公开(公告)号：US20050255714A1

公开(公告)日：2005-11-17

申请号：US11152501

申请日：2005-06-14

申请人： R. Iyer ,  Sean Seutter ,  Sanjeev Tandon ,  Errol Sanchez ,  Shulin Wang

发明人： R. Iyer ,  Sean Seutter ,  Sanjeev Tandon ,  Errol Sanchez ,  Shulin Wang

IPC分类号： C23C16/34 ,  H01L21/31 ,  H01L21/318

CPC分类号： H01L21/0217 ,  C23C16/345 ,  H01L21/02208 ,  H01L21/02271 ,  H01L21/3185

摘要： Embodiments of the invention generally provide a method for depositing a film containing silicon (Si) and nitrogen (N). In one embodiment, the method includes heating a substrate disposed in a processing chamber to a temperature less than about 650 degrees Celsius, flowing a nitrogen-containing gas into the processing chamber, flowing a silicon-containing gas into the processing chamber, and depositing a SiN-containing layer on a substrate. The silicon-containing gas is at least one of a gas identified as NR2—Si(R′2)—Si(R′2)—NR2 (amino(di)silanes), R3—Si—N═N═N (silyl azides), R′3—Si—NR—NR2 (silyl hydrazines) or 1,3,4,5,7,8-hexamethytetrasiliazane, wherein R and R′ comprise at least one functional group selected from the group of a halogen, an organic group having one or more double bonds, an organic group having one or more triple bonds, an aliphatic alkyl group, a cyclical alkyl group, an aromatic group, an organosilicon group, an alkyamino group, or a cyclic group containing N or Si.

摘要翻译： 本发明的实施方案通常提供一种沉积含有硅（Si）和氮（N）的膜的方法。 在一个实施例中，该方法包括将设置在处理室中的基板加热至低于约650摄氏度的温度，使含氮气体流入处理室，使含硅气体流入处理室，并将 衬底上的含SiN层。 含硅气体是被鉴定为NR 2 -Si（R'2）-Si（R'2）-Si（R'2）-Si ）-NR 2（氨基（二）硅烷），R 3 -Si-NNN（甲硅烷基叠氮化物），R'3 -Si- NR-NR 2（甲硅烷基肼）或1,3,4,5,7,8-六甲基四硅氮烷，其中R和R'包含至少一个选自以下的官能团：卤素， 具有一个或多个双键的有机基团，具有一个或多个三键的有机基团，脂肪族烷基，环状烷基，芳族基团，有机硅基团，烷基氨基或含有N或Si的环状基团。

公开(公告)号：US20060286818A1

公开(公告)日：2006-12-21

申请号：US11155646

申请日：2005-06-17

申请人： Yaxin Wang ,  Yuji Maeda ,  Thomas Mele ,  Sean Seutter ,  Sanjeev Tandon ,  R. Iyer

发明人： Yaxin Wang ,  Yuji Maeda ,  Thomas Mele ,  Sean Seutter ,  Sanjeev Tandon ,  R. Iyer

IPC分类号： H01L21/471

CPC分类号： H01L21/3185 ,  C23C16/345 ,  C23C16/45525 ,  C23C16/45553 ,  H01L29/6656 ,  H01L29/6659 ,  H01L29/66628 ,  H01L29/7834

摘要： Embodiments of the invention generally provide a method for depositing silicon-containing films. In one embodiment, a method for depositing silicon-containing material film on a substrate includes flowing a nitrogen and carbon containing chemical into a deposition chamber, flowing a silicon-containing source chemical having silicon-nitrogen bonds into the processing chamber, and heating the substrate disposed in the chamber to a temperature less than about 550 degrees Celsius. In another embodiment, the silicon containing chemical is trisilylamine and the nitrogen and carbon containing chemical is (CH3)3—N.

摘要翻译： 本发明的实施方案通常提供一种沉积含硅膜的方法。 在一个实施例中，将含​​硅材料膜沉积在基板上的方法包括将含氮和碳的化学品流入沉积室，将含有硅 - 氮键的含硅源化学品流入处理室，并加热基板 置于室内至低于约550摄氏度的温度。 在另一个实施方案中，含硅化学品是三甲基胺，含氮和碳的化学品是（CH 3 3）3 -N。

公开(公告)号：US20060009041A1

公开(公告)日：2006-01-12

申请号：US10885969

申请日：2004-07-06

申请人： R. Iyer ,  Andrew Lam ,  Yuji Maeda ,  Thomas Mele ,  Faran Nouri ,  Jacob Smith ,  Sean Seutter ,  Sanjeev Tandon ,  Randhir Singh Thakur ,  Sunderraj Thirupapuliyur

