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公开(公告)号：US10014458B2
公开(公告)日：2018-07-03
申请号：US15454256
申请日：2017-03-09
Inventor： Masumi Abe , Naoki Tagami , Toshiaki Kurachi
CPC classification number: H01L33/62 , H01L25/0753 , H01L33/32 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/647 , H01L2224/48095 , H01L2224/48465 , H01L2224/73265 , H01L2924/181 , H01L2924/00012
Abstract: An LED module includes a resin substrate, a metal layer formed above the resin substrate, a resist layer formed above the metal layer and including a plurality of layers, and an LED chip mounted above the resist layer via an adhesive. The resist layer comprises an epoxy acrylic-based or a silicon-based resin material, and the adhesive is white.
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公开(公告)号：US09871024B2
公开(公告)日：2018-01-16
申请号：US15451985
申请日：2017-03-07
Inventor： Masumi Abe , Naoki Tagami , Toshiaki Kurachi
CPC classification number: H01L25/0753 , H01L25/50 , H01L27/156 , H01L33/44 , H01L33/504 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2924/181 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0091 , H01L2924/00014 , H01L2924/00012
Abstract: A light-emitting apparatus is provided. The light-emitting apparatus includes a first and second light-emitting elements disposed on a substrate. A sealing layer is above the first and second light-emitting elements for sealing the first and second light-emitting elements. A first phosphor layer is above a first portion of the sealing layer. The first phosphor layer includes at least one first phosphor. A second phosphor layer is above a second portion of the sealing layer. The second phosphor layer includes at least one second phosphor. The first phosphor layer is configured to emit light, which is emitted as a result of emission by the first light-emitting element, having a first color. The second phosphor layer is configured to emit light, which is emitted as a result of emission by the second light-emitting element, having a second color different from the first color.
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公开(公告)号：US09799803B2
公开(公告)日：2017-10-24
申请号：US15223713
申请日：2016-07-29
Inventor： Naoki Tagami , Masumi Abe , Hisaki Fujitani , Kosuke Takehara , Toshiaki Kurachi
IPC: H01L33/48
CPC classification number: H01L33/486 , H01L2224/32225 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00
Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers, above the substrate; and an LED element mounted above the resist via an adhesive. The adhesive includes an addition-reaction type silicone resin. In the resist, a higher positioned layer of the plurality of layers is lower in at least one of sulfur content, phosphorus content, and nitrogen content than a lower positioned layer of the plurality of layers.
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公开(公告)号：US20150214451A1
公开(公告)日：2015-07-30
申请号：US14421138
申请日：2013-09-04
Inventor： Masumi Abe , Yasufumi Wada , Toshifumi Ogata , Kenji Sugiura
CPC classification number: H01L33/62 , F21S4/28 , F21V23/003 , F21V23/005 , F21Y2105/10 , F21Y2115/10 , H01L24/05 , H01L24/48 , H01L24/49 , H01L25/0753 , H01L33/54 , H01L2224/04042 , H01L2224/05555 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48465 , H01L2224/49109 , H01L2224/4911 , H01L2224/49429 , H01L2224/4945 , H01L2924/00014 , H01L2924/12042 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/45014 , H01L2224/85399 , H01L2224/05599
Abstract: Each of a plurality of semiconductor light-emitting element has, on an upper surface thereof that has a quadrilateral shape, a pair of connecting portions having different polarities from each other. The pair of connecting portions are aligned on a diagonal of the quadrilateral shape. The diagonal intersects a row direction along which the semiconductor light-emitting elements within a row are arranged. Connecting portions having identical polarity are positioned on an imaginary line parallel to the row direction. Metal wires intersect two sides extending from a corner, on the diagonal, of the upper surface of each of the semiconductor light-emitting elements when viewed from a direction perpendicular to a mounting surface of a substrate for mounting the semiconductor light-emitting elements.
Abstract translation: 多个半导体发光元件中的每一个在具有四边形形状的上表面上具有彼此不同极性的一对连接部。 该对连接部分在四边形形状的对角线上对齐。 该对角线与排列有一排的半导体发光元件的行方向交叉。 具有相同极性的连接部分位于平行于行方向的假想线上。 当从垂直于用于安装半导体发光元件的基板的安装表面的方向观察时，金属线从每个半导体发光元件的上表面的对角线的角部延伸的两侧相交。
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公开(公告)号：US10199597B2
公开(公告)日：2019-02-05
申请号：US15671270
申请日：2017-08-08
Inventor： Masumi Abe , Toshifumi Ogata , Naoki Tagami , Toshiaki Kurachi
Abstract: A light-emitting apparatus is provided. The light-emitting apparatus includes a substrate, a light-emitting element on the substrate, a first sealing layer which seals the light-emitting element, and a second b sealing layer. The substrate includes a base, an interconnect layer disposed on the base and electrically connected to the light-emitting element, a metal layer which covers a portion of the interconnect layer, and an electrically insulating layer which covers another portion of the interconnect layer. The second sealing layer seals a boundary between the metal layer and the electrically insulating layer.
