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公开(公告)号：US5705424A
公开(公告)日：1998-01-06
申请号：US215555
申请日：1994-03-21
IPC分类号： G02F1/136 , G02B27/00 , G02F1/1335 , G02F1/1347 , G02F1/1362 , G02F1/1368 , G09G3/20 , G09G3/30 , G09G3/36 , H01L21/336 , H01L21/77 , H01L21/84 , H01L27/12 , H01L29/786 , H04N5/74 , H01L21/20 , H01L21/22 , H01L21/304 , H01L21/52
CPC分类号： A61B3/113 , G02B27/0093 , G02F1/133526 , G02F1/13454 , G02F1/136277 , G02F1/1368 , G09G3/30 , G09G3/36 , H01L27/1214 , H01L27/1266 , H01L27/156 , H01L29/786 , H01L29/78603 , H01L29/78633 , H01L29/78648 , H04N5/7441 , H04N9/3105 , H04N9/312 , H04N9/3141 , H04N9/3144 , H05B33/12 , G02B2027/0198 , G02F1/133514 , G02F1/133516 , G02F1/13473 , G02F1/136209 , G02F2001/13613 , G02F2202/105 , G02F2203/01 , G09G2300/023 , G09G2300/0809 , G09G2300/0842 , G09G2310/0259 , G09G2320/0233 , G09G2320/041 , G09G2320/043 , G09G2340/0464 , G09G2370/04 , G09G2370/042 , G09G3/2014 , G09G3/3607 , G09G3/3614 , G09G3/3648 , H01L2221/68359 , H01L2221/68363 , H01L29/78612 , H01L29/78618 , H04N5/70 , H04N5/74 , H04N5/7491 , Y10S438/977
摘要： The present invention relates to methods of fabricating pixel electrodes for active matrix displays including the formation of arrays of transistor circuits in thin film silicon on an insulating substrate and transfer of this active matrix circuit onto an optically transmissive substrate. An array of color filter elements can be formed prior to transfer of the active matrix circuit that are aligned between a light source for the display and the array of pixel electrodes to provide a color display.
摘要翻译： 本发明涉及制造用于有源矩阵显示器的像素电极的方法，包括在绝缘衬底上形成薄膜硅中晶体管电路的阵列并将该有源矩阵电路传送到光学透射衬底上。 可以在转移有源矩阵电路之前形成彩色滤光片元件阵列，该有源矩阵电路在用于显示器的光源和像素电极阵列之间对齐以提供彩色显示。
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公开(公告)号：US06608654B2
公开(公告)日：2003-08-19
申请号：US08716409
申请日：1997-03-17
IPC分类号： G02F1136
CPC分类号： H01L27/1266 , G02B27/0093 , G02F1/133514 , G02F1/133516 , G02F1/133526 , G02F1/13454 , G02F1/13473 , G02F1/136209 , G02F1/136277 , G02F1/1368 , G02F2001/13613 , G02F2202/105 , G02F2203/01 , G09G3/2014 , G09G3/30 , G09G3/36 , G09G3/3607 , G09G3/3614 , G09G3/3648 , G09G2300/023 , G09G2300/0809 , G09G2300/0842 , G09G2310/0259 , G09G2320/0233 , G09G2320/041 , G09G2320/043 , G09G2340/0464 , G09G2370/042 , H01L27/1214 , H01L29/78612 , H01L29/78618 , H01L29/78633 , H04N5/7441 , H04N5/7491 , H04N9/3141
摘要： The present invention relates to methods of fabricating pixel electrodes (44) for active matrix displays including the formation of arrays of transistor circuits in thin film silicon (10) on an insulating substrate and transfer of this active matrix circuit onto an optically transmissive substrate (24). An array of color filter elements can be formed prior to transfer of the active matrix circuit that are aligned between a light source for the display and the array of pixel electrodes to provide a color display.