发明人： R. Iyer ,  Andrew Lam ,  Yuji Maeda ,  Thomas Mele ,  Faran Nouri ,  Jacob Smith ,  Sean Seutter ,  Sanjeev Tandon ,  Randhir Singh Thakur ,  Sunderraj Thirupapuliyur

IPC分类号： H01L21/302

CPC分类号： H01L21/324 ,  H01L29/1054 ,  H01L29/6656 ,  H01L29/7842 ,  H01L29/7843

摘要： An assembly comprises a multilayer nitride stack having nitride etch stop layers formed on top of one another, each of the nitride etch stop layers is formed using a film forming process. A method of making the multilayer nitride stack includes placing a substrate in a single wafer deposition chamber and thermally shocking the substrate momentarily prior to deposition. A first nitride etch stop layer is deposited over the substrate. A second nitride etch stop layer is deposited over the first nitride etch stop layer.

公开(公告)号：US20050109276A1

公开(公告)日：2005-05-26

申请号：US10911208

申请日：2004-08-04

申请人： R. Iyer ,  Sean Seutter ,  Jacob Smith ,  Gregory Dibello ,  Alexander Tam ,  Binh Tran ,  Sanjeev Tandon

发明人： R. Iyer ,  Sean Seutter ,  Jacob Smith ,  Gregory Dibello ,  Alexander Tam ,  Binh Tran ,  Sanjeev Tandon

IPC分类号： C23C16/00 ,  C23C16/34 ,  C23C16/44 ,  C23C16/455

CPC分类号： C23C16/4557 ,  C23C16/345 ,  C23C16/4412 ,  C23C16/45565

摘要： A method and apparatus for a CVD chamber that provides uniform heat distribution, efficient precursor delivery, uniform distribution of process and inert chemicals, and thermal management of residues in the chamber and exhaust surfaces by changing the mechanical design of a single wafer thermal CVD chamber. The improvements include a processing chamber comprising a chamber body and a chamber lid defining a processing region, a substrate support disposed in the processing region, a gas delivery system mounted on the chamber lid, the gas delivery system comprising a lid, an adapter ring and two blocker plates that define a gas mixing region, and a face plate fastened to the adapter ring, a heating element positioned to heat the adapter ring to a desired temperature, and a temperature controlled exhaust system. The improvements also include a method for depositing a silicon nitride layer on a substrate, comprising vaporizing bis(tertiary-butylamino) silane, flowing the bis(tertiary-butylamino) silane into a processing chamber, flowing ammonia into a processing chamber, combining the two reactants in a mixer in the chamber lid, having an additional mixing region defined by an adapter ring and at least two blocker plates, heating the adapter ring, flowing the bis(tertiary-butylamino) silane through a gas distribution plate into a processing region above a substrate. The improvements reduce defects across the surface of the substrate and improve product yield.

摘要翻译： 一种用于CVD室的方法和装置，其通过改变单个晶片热CVD室的机械设计来提供均匀的热分布，有效的前体输送，工艺和惰性化学品的均匀分布，以及腔室和排气表面中残留物的热管理。 该改进包括一个处理室，该处理室包括一个室主体和一个限定处理区域的室盖，设置在处理区域中的基板支撑件，安装在室盖上的气体输送系统，气体输送系统包括盖子，适配器环和 限定气体混合区域的两个阻挡板和紧固到接合环的面板，定位成将接合环加热到所需温度的加热元件和温度控制的排气系统。 该改进还包括在基底上沉积氮化硅层的方法，包括将双（叔丁基氨基）硅烷蒸发，将双（叔丁基氨基）硅烷流入处理室，将氨流入处理室，将两 在室盖中的混合器中的反应物，具有由适配环和至少两个阻挡板限定的附加混合区域，加热适配环，使双（叔丁基氨基）硅烷通过气体分布板流入上述加工区域 底物。 这些改进减少了衬底表面的缺陷并提高了产品的产率。

公开(公告)号：US20070082507A1

公开(公告)日：2007-04-12

申请号：US11245373

申请日：2005-10-06

申请人： R. Iyer ,  Jacob Smith ,  Sean Seutter ,  Kangzhan Zhang ,  Alexander Tam ,  Kevin Cunningham ,  Phani Ramachandran

