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1.发明授权公开(公告)号：US09741915B2
公开(公告)日：2017-08-22
申请号：US15220790
申请日：2016-07-27
Inventor： Naoki Tagami , Masumi Abe , Hisaki Fujitani , Kosuke Takehara , Toshiaki Kurachi
CPC classification number: H01L33/62 , H01L33/60 , H01L2224/48091 , H01L2224/48228 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. A content percentage of at least one of a phenyl group, an ester bond, and a carbon double bond in a second layer that is an uppermost layer of the plurality of layers is lower than a content percentage of the at least one of the phenyl group, the ester bond, and the carbon double bond in a first layer that is an underlying layer of the plurality of layers, the underlying layer being located below the uppermost layer.
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公开(公告)号：US10199597B2
公开(公告)日：2019-02-05
申请号：US15671270
申请日：2017-08-08
Inventor： Masumi Abe , Toshifumi Ogata , Naoki Tagami , Toshiaki Kurachi
Abstract: A light-emitting apparatus is provided. The light-emitting apparatus includes a substrate, a light-emitting element on the substrate, a first sealing layer which seals the light-emitting element, and a second b sealing layer. The substrate includes a base, an interconnect layer disposed on the base and electrically connected to the light-emitting element, a metal layer which covers a portion of the interconnect layer, and an electrically insulating layer which covers another portion of the interconnect layer. The second sealing layer seals a boundary between the metal layer and the electrically insulating layer.
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公开(公告)号：US10096747B2
公开(公告)日：2018-10-09
申请号：US15454310
申请日：2017-03-09
Inventor： Masumi Abe , Naoki Tagami , Toshiaki Kurachi
Abstract: A light-emitting diode (LED) module is provided. The LED module includes a substrate, a metal layer disposed above the substrate, a resist layer disposed above the substrate and including a plurality of layers, an LED chip mounted above the substrate, and a wire connecting the metal layer and the LED chip. In a first region in which the LED chip is mounted, at least a portion of the resist layer is disposed directly on the substrate with the LED chip being mounted above the resist layer via an adhesive. In a second region which includes a connection at which the wire and the metal layer are connected and a periphery of the connection, the metal layer is disposed above the substrate with the resist layer being disposed above the metal layer.
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公开(公告)号：US10014458B2
公开(公告)日：2018-07-03
申请号：US15454256
申请日：2017-03-09
Inventor： Masumi Abe , Naoki Tagami , Toshiaki Kurachi
CPC classification number: H01L33/62 , H01L25/0753 , H01L33/32 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/647 , H01L2224/48095 , H01L2224/48465 , H01L2224/73265 , H01L2924/181 , H01L2924/00012
Abstract: An LED module includes a resin substrate, a metal layer formed above the resin substrate, a resist layer formed above the metal layer and including a plurality of layers, and an LED chip mounted above the resist layer via an adhesive. The resist layer comprises an epoxy acrylic-based or a silicon-based resin material, and the adhesive is white.
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公开(公告)号：US09871024B2
公开(公告)日：2018-01-16
申请号：US15451985
申请日：2017-03-07
Inventor： Masumi Abe , Naoki Tagami , Toshiaki Kurachi
CPC classification number: H01L25/0753 , H01L25/50 , H01L27/156 , H01L33/44 , H01L33/504 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2924/181 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0091 , H01L2924/00014 , H01L2924/00012
Abstract: A light-emitting apparatus is provided. The light-emitting apparatus includes a first and second light-emitting elements disposed on a substrate. A sealing layer is above the first and second light-emitting elements for sealing the first and second light-emitting elements. A first phosphor layer is above a first portion of the sealing layer. The first phosphor layer includes at least one first phosphor. A second phosphor layer is above a second portion of the sealing layer. The second phosphor layer includes at least one second phosphor. The first phosphor layer is configured to emit light, which is emitted as a result of emission by the first light-emitting element, having a first color. The second phosphor layer is configured to emit light, which is emitted as a result of emission by the second light-emitting element, having a second color different from the first color.