摘要翻译： 本发明涉及制造用于有源矩阵显示器的像素电极（44）的方法，包括在绝缘衬底上形成薄膜硅（10）中的晶体管电路阵列，并将该有源矩阵电路转移到光学透射衬底（24 ）。 可以在转移有源矩阵电路之前形成彩色滤光片元件阵列，该有源矩阵电路在用于显示器的光源和像素电极阵列之间对齐以提供彩色显示。
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3.发明授权
公开(公告)号：US5258325A
公开(公告)日：1993-11-02
申请号：US834849
申请日：1992-02-13
申请人： Mark B. Spitzer , Jack P. Salerno , Jeffrey Jacobsen , Brenda Dingle , Duy-Phach Vu , Paul M. Zavracky
发明人： Mark B. Spitzer , Jack P. Salerno , Jeffrey Jacobsen , Brenda Dingle , Duy-Phach Vu , Paul M. Zavracky
IPC分类号： A61B3/113 , G02B5/30 , G02B27/00 , G02B27/01 , G02F1/1333 , G02F1/1335 , G02F1/1347 , G02F1/136 , G02F1/1362 , G09G3/30 , G09G3/32 , G09G3/36 , H01L21/77 , H01L21/822 , H01L21/84 , H01L21/98 , H01L25/075 , H01L25/10 , H01L27/06 , H01L27/12 , H01L27/15 , H01L29/786 , H01L33/00 , H01S5/02 , H01S5/42 , H04N5/70 , H04N5/74 , H05B33/12 , H01L21/20 , H01L21/22 , H01L21/304 , H01L21/52
CPC分类号： A61B3/113 , G02B27/0093 , G02B27/0172 , G02F1/13454 , G02F1/136209 , G09G3/30 , G09G3/36 , H01L21/8221 , H01L24/96 , H01L25/0756 , H01L25/10 , H01L25/50 , H01L27/0688 , H01L27/1214 , H01L27/156 , H01L29/786 , H01L29/78603 , H01L29/78648 , H04N5/7441 , H04N9/3141 , H05B33/12 , G02B2027/0132 , G02B2027/0138 , G02B2027/0187 , G02B2027/0198 , G02B5/30 , G02F1/13336 , G02F2001/13613 , G09G2300/023 , G09G2300/0809 , G09G2300/0842 , G09G2320/0233 , G09G2320/041 , G09G2320/043 , G09G2340/0464 , G09G2370/042 , G09G3/32 , G09G3/3607 , G09G3/3614 , G09G3/3648 , H01L2221/68359 , H01L2221/68363 , H01L2221/68368 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01065 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/12042 , H01L2924/13091 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H01L2924/3511 , H01S5/0217 , H01S5/423 , H04N5/70 , H04N5/7491 , Y10T29/41
摘要： The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of high density and complexity. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in modules.
摘要翻译： 本发明涉及将产生高密度和复杂性的集成电子电路的设备处理，封装和互连。 过程包括使用传输，互连和封装的硅薄膜的电路板在共同的模块衬底上形成复杂的多功能电路。 使用与极高密度和复杂性相兼容的集成传输/互连处理的电路模块提供具有板载驱动器和模块逻辑的大面积有源矩阵显示器。
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公开(公告)号：US5539550A
公开(公告)日：1996-07-23
申请号：US119292
申请日：1993-09-09
申请人： Mark B. Spitzer , Jack P. Salerno , Jeffrey Jacobsen , Brenda Dingle , Duy-Phach Vu , Paul M. Zavracky
发明人： Mark B. Spitzer , Jack P. Salerno , Jeffrey Jacobsen , Brenda Dingle , Duy-Phach Vu , Paul M. Zavracky
IPC分类号： A61B3/113 , G02B5/30 , G02B27/00 , G02B27/01 , G02F1/1333 , G02F1/1335 , G02F1/1347 , G02F1/136 , G02F1/1362 , G09G3/30 , G09G3/32 , G09G3/36 , H01L21/77 , H01L21/822 , H01L21/84 , H01L21/98 , H01L25/075 , H01L25/10 , H01L27/06 , H01L27/12 , H01L27/15 , H01L29/786 , H01L33/00 , H01S5/02 , H01S5/42 , H04N5/70 , H04N5/74 , H05B33/12
CPC分类号： A61B3/113 , G02B27/0093 , G02B27/0172 , G02F1/13454 , G02F1/136209 , G09G3/30 , G09G3/36 , H01L21/8221 , H01L24/96 , H01L25/0756 , H01L25/10 , H01L25/50 , H01L27/0688 , H01L27/1214 , H01L27/156 , H01L29/786 , H01L29/78603 , H01L29/78648 , H04N5/7441 , H04N9/3141 , H05B33/12 , G02B2027/0132 , G02B2027/0138 , G02B2027/0187 , G02B2027/0198 , G02B5/30 , G02F1/13336 , G02F2001/13613 , G09G2300/023 , G09G2300/0809 , G09G2300/0842 , G09G2320/0233 , G09G2320/041 , G09G2320/043 , G09G2340/0464 , G09G2370/042 , G09G3/32 , G09G3/3607 , G09G3/3614 , G09G3/3648 , H01L2221/68359 , H01L2221/68363 , H01L2221/68368 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01065 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/12042 , H01L2924/13091 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H01L2924/3511 , H01S5/0217 , H01S5/423 , H04N5/70 , H04N5/7491 , Y10T29/41
摘要： Circuit modules including complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. The modules include integrated transfer/interconnects with extremely high density and complexity with large-area active-matrix liquid crystal displays and on-board drivers and logic in glass-based modules.