发明人： R. Iyer ,  Jacob Smith ,  Sean Seutter ,  Kangzhan Zhang ,  Alexander Tam ,  Kevin Cunningham ,  Phani Ramachandran

IPC分类号： H01L21/00

CPC分类号： C23C16/45565 ,  C23C16/345 ,  C23C16/4412 ,  C23C16/4557

摘要： A method and apparatus for low temperature deposition of doped silicon nitride films is disclosed. The improvements include a mechanical design for a CVD chamber that provides uniform heat distribution for low temperature processing and uniform distribution of process chemicals, and methods for depositing at least one layer comprising silicon and nitrogen on a substrate by heating a substrate, flowing a silicon containing precursor into a processing chamber having a mixing region defined by an adaptor ring and one or more blocker plates and an exhaust system heating the adapter ring and a portion of the exhaust system, flowing one or more of a hydrogen, germanium, boron, or carbon containing precursor into the processing chamber, and optionally flowing a nitrogen containing precursor into the processing chamber.

摘要翻译： 公开了一种用于低温沉积掺杂氮化硅膜的方法和装置。 这些改进包括用于CVD室的机械设计，其提供用于低温处理的均匀热分布和工艺化学品的均匀分布，以及用于通过加热衬底在衬底上沉积包含硅和氮的至少一层的方法，使含硅 前体进入具有由适配环和一个或多个阻断板限定的混合区域的处理室，以及加热接合环和排气系统的一部分，排出氢，锗，硼或碳的一部分的排气系统 并且可选地将含氮前体流入处理室。

公开(公告)号：US20070125762A1

公开(公告)日：2007-06-07

申请号：US11293626

申请日：2005-12-01

申请人： Anqing Cui ,  Binh Tran ,  Alexander Tam ,  Jacob Smith ,  R. Iyer ,  Joseph Yudovsky ,  Sean Seutter

发明人： Anqing Cui ,  Binh Tran ,  Alexander Tam ,  Jacob Smith ,  R. Iyer ,  Joseph Yudovsky ,  Sean Seutter

IPC分类号： H05B3/68

CPC分类号： H01L21/67103

摘要： Apparatus, reactors, and methods for heating substrates are disclosed. The apparatus comprises a stage comprising a body and a surface having an area to support a substrate, a shaft coupled to the stage, a first heating element disposed within a central region of the body of the stage, and at least second and third heating elements disposed within the body of the stage, the at least second and third heating elements each partially surrounding the first heating element and wherein the at least second and third heating elements are circumferentially adjacent to each other.

摘要翻译： 公开了用于加热基底的装置，反应器和方法。 该装置包括一个舞台，包括主体和具有支撑衬底的区域的表面，耦合到舞台的轴，设置在舞台的身体的中心区域内的第一加热元件，以及至少第二和第三加热元件 设置在所述台体内，所述至少第二和第三加热元件各自部分地围绕所述第一加热元件，并且其中所述至少第二和第三加热元件彼此周向相邻。

公开(公告)号：US20060102076A1

公开(公告)日：2006-05-18

申请号：US11245758

申请日：2005-10-07

申请人： Jacob Smith ,  Sean Seutter ,  R. Iyer ,  Binh Tran ,  Alexander Tam ,  James Wilson

发明人： Jacob Smith ,  Sean Seutter ,  R. Iyer ,  Binh Tran ,  Alexander Tam ,  James Wilson

IPC分类号： C23C16/00

CPC分类号： C23C16/4557 ,  C23C16/345 ,  C23C16/4412 ,  C23C16/45565

摘要： A method and apparatus for a chemical vapor deposition (CVD) chamber provides uniform heat distribution, uniform distribution of process chemicals in the CVD chamber, and minimization of by-product and condensate residue in the chamber. The improvements include a processing chamber comprising a chamber body, a base, and a chamber lid defining a processing region, a substrate support disposed in the processing region, a gas delivery system mounted on a chamber lid, the gas delivery system comprising an adapter ring and two blocker plates that define a gas mixing region, and a face plate fastened to the adapter ring, an exhaust system mounted at the base, a heating element positioned to heat the adapter ring; and a heating element positioned to heat a portion of the exhaust system.