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Patent Agency Ranking
公开(公告)号：US10153408B2
公开(公告)日：2018-12-11
申请号：US15692527
申请日：2017-08-31
Inventor： Masumi Abe , Toshifumi Ogata , Toshiaki Kurachi
IPC: H01L33/50 , H01L25/16 , H01L25/075 , H01L27/15 , H01L33/56
Abstract: A light-emitting apparatus includes a first relay line and a second relay line. The first and second relay lines are disposed between a first region and a second region of a substrate. Further, the first and second relay lines extend at least partially parallel to each other in a second direction that crosses a first direction in which the first region and the second region are aligned. The first relay line electrically connects a first light-emitting element group disposed in the first region and a third light-emitting element group disposed in the second region. The second relay line electrically connects a second light-emitting element group disposed in the first region and a fourth light-emitting element group disposed in the second region.
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公开(公告)号：US10096747B2
公开(公告)日：2018-10-09
申请号：US15454310
申请日：2017-03-09
Inventor： Masumi Abe , Naoki Tagami , Toshiaki Kurachi
Abstract: A light-emitting diode (LED) module is provided. The LED module includes a substrate, a metal layer disposed above the substrate, a resist layer disposed above the substrate and including a plurality of layers, an LED chip mounted above the substrate, and a wire connecting the metal layer and the LED chip. In a first region in which the LED chip is mounted, at least a portion of the resist layer is disposed directly on the substrate with the LED chip being mounted above the resist layer via an adhesive. In a second region which includes a connection at which the wire and the metal layer are connected and a periphery of the connection, the metal layer is disposed above the substrate with the resist layer being disposed above the metal layer.
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公开(公告)号：US10088133B2
公开(公告)日：2018-10-02
申请号：US15875316
申请日：2018-01-19
Inventor： Masumi Abe , Toshifumi Ogata , Toshiaki Kurachi
Abstract: A mounting substrate includes: a substrate; a first terminal, a fifth terminal, and a sixth terminal which are disposed in a first region; a second terminal disposed in a second region; a third terminal and a seventh terminal which are disposed in a third region; and a fourth terminal disposed in a fourth region. The mounting substrate includes: a first connecting line which electrically connects the fifth terminal and the second terminal; a second connecting line which electrically connects the sixth terminal and the third terminal; and a third connecting line which electrically connects the seventh terminal and the fourth terminal.
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公开(公告)号：US09420642B2
公开(公告)日：2016-08-16
申请号：US14828586
申请日：2015-08-18
Inventor： Masumi Abe , Toshifumi Ogata , Atsuyoshi Ishimori , Kenji Sugiura , Toshiaki Kurachi
CPC classification number: H05B33/04 , H01L33/501 , H01L33/504 , H01L33/508 , H01L2224/48091 , H01L2224/48137 , H01L2924/181 , H01L2933/0041 , H05B33/10 , H01L2924/00014 , H01L2924/00012
Abstract: Light emitting apparatus including: substrate; LED chips on substrate; first sealing layer sealing LED chips; second sealing layer above first sealing layer; and phosphor layer containing yellow phosphor, disposed between first sealing layer and second sealing layer, wherein phosphor layer contains the yellow phosphor in higher density than first sealing layer and second sealing layer.
Abstract translation: 发光装置，包括：基板; 基板上的LED芯片; 第一密封层密封LED芯片; 第一密封层上方的第二密封层; 以及配置在第一密封层和第二密封层之间的含有黄色荧光体的荧光体层，其中荧光体层含有比第一密封层和第二密封层更高密度的黄色荧光体。
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公开(公告)号：US10260687B2
公开(公告)日：2019-04-16
申请号：US15790674
申请日：2017-10-23
Inventor： Hisaki Fujitani , Masumi Abe , Kosuke Takehara
IPC: F21K9/64 , H01L25/075 , F21K9/00 , F21V5/00 , F21V7/00 , F21Y115/10 , F21S8/04 , F21K9/23 , F21K9/27 , F21Y103/10 , F21V5/04 , F21V13/02 , F21K9/69 , F21K9/68
Abstract: A light-emitting module is provided. The light emitting module includes a substrate; a thin-film layer that is disposed above the substrate, the thin-film layer defining an opening that exposes a surface of the substrate; a light-emitting element disposed above the substrate and in the opening; and a sealant disposed above the substrate and in the opening, the sealant containing a wavelength converter and sealing the light-emitting element. A thickness of the thin-film layer is less than a thickness of the sealant. An edge portion of the sealant is in contact with the thin-film layer. The surface of the substrate and a surface of the thin-film layer are hydrophilic. The surface of the thin-film layer has a lower wettability than a wettability of the surface of the substrate.
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