摘要翻译： 电路模块包括使用传输，互连和封装的硅薄膜电路板的公共模块基板上的复杂多功能电路。 这些模块包括具有极高密度和复杂性的集成传输/互连，大面积有源矩阵液晶显示器和板载驱动器以及基于玻璃的模块中的逻辑。
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公开(公告)号：US5976953A
公开(公告)日：1999-11-02
申请号：US986998
申请日：1997-12-08
IPC分类号： H01L21/822 , H01L21/98 , H01L23/498 , H01L25/065 , H01L25/18 , H01L27/00 , H01L27/04 , H01L27/10
CPC分类号： H01L25/50 , H01L23/49833 , H01L24/24 , H01L24/82 , H01L25/0657 , H01L25/18 , H01L2224/16145 , H01L2224/24225 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01061 , H01L2924/01072 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , Y10S148/164
摘要： A multi-layered structure is fabricated in which a microprocessor is configured in different layers and interconnected vertically through insulating layers which separate each circuit layer of the structure. Each circuit layer can be fabricated in a separate wafer or thin film material and then transferred onto the layered structure and interconnected.
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公开(公告)号：US5793115A
公开(公告)日：1998-08-11
申请号：US315027
申请日：1994-09-29
IPC分类号： H01L21/822 , H01L21/98 , H01L23/498 , H01L25/065 , H01L25/18 , H01L27/00 , H01L27/04 , H01L27/10 , H01L23/48 , H01L21/18 , H01L23/52
CPC分类号： H01L25/50 , H01L23/49833 , H01L24/24 , H01L24/82 , H01L25/0657 , H01L25/18 , H01L2224/16145 , H01L2224/24225 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01061 , H01L2924/01072 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , Y10S148/164
摘要： A multi-layered structure is fabricated in which a microprocessor is configured in different layers and interconnected vertically through insulating layers which separate each circuit layer of the structure. Each circuit layer can be fabricated in a separate wafer or thin film material and then transferred onto the layered structure and interconnected.
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7.发明授权Method for forming three dimensional processor using transferred thin film circuits 失效使用转移薄膜电路形成三维处理器的方法
公开(公告)号：US5656548A
公开(公告)日：1997-08-12
申请号：US531177
申请日：1995-09-19
IPC分类号： H01L21/822 , H01L21/98 , H01L23/498 , H01L25/065 , H01L25/18 , H01L27/00 , H01L27/04 , H01L27/10 , H01L21/18
CPC分类号： H01L25/50 , H01L23/49833 , H01L24/24 , H01L24/82 , H01L25/0657 , H01L25/18 , H01L2224/16145 , H01L2224/24225 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01061 , H01L2924/01072 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , Y10S148/164
摘要： A multi-layered structure is fabricated in which a microprocessor is configured in different layers and interconnected vertically through insulating layers which separate each circuit layer of the structure. Each circuit layer can be fabricated in a separate wafer or thin film material and then transferred onto the layered structure and interconnected.
摘要翻译： 制造多层结构，其中微处理器被配置在不同的层中，并且通过隔离结构的每个电路层的绝缘层垂直互连。 每个电路层可以制造在单独的晶片或薄膜材料中，然后转移到分层结构上并互连。
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公开(公告)号：US06624046B1
公开(公告)日：2003-09-23
申请号：US09430968
申请日：1999-11-01
IPC分类号： H01L2146
CPC分类号： H01L25/50 , H01L23/49833 , H01L24/24 , H01L24/82 , H01L25/0657 , H01L25/18 , H01L2224/16145 , H01L2224/24225 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01061 , H01L2924/01072 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , Y10S148/164 , H01L2924/00
摘要： A multi-layered structure is fabricated in which a microprocessor is configured in different layers and interconnected vertically through insulating layers which separate each circuit layer of the structure. Each circuit layer can be fabricated in a separate wafer or thin film material and then transferred onto the layered structure and interconnected.
