CONDUCTIVE OXIDE RANDOM ACCESS MEMORY (CORAM) CELL AND METHOD OF FABRICATING SAME
    4.
    发明申请
    CONDUCTIVE OXIDE RANDOM ACCESS MEMORY (CORAM) CELL AND METHOD OF FABRICATING SAME 有权
    导电氧化物随机存取存储器(CORAM)单元及其制造方法

    公开(公告)号:US20140374689A1

    公开(公告)日:2014-12-25

    申请号:US13925951

    申请日:2013-06-25

    IPC分类号: H01L45/00 H01L27/24

    摘要: Conductive oxide random access memory (CORAM) cells and methods of fabricating CORAM cells are described. For example, a material layer stack for a memory element includes a first conductive electrode. An insulating layer is disposed on the first conductive oxide and has an opening with sidewalls therein that exposes a portion of the first conductive electrode. A conductive oxide layer is disposed in the opening, on the first conductive electrode and along the sidewalls of the opening. A second electrode is disposed in the opening, on the conductive oxide layer.

    摘要翻译: 描述了导电氧化物随机存取存储器(CORAM)单元和制造CORAM单元的方法。 例如,用于存储元件的材料层堆叠包括第一导电电极。 绝缘层设置在第一导电氧化物上并且具有露出第一导电电极的一部分的侧壁的开口。 导电氧化物层设置在开口中,在第一导电电极上并且沿着开口的侧壁。 第二电极设置在开口中,在导电氧化物层上。

    Conductive oxide random access memory (CORAM) cell and method of fabricating same
    7.
    发明授权
    Conductive oxide random access memory (CORAM) cell and method of fabricating same 有权
    导电氧化物随机存取存储器(CORAM)单元及其制造方法

    公开(公告)号:US09548449B2

    公开(公告)日:2017-01-17

    申请号:US13925951

    申请日:2013-06-25

    IPC分类号: H01L45/00 H01L27/24

    摘要: Conductive oxide random access memory (CORAM) cells and methods of fabricating CORAM cells are described. For example, a material layer stack for a memory element includes a first conductive electrode. An insulating layer is disposed on the first conductive oxide and has an opening with sidewalls therein that exposes a portion of the first conductive electrode. A conductive oxide layer is disposed in the opening, on the first conductive electrode and along the sidewalls of the opening. A second electrode is disposed in the opening, on the conductive oxide layer.

    摘要翻译: 描述了导电氧化物随机存取存储器(CORAM)单元和制造CORAM单元的方法。 例如,用于存储元件的材料层堆叠包括第一导电电极。 绝缘层设置在第一导电氧化物上并且具有露出第一导电电极的一部分的侧壁的开口。 导电氧化物层设置在开口中,在第一导电电极上并且沿着开口的侧壁。 第二电极设置在开口中,在导电氧化物层上。