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公开(公告)号：US09857035B2
公开(公告)日：2018-01-02
申请号：US14596548
申请日：2015-01-14
Inventor： Koji Omura , Toshiaki Kurachi
IPC: F21K99/00 , F21S8/02 , H01L25/00 , F21K9/232 , F21Y105/10 , F21Y115/10 , F21Y113/13
CPC classification number: F21K9/64 , F21K9/232 , F21S8/026 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H01L25/00 , H01L2224/45144 , H01L2224/48137 , H01L2924/181 , H01L2924/00 , H01L2924/00012
Abstract: A light emitting device that emits white light includes first and second light emitting elements which have different emission peak wavelengths within a range of 440 nm to 495 nm. The device also includes a wavelength conversion material which converts a wavelength of light emitted by at least one of the first and second light emitting elements. The white light has an emission spectrum peaked at a first peak wavelength and a second peak wavelength. The first peak wavelength corresponds to the emission peak wavelength of the first light emitting element, and the second peak wavelength corresponds to the emission peak wavelength of the second light emitting element. Where a light intensity at one of the first peak wavelength and the second peak wavelength is 1, a light intensity at a bottom of a valley between the first and second peak wavelengths is 0.5 or higher but lower than 1.0.
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2.发明授权公开(公告)号：US09741915B2
公开(公告)日：2017-08-22
申请号：US15220790
申请日：2016-07-27
Inventor： Naoki Tagami , Masumi Abe , Hisaki Fujitani , Kosuke Takehara , Toshiaki Kurachi
CPC classification number: H01L33/62 , H01L33/60 , H01L2224/48091 , H01L2224/48228 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. A content percentage of at least one of a phenyl group, an ester bond, and a carbon double bond in a second layer that is an uppermost layer of the plurality of layers is lower than a content percentage of the at least one of the phenyl group, the ester bond, and the carbon double bond in a first layer that is an underlying layer of the plurality of layers, the underlying layer being located below the uppermost layer.
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公开(公告)号：US10014458B2
公开(公告)日：2018-07-03
申请号：US15454256
申请日：2017-03-09
Inventor： Masumi Abe , Naoki Tagami , Toshiaki Kurachi
CPC classification number: H01L33/62 , H01L25/0753 , H01L33/32 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/647 , H01L2224/48095 , H01L2224/48465 , H01L2224/73265 , H01L2924/181 , H01L2924/00012
Abstract: An LED module includes a resin substrate, a metal layer formed above the resin substrate, a resist layer formed above the metal layer and including a plurality of layers, and an LED chip mounted above the resist layer via an adhesive. The resist layer comprises an epoxy acrylic-based or a silicon-based resin material, and the adhesive is white.
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公开(公告)号：US09871024B2
公开(公告)日：2018-01-16
申请号：US15451985
申请日：2017-03-07
Inventor： Masumi Abe , Naoki Tagami , Toshiaki Kurachi
CPC classification number: H01L25/0753 , H01L25/50 , H01L27/156 , H01L33/44 , H01L33/504 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2924/181 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0091 , H01L2924/00014 , H01L2924/00012
Abstract: A light-emitting apparatus is provided. The light-emitting apparatus includes a first and second light-emitting elements disposed on a substrate. A sealing layer is above the first and second light-emitting elements for sealing the first and second light-emitting elements. A first phosphor layer is above a first portion of the sealing layer. The first phosphor layer includes at least one first phosphor. A second phosphor layer is above a second portion of the sealing layer. The second phosphor layer includes at least one second phosphor. The first phosphor layer is configured to emit light, which is emitted as a result of emission by the first light-emitting element, having a first color. The second phosphor layer is configured to emit light, which is emitted as a result of emission by the second light-emitting element, having a second color different from the first color.
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公开(公告)号：US09799803B2
公开(公告)日：2017-10-24
申请号：US15223713
申请日：2016-07-29
Inventor： Naoki Tagami , Masumi Abe , Hisaki Fujitani , Kosuke Takehara , Toshiaki Kurachi
IPC: H01L33/48
CPC classification number: H01L33/486 , H01L2224/32225 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00
Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers, above the substrate; and an LED element mounted above the resist via an adhesive. The adhesive includes an addition-reaction type silicone resin. In the resist, a higher positioned layer of the plurality of layers is lower in at least one of sulfur content, phosphorus content, and nitrogen content than a lower positioned layer of the plurality of layers.
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Patent Agency Ranking
公开(公告)号：US10278245B2
公开(公告)日：2019-04-30
申请号：US15055937
申请日：2016-02-29
Inventor： Masumi Abe , Yasuharu Ueno , Koji Omura , Kenji Sugiura , Toshifumi Ogata , Atsuyoshi Ishimori , Toshiaki Kurachi
IPC: H05B33/08 , F21S8/02 , F21Y115/10 , F21Y113/10 , F21Y105/18 , H01L25/075
Abstract: A light-emitting device includes a substrate and a plurality of light-emitting elements disposed above the substrate. In the plurality of light-emitting elements, a first light-emitting element and a second light-emitting element different in a rate of decrease in light output along with a temperature increase are included. The plurality of light-emitting elements include: a first serial element group including some light-emitting elements connected in series among the plurality of light-emitting elements; and a second serial element group connected in parallel with the first serial element group and including some light-emitting elements connected in series among the plurality of light-emitting elements. A ratio between a total number of first light-emitting elements and a total number of second light-emitting elements is different between the first serial element group and the second serial element group.
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公开(公告)号：USD795207S1
公开(公告)日：2017-08-22
申请号：US29578457
申请日：2016-09-21
Designer： Atsuyoshi Ishimori , Toshifumi Ogata , Toshiaki Kurachi
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公开(公告)号：USD770987S1
公开(公告)日：2016-11-08
申请号：US29523266
申请日：2015-04-08
Designer： Atsuyoshi Ishimori , Toshifumi Ogata , Toshiaki Kurachi
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公开(公告)号：US10103298B2
公开(公告)日：2018-10-16
申请号：US15223043
申请日：2016-07-29
Inventor： Naoki Tagami , Masumi Abe , Hisaki Fujitani , Kosuke Takehara , Toshiaki Kurachi
Abstract: A light emitting diode (LED) module which includes: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. The plurality of layers includes a second layer that is an uppermost layer and a first layer that is an underlying layer. The second layer that is the uppermost layer includes fluorine as a component.
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公开(公告)号：US10032754B2
公开(公告)日：2018-07-24
申请号：US15819069
申请日：2017-11-21
Inventor： Masumi Abe , Naoki Tagami , Toshiaki Kurachi
Abstract: A method of manufacturing a light-emitting apparatus includes mounting a first light-emitting element and a second light-emitting element on a substrate. A sealing layer is formed above the first light-emitting element and the second light-emitting element for sealing the first light-emitting element and the second light-emitting element. A first phosphor layer is applied above a first portion of the sealing layer, in which the first phosphor layer includes at least one first phosphor. A second phosphor layer is applied above a second portion of the sealing layer, in which the second phosphor layer includes at least one second phosphor.
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