摘要翻译： 制造多层结构，其中微处理器被配置在不同的层中，并且通过隔离结构的每个电路层的绝缘层垂直互连。 每个电路层可以制造在单独的晶片或薄膜材料中，然后转移到分层结构上并互连。
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公开(公告)号：US5317236A
公开(公告)日：1994-05-31
申请号：US815684
申请日：1991-12-31
申请人： Paul M. Zavracky , John C. C. Fan , Robert McClelland , Jeffrey Jacobsen , Brenda Dingle , Mark B. Spitzer
发明人： Paul M. Zavracky , John C. C. Fan , Robert McClelland , Jeffrey Jacobsen , Brenda Dingle , Mark B. Spitzer
IPC分类号： G02F1/136 , A61B3/113 , G02B5/30 , G02B27/00 , G02B27/01 , G02F1/1333 , G02F1/1335 , G02F1/1345 , G02F1/1347 , G02F1/1362 , G02F1/1368 , G09G3/30 , G09G3/36 , H01L21/336 , H01L21/77 , H01L21/822 , H01L21/84 , H01L25/075 , H01L27/06 , H01L27/12 , H01L27/15 , H01L29/786 , H01L33/00 , H01L33/40 , H01S5/02 , H01S5/42 , H04N5/70 , H04N5/74 , H05B33/12 , H01J9/00
CPC分类号： H01L27/1266 , A61B3/113 , G02B27/0093 , G02B27/017 , G02B27/0172 , G02F1/133526 , G02F1/13454 , G02F1/136209 , G02F1/136277 , G09G3/30 , G09G3/36 , H01L21/8221 , H01L25/0756 , H01L27/0688 , H01L27/1214 , H01L27/156 , H01L29/66772 , H01L29/786 , H01L29/78603 , H01L29/78648 , H01L29/78654 , H01L33/0062 , H04N5/7441 , H04N9/3141 , H05B33/12 , G02B2027/0132 , G02B2027/0138 , G02B2027/0187 , G02B2027/0198 , G02B5/30 , G02F1/13336 , G02F1/13473 , G02F2001/13613 , G02F2202/105 , G09G2300/023 , G09G2300/0809 , G09G2300/0842 , G09G2320/0233 , G09G2320/041 , G09G2320/043 , G09G2340/0464 , G09G2370/042 , G09G3/3607 , G09G3/3614 , G09G3/3648 , H01L2221/6835 , H01L2221/68359 , H01L2221/68363 , H01L2924/00011 , H01L2924/0002 , H01L2924/09701 , H01L33/405 , H01S5/0217 , H01S5/423 , H04N5/70 , H04N5/7491 , Y10S148/135
摘要： A display panel is formed using a single crystal thin-film material that may be transferred to substrates for display fabrication. Pixel arrays form light valves or switches that can be fabricated with control electronics in the thin-film material prior to transfer. The resulting circuit panel is then incorporated into a display panel with a light emitting or liquid crystal material to provide the desired display.
摘要翻译： 使用可以转移到显示器制造用基板的单晶薄膜材料形成显示面板。 像素阵列形成光阀或开关，可以在传输之前用薄膜材料中的控制电子元件制造。 所得到的电路板然后被结合到具有发光或液晶材料的显示面板中以提供期望的显示。
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10.发明授权Single crystal silicon arrayed devices with optical shield between transistor and substrate 失效在晶体管和衬底之间具有光学屏蔽的单晶硅阵列器件公开(公告)号：US06317175B1
公开(公告)日：2001-11-13
申请号：US08471575
申请日：1995-06-06
IPC分类号： G02F11343
CPC分类号： H01L27/1266 , A61B3/113 , G02B5/30 , G02B27/0093 , G02B27/017 , G02B27/0172 , G02B2027/0132 , G02B2027/0138 , G02B2027/0187 , G02B2027/0198 , G02F2001/13613 , G03B21/10 , G03B21/28 , G03B33/12 , G03B37/04 , G09G3/30 , G09G3/36 , G09G3/3607 , G09G3/3614 , G09G3/3648 , G09G2300/023 , G09G2300/0809 , G09G2300/0842 , G09G2320/0233 , G09G2320/041 , G09G2320/043 , G09G2340/0464 , G09G2370/042 , H01L21/8221 , H01L25/0756 , H01L25/50 , H01L27/0688 , H01L27/1214 , H01L27/1274 , H01L27/156 , H01L29/786 , H01L29/78603 , H01L29/78648 , H01L33/0062 , H01L2221/68359 , H01L2221/68363 , H01L2924/0002 , H01L2924/09701 , H01S5/423 , H04N5/70 , H04N5/74 , H04N5/7441 , H04N5/7491 , H04N9/3108 , H04N9/312 , H04N9/3141 , H04N9/3173 , H05B33/12 , H01L2924/00
摘要： A display panel is formed using a single crystal thin-film transistors that are transferred to substrates for display fabrication. Pixel arrays form light valves or switches that can be fabricated with control electronics in the thin-film material prior to transfer. The resulting circuit panel is then incorporated into a projection display system with a light emitting or liquid crystal material to provide the desired light valve.
摘要翻译： 使用转印到用于显示制造的基板的单晶薄膜晶体管形成显示面板。 像素阵列形成光阀或开关，可以在传输之前用薄膜材料中的控制电子元件制造。 所得到的电路板然后被结合到具有发光或液晶材料的投影显示系统中以提供所需的光阀。
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