Method of growing III group nitride single crystal and III group nitride single crystal manufactured by using the same
    1.
    发明授权
    Method of growing III group nitride single crystal and III group nitride single crystal manufactured by using the same 有权
    通过使用其制造III族氮化物单晶和III族氮化物单晶的生长方法

    公开(公告)号:US07740823B2

    公开(公告)日:2010-06-22

    申请号:US11976237

    申请日:2007-10-23

    IPC分类号: C01B21/06

    CPC分类号: C30B25/18 C30B29/403

    摘要: A method of growing a III group nitride single crystal by using a metal-organic chemical vapor deposition (MOCVD) process, the method including: preparing an r-plane (1-102) substrate; forming a nitride-based nucleation layer on the substrate; and growing a nonpolar a-plane nitride gallium single crystal on the nitride-based nucleation layer while altering increase and decrease of a ratio of V/III group to alternate a horizontal growth mode and a vertical growth mode.

    摘要翻译: 一种通过使用金属有机化学气相沉积(MOCVD)法生长III族氮化物单晶的方法,所述方法包括:制备r-平面(1-102)衬底; 在基板上形成氮化物基成核层; 并且在氮化物基成核层上生长非极性a面平面氮化镓镓单晶,同时改变V / III基团的比例的增加和减小以交替水平生长模式和垂直生长模式。

    Method of Growing III group nitride single crystal and III group nitride single crystal manufactured by using the same
    2.
    发明申请
    Method of Growing III group nitride single crystal and III group nitride single crystal manufactured by using the same 有权
    通过使用其制造的III族氮化物单晶和III族氮化物单晶的生长方法

    公开(公告)号:US20080152570A1

    公开(公告)日:2008-06-26

    申请号:US11976237

    申请日:2007-10-23

    IPC分类号: C30B25/00 C01B21/00

    CPC分类号: C30B25/18 C30B29/403

    摘要: A method of growing a III group nitride single crystal by using a metal-organic chemical vapor deposition (MOCVD) process, the method including: preparing an r-plane (1-102) substrate; forming a nitride-based nucleation layer on the substrate; and growing a nonpolar a-plane nitride gallium single crystal on the nitride-based nucleation layer while altering increase and decrease of a ratio of V/III group to alternate a horizontal growth mode and a vertical growth mode.

    摘要翻译: 一种通过使用金属有机化学气相沉积(MOCVD)法生长III族氮化物单晶的方法,所述方法包括:制备r-平面(1-102)衬底; 在基板上形成氮化物基成核层; 并且在氮化物基成核层上生长非极性a面平面氮化镓镓单晶,同时改变V / III基团的比例的增加和减小以交替水平生长模式和垂直生长模式。

    Nitride semiconductor single crystal substrate, and methods of fabricating the same and a vertical nitride semiconductor light emitting diode using the same
    4.
    发明授权
    Nitride semiconductor single crystal substrate, and methods of fabricating the same and a vertical nitride semiconductor light emitting diode using the same 有权
    氮化物半导体单晶衬底及其制造方法以及使用其的垂直氮化物半导体发光二极管

    公开(公告)号:US07859086B2

    公开(公告)日:2010-12-28

    申请号:US11723065

    申请日:2007-03-16

    IPC分类号: H01L33/00 H01L29/04 H01L29/12

    摘要: A nitride semiconductor single crystal substrate, a manufacturing method thereof and a method for manufacturing a vertical nitride semiconductor device using the same. According to an aspect of the invention, in the nitride semiconductor single crystal substrate, upper and lower regions are divided along a thickness direction, the nitride single crystal substrate having a thickness of at least 100 μm. Here, the upper region has a doping concentration that is five times or greater than that of the lower region. Preferably, a top surface of the substrate in the upper region has Ga polarity. Also, according to a specific embodiment of the invention, the lower region is intentionally un-doped and the upper region is n-doped. Preferably, each of the upper and lower regions has a doping concentration substantially identical in a thickness direction.

