on an upper surface of the first layer and a second portion of the conductor layer is arranged on a top surface of the electronic or optoelectronic component and is in contact with an electric contact of the electronic or optoelectronic component. The electric contact, in particular a contact pad, is arranged on the top surface.

公开(公告)号：US12040317B2

公开(公告)日：2024-07-16

申请号：US17541761

申请日：2021-12-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Brandl ,  Andreas Dobner ,  Matthias Goldbach ,  Sebastian Wittmann ,  Uli Hiller ,  Markus Klein ,  Thomas Schwarz ,  Andreas Waldschik ,  Michael Wittmann ,  Matthias Bruckschloegl ,  Stefan Groetsch ,  Rainer Huber ,  Peter Brick ,  Ludwig Hofbauer

IPC: H04W72/20 ,  H01L25/075 ,  H01L33/46 ,  H01L33/62 ,  H01L33/64 ,  H04W72/51 ,  B60J3/00 ,  B60K35/00 ,  B60K35/60 ,  B62J50/22

CPC classification number: H01L25/0756 ,  H01L33/46 ,  H01L33/62 ,  H01L33/641 ,  H04W72/20 ,  H04W72/51 ,  B60J3/00 ,  B60K35/00 ,  B60K35/60 ,  B60K2370/785 ,  B62J50/22

Abstract: An optoelectronic device comprises a plurality of optoelectronic light sources being arranged on a first layer, in particular an intermediate layer being arranged between a cover layer and a carrier layer. The first layer comprises or consists of an at least partially transparent material and each optoelectronic light source of the plurality of optoelectronic light sources comprises an individual light converter for converting light emitted by the associated light source into converted light. The light converter of each optoelectronic light source is arranged on the first layer and/or the associated optoelectronic light source.

公开(公告)号：US12027656B2

公开(公告)日：2024-07-02

申请号：US17431073

申请日：2020-02-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Matthias Goldbach ,  Benjamin Höflinger

IPC: H01L27/15 ,  H01L23/495 ,  H01L25/075 ,  H01L33/00 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/62 ,  H01L23/495 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/486 ,  H01L33/60 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: In one embodiment, the optoelectronic semiconductor device comprises at least two metallic lead frame parts and a circuit chip on the lead frame parts. An electrically insulating and opaque matrix material mechanically connects the lead frame parts. The circuit chip is embedded in the matrix material, so that a carrier is formed by the matrix material together with the lead frame parts and the circuit chip. An optoelectronic semiconductor chip is provided on a carrier upper side. Furthermore, the semiconductor device comprises at least one optical component on the carrier upper side.

公开(公告)号：US20220149019A1

公开(公告)日：2022-05-12

申请号：US17541798

申请日：2021-12-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Brandl ,  Andreas Dobner ,  Matthias Goldbach ,  Sebastian Wittmann ,  Uli Hiller ,  Markus Klein ,  Thomas Schwarz ,  Andreas Waldschik ,  Michael Wittmann ,  Matthias Bruckschloegl ,  Stefan Groetsch ,  Rainer Huber ,  Peter Brick ,  Ludwig Hofbauer

IPC: H01L25/075 ,  H01L33/46 ,  H01L33/62 ,  H01L33/64

Abstract: An optoelectronic device comprises a layer stack, which includes a carrier layer, a cover layer, and a first layer. The first layer is in particular an intermediate layer, arranged between the cover layer and the carrier layer. At least one electronic or optoelectronic element, in particular an optoelectronic light source, is arranged on the first layer and at least one layer of the layer stack and preferably all layers of the layer stack are at least partially transparent. The layer stack comprises at least one layer which comprises particles with a high thermal conductivity and/or at least one thermally conductive layer which is arranged between two adjacent layers of the layer stack.

公开(公告)号：US20160308102A1

公开(公告)日：2016-10-20

申请号：US15102904

申请日：2014-12-10

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Michael Zitzlsperger ,  Matthias Goldbach

IPC: H01L33/62 ,  H01L33/54 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2224/4554

Abstract: An optoelectronic component includes a leadframe, a molded body connected to the leadframe, and an optoelectronic semiconductor chip arranged on the leadframe, wherein the leadframe includes an alignment opening, and wherein the molded body includes a recess via which the leadframe is exposed in the area of the alignment opening.

Abstract translation: 光电子部件包括引线框架，连接到引线框架的成型体和布置在引线框架上的光电子半导体芯片，其中引线框架包括对准开口，并且其中模制主体包括凹部，引线框架经由该凹槽暴露在区域中 的对齐开口。