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Patent Agency Ranking
公开(公告)号：US09799803B2
公开(公告)日：2017-10-24
申请号：US15223713
申请日：2016-07-29
Inventor： Naoki Tagami , Masumi Abe , Hisaki Fujitani , Kosuke Takehara , Toshiaki Kurachi
IPC: H01L33/48
CPC classification number: H01L33/486 , H01L2224/32225 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00
Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers, above the substrate; and an LED element mounted above the resist via an adhesive. The adhesive includes an addition-reaction type silicone resin. In the resist, a higher positioned layer of the plurality of layers is lower in at least one of sulfur content, phosphorus content, and nitrogen content than a lower positioned layer of the plurality of layers.
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公开(公告)号：US09761766B2
公开(公告)日：2017-09-12
申请号：US15013457
申请日：2016-02-02
Inventor： Kosuke Takehara , Hisaki Fujitani , Naoki Tagami
IPC: H01L33/50 , H01L33/56 , H01L33/62 , H01L33/60 , H01L33/20 , H01L33/54 , H01L33/44 , H01L25/075 , H05K1/02
CPC classification number: H01L33/502 , H01L25/0753 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48228 , H01L2224/49107 , H01L2224/73265 , H05K1/0274 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
Abstract: An LED module includes a mount board and an LED chip. The mount board includes: an insulation substrate that includes resin and glass; a first conductor, a second conductor and a third conductor; and a white resist layer. The white resist layer is provided with a first opening, a second opening and at least one third opening for exposing the first conductor, the second conductor and the third conductor, respectively. The LED module further includes a wavelength conversion layer disposed between the LED chip and the third conductor in a thickness direction of the LED chip. The wavelength conversion layer includes phosphor particles that are excited by first light emitted from the LED chip to emit second light having wavelengths greater than wavelengths of the first light.
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公开(公告)号：US10103298B2
公开(公告)日：2018-10-16
申请号：US15223043
申请日：2016-07-29
Inventor： Naoki Tagami , Masumi Abe , Hisaki Fujitani , Kosuke Takehara , Toshiaki Kurachi
Abstract: A light emitting diode (LED) module which includes: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. The plurality of layers includes a second layer that is an uppermost layer and a first layer that is an underlying layer. The second layer that is the uppermost layer includes fluorine as a component.
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公开(公告)号：US10032754B2
公开(公告)日：2018-07-24
申请号：US15819069
申请日：2017-11-21
Inventor： Masumi Abe , Naoki Tagami , Toshiaki Kurachi
Abstract: A method of manufacturing a light-emitting apparatus includes mounting a first light-emitting element and a second light-emitting element on a substrate. A sealing layer is formed above the first light-emitting element and the second light-emitting element for sealing the first light-emitting element and the second light-emitting element. A first phosphor layer is applied above a first portion of the sealing layer, in which the first phosphor layer includes at least one first phosphor. A second phosphor layer is applied above a second portion of the sealing layer, in which the second phosphor layer includes at least one second phosphor.
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公开(公告)号：US09728695B2
公开(公告)日：2017-08-08
申请号：US15012133
申请日：2016-02-01
Inventor： Kosuke Takehara , Hisaki Fujitani , Naoki Tagami , Toshiaki Kurachi
CPC classification number: H01L33/62 , H01L33/50 , H01L33/505 , H01L33/52 , H01L33/60 , H01L2224/45144 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H05K1/0274 , H05K2201/0195 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
Abstract: A mount substrate includes: an insulation substrate containing resin and glass; connection conductors formed on a surface of the insulation substrate; a first white resist layer that covers the connection conductors; and a second white resist layer that covers the first white resist. Each of the connection conductors includes a copper foil and a plating layer partly formed on the copper foil. The plating layer is formed of metal having oxidation-resistant and corrosion-resistant characteristics higher than those of copper. The first white resist layer is formed with first openings that respectively expose the plating layers of the connection conductors. The second white resist layer covers a periphery of each plating layer of the connection conductors in planar view.
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