摘要翻译： 用于化学气相沉积（CVD）室的方法和装置提供均匀的热分布，CVD室中的工艺化学品的均匀分布，以及室中的副产物和冷凝物残留物的最小化。 该改进包括一个处理室，它包括一个室主体，一个基座和一个限定一个处理区域的室盖，一个位于处理区域中的基板支架，一个安装在室盖上的气体输送系统，该气体输送系统包括一个适配环 以及限定气体混合区域的两个阻挡板，以及紧固到所述适配环的面板，安装在所述基座处的排气系统，定位成加热所述适配环的加热元件; 以及加热元件，其定位成加热排气系统的一部分。

公开(公告)号：US20060286820A1

公开(公告)日：2006-12-21

申请号：US11157567

申请日：2005-06-21

申请人： Kaushal Singh ,  Sean Seutter ,  Jacob Smith ,  R. Iyer ,  Steve Ghanayem ,  Adam Brailove ,  Robert Shydo ,  Jeannot Morin

发明人： Kaushal Singh ,  Sean Seutter ,  Jacob Smith ,  R. Iyer ,  Steve Ghanayem ,  Adam Brailove ,  Robert Shydo ,  Jeannot Morin

IPC分类号： H01L21/31

CPC分类号： H01L21/0217 ,  C23C16/0227 ,  C23C16/345 ,  C23C16/45519 ,  C23C16/45591 ,  C23C16/482 ,  C23C16/488 ,  C23C16/52 ,  H01L21/0228 ,  H01L21/3185

摘要： Embodiments of the invention generally provide a method for depositing films using photoexcitation. The photoexcitation may be utilized for at least one of treating the substrate prior to deposition, treating substrate and/or gases during deposition, treating a deposited film, or for enhancing chamber cleaning. In one embodiment, a method for depositing silicon and nitrogen-containing film on a substrate includes heating a substrate disposed in a processing chamber, generating a beam of energy of between about 1 to about 10 eV, transferring the energy to a surface of the substrate; flowing a nitrogen-containing chemical into the processing chamber, flowing a silicon-containing chemical with silicon-nitrogen bonds into the processing chamber, and depositing a silicon and nitrogen-containing film on the substrate.

公开(公告)号：US20070087575A1

公开(公告)日：2007-04-19

申请号：US11253229

申请日：2005-10-17

申请人： R. Iyer ,  Sanjeev Tandon

发明人： R. Iyer ,  Sanjeev Tandon

IPC分类号： H01L21/31 ,  H01L21/469

CPC分类号： H01L21/3185 ,  H01L21/0214 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/022 ,  H01L21/02271 ,  H01L21/3144 ,  H01L21/3145 ,  H01L21/31612 ,  H01L29/6656

摘要： Embodiments of methods for fabricating a spacer structure on a semiconductor substrate are provided herein. In one embodiment, a method for fabricating a spacer structure on a semiconductor substrate includes providing a substrate containing a base structure over which the spacer structure is to be formed. The spacer structure may be formed over the base structure by depositing a first layer comprising silicon nitride on the base structure, depositing a second layer comprising a silicon-based dielectric material on the first layer, and depositing a third layer comprising silicon nitride on the second layer. The first, second, and third layers are deposited in a single processing reactor.

公开(公告)号：US20070111538A1

公开(公告)日：2007-05-17

申请号：US11273380

申请日：2005-11-12

申请人： R. Iyer ,  Sanjeev Tandon ,  Kangzhan Zhang ,  Rubi Lapena ,  Yuji Maeda

发明人： R. Iyer ,  Sanjeev Tandon ,  Kangzhan Zhang ,  Rubi Lapena ,  Yuji Maeda

IPC分类号： H01L21/31

CPC分类号： H01L21/3081 ,  C23C16/345 ,  H01L21/0214 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/022 ,  H01L21/02271 ,  H01L21/31612 ,  H01L21/3185

摘要： Embodiments of methods for fabricating a silicon nitride stack on a semiconductor substrate are provided herein. In one embodiment, a method for fabricating a silicon nitride stack on a semiconductor substrate includes depositing a base layer comprising silicon nitride on the substrate using a first set of process conditions that selectively control the stress of the base layer; and depositing an upper layer comprising silicon nitride using a second set of process conditions that selectively control at least one of an oxidation resistance and a refractive index of the upper layer.

摘要翻译： 本文提供了在半导体衬底上制造氮化硅叠层的方法的实施例。 在一个实施例中，在半导体衬底上制造氮化硅堆叠的方法包括：使用选择性地控制基底层的应力的第一组工艺条件，在衬底上沉积包括氮化硅的基底层; 以及使用选择性地控制上层的抗氧化性和折射率中的至少一种的第二组工艺条件沉积包括氮化硅的上层。