    摘要翻译: 氮化物半导体单晶衬底,其制造方法和使用其的垂直氮化物半导体器件的制造方法。 根据本发明的一个方面,在氮化物半导体单晶衬底中,沿着厚度方向分割上部和下部区域,所述氮化物单晶衬底的厚度至少为100μm。 这里,上部区域的掺杂浓度为下部区域的5倍以上。 优选地,上部区域中的基板的顶表面具有Ga极性。 此外,根据本发明的具体实施例,下部区域有意地未掺杂,并且上部区域是n掺杂的。 优选地,上部区域和下部区域中的每一个具有在厚度方向上基本相同的掺杂浓度。

    Nitride semiconductor single crystal substrate, and methods of fabricating the same and a vertical nitride semiconductor light emitting diode using the same
    5.
    发明申请
    Nitride semiconductor single crystal substrate, and methods of fabricating the same and a vertical nitride semiconductor light emitting diode using the same 有权
    氮化物半导体单晶衬底及其制造方法以及使用其的垂直氮化物半导体发光二极管

    公开(公告)号:US20070215983A1

    公开(公告)日:2007-09-20

    申请号:US11723065

    申请日:2007-03-16

    IPC分类号: H01L29/12

    摘要: A nitride semiconductor single crystal substrate, a manufacturing method thereof and a method for manufacturing a vertical nitride semiconductor device using the same. According to an aspect of the invention, in the nitride semiconductor single crystal substrate, upper and lower regions are divided along a thickness direction, the nitride single crystal substrate having a thickness of at least 100 μm. Here, the upper region has a doping concentration that is five times or greater than that of the lower region. Preferably, a top surface of the substrate in the upper region has Ga polarity. Also, according to a specific embodiment of the invention, the lower region is intentionally un-doped and the upper region is n-doped. Preferably, each of the upper and lower regions has a doping concentration substantially identical in a thickness direction.

    摘要翻译: 氮化物半导体单晶衬底,其制造方法和使用其的垂直氮化物半导体器件的制造方法。 根据本发明的一个方面,在氮化物半导体单晶衬底中,沿厚度方向分割上下区域,氮化物单晶衬底的厚度至少为100μm。 这里,上部区域的掺杂浓度为下部区域的5倍以上。 优选地,上部区域中的基板的顶表面具有Ga极性。 此外,根据本发明的具体实施例,下部区域有意地未掺杂,并且上部区域是n掺杂的。 优选地,上部区域和下部区域中的每一个具有在厚度方向上基本相同的掺杂浓度。

    Method of manufacturing a silicon/silicon germanium heterojunction
bipolar transistor
    7.
    发明授权
    Method of manufacturing a silicon/silicon germanium heterojunction bipolar transistor 失效
    制造硅/硅锗异质结双极晶体管的方法

    公开(公告)号:US5897359A

    公开(公告)日:1999-04-27

    申请号:US987474

    申请日:1997-12-09

    CPC分类号: H01L29/66242 H01L29/7378

    摘要: There is disclosed a method of manufacturing a silicon/silicon germanium heterojunction bipolar transistor having a good conformity and an improved speed characteristic, which includes the steps of sequentially laminating an underlying nitride film, an oxide film, a polycrystalline silicon film and an upper nitride on a semiconductor substrate on which devices are separated and a collector is formed; sequentially etching said upper nitride film and said polycrystalline silicon film using the emitter as a mask, and then forming a side wall nitride film; selectively wet-etching said oxide film to form a side base linker opening; burying said base linker opening with a polycrystalline silicon; oxidizing said polycrystalline silicon film buried into said base linker opening and then removing said oxide film by means of the selective wet-etch process; removing said upper nitride and then forming a silicon/silicon germanium film as a base film on the exposed thereof; and forming an emitter said silicon/silicon germanium film.

    摘要翻译: 公开了一种制造具有良好一致性和改进的速度特性的硅/硅锗异质结双极晶体管的方法,其包括以下步骤:将下面的氮化物膜,氧化物膜,多晶硅膜和上部氮化物依次层压在 半导体衬底,器件分离并形成集电极; 使用发射极作为掩模,依次蚀刻所述上部氮化物膜和所述多晶硅膜,然后形成侧壁氮化物膜; 选择性地湿蚀刻所述氧化膜以形成侧基连接器开口; 用多晶硅掩埋所述基底连接器开口; 氧化所述多晶硅膜,所述多晶硅膜埋入所述基底连接器开口中,然后通过选择性湿蚀刻工艺除去所述氧化物膜; 去除所述上部氮化物,然后在其暴露时形成硅/硅锗膜作为基膜; 以及形成所述硅/硅锗膜的发射极。