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公开(公告)号：US08299371B2
公开(公告)日：2012-10-30
申请号：US12972700
申请日：2010-12-20
IPC分类号： H05K1/11
CPC分类号： H05K3/462 , H05K1/162 , H05K1/167 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4623 , H05K2203/063 , Y10T29/49099 , Y10T29/49126 , Y10T29/49165
摘要： A circuitized substrate and method of making same in which quantities of thru-holes are formed within a dielectric interposer layer. The substrate includes two printed circuit board (PCB) layers bonded to opposing sides of the interposer with electrically conductive features of each PCB aligned with the interposer thru-holes. Resistive paste is positioned on the conductive features located adjacent the thru-holes to form controlled electrically resistive connections between conductive features of the two PCBs. A circuitized substrate assembly and method of making same are also disclosed.
摘要翻译： 电路基板及其制造方法，其中在电介质中介层内形成有通孔数量。 基板包括两个印刷电路板（PCB）层，其结合到插入件的相对侧，每个PCB的导电特征与插入件通孔对准。 电阻浆料位于邻近通孔的导电特征上，以在两个PCB的导电特征之间形成受控的电阻连接。 还公开了电路化基板组件及其制造方法。
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公开(公告)号：US08558374B2
公开(公告)日：2013-10-15
申请号：US13022654
申请日：2011-02-08
CPC分类号： H05K7/1061 , H01L23/473 , H01L23/49833 , H01L23/5389 , H01L2924/0002 , H05K1/0203 , H05K2201/10378 , H01L2924/00
摘要： An electronic package with two circuitized substrates which sandwich an interposer therebetween, the interposer electrically interconnecting the substrates while including at least one electrical component (e.g., a power module) substantially therein to provide even further operational capabilities for the resulting package.
摘要翻译： 具有夹在其间的插入件的两个电路化基板的电子封装件，所述插入器将基板电气互连，同时包括至少一个电气部件（例如，功率模块），其基本上在其中，以为所得到的封装提供甚至进一步的操作能力。
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公开(公告)号：US08288857B2
公开(公告)日：2012-10-16
申请号：US12884421
申请日：2010-09-17
CPC分类号： H01L23/42 , H01L23/573 , H01L24/13 , H01L24/16 , H01L24/29 , H01L2224/13101 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29369 , H01L2224/29387 , H01L2224/29393 , H01L2224/73204 , H01L2224/73253 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2924/00014
摘要： A tamper-resistant microchip package contains fluid- or nanofluid-filled capsules, channels, or reservoirs, wherein the fluids, either alone or in combination, can destroy circuitry by etching, sintering, or thermally destructing when reverse engineering of the device is attempted. The fluids are released when the fluid-filled cavities are cut away for detailed inspection of the microchip. Nanofluids may be used for the sintering process, and also to increase the thermal conductivity of the fluid for die thermal management. Through-vias and micro vias may be incorporated into the design to increase circuitry destruction efficacy by improving fluid/chip contact. Thermal interface materials may also be utilized to facilitate chip cooling.
摘要翻译： 防篡改微芯片封装包含流体或纳米流体填充的胶囊，通道或储存器，其中单独或组合的流体可以在尝试逆向工程化时通过蚀刻，烧结或热破坏来破坏电路。 当流体填充的空腔被切掉以便对微芯片进行详细检查时，释放流体。 可以将纳米流体用于烧结过程，并且还可以增加用于管芯热管理的流体的热导率。 通孔和微通孔可以并入设计中以通过改善流体/芯片接触来增加电路破坏功效。 也可以使用热界面材料来促进芯片冷却。
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4.发明授权Method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner 失效以连续的方式制造具有光可成像电介质层的电路化基板的方法公开(公告)号：US07977034B1
公开(公告)日：2011-07-12
申请号：US12657394
申请日：2010-01-20
CPC分类号： H05K3/4641 , H05K3/064 , H05K3/4069 , H05K3/427 , H05K3/44 , H05K3/445 , H05K3/462 , H05K2201/0355 , H05K2201/09536 , H05K2201/096 , H05K2201/10378 , H05K2203/0143 , H05K2203/068 , H05K2203/1545 , H05K2203/1572 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： Apparatus and method for making circuitized substrates using a continuous roll format in which a layer of conductor is fed into the apparatus, layers of photo-imageable dielectric are applied to opposite sides of the conductor layer, thru-holes are formed through the composite, and then metal layers are added over the dielectric and then patterns (e.g., circuit) are formed therein. Several operations are performed in addition to these to form the final end product, a circuitized substrate (e.g., printed circuit board), all while the conductor layer of the product is retained in a solid format, up to the final separation from the continuous layer.
摘要翻译： 使用连续辊式制造电路化基板的装置和方法，其中导体层被馈送到装置中，可光成像电介质层被施加到导体层的相对侧，穿过复合材料形成通孔， 然后在电介质上添加金属层，然后在其中形成图案（例如电路）。 除了这些之外，还进行了几个操作以形成最终终端产品，电路化基板（例如，印刷电路板），同时产品的导体层保持为固体形式，直到与连续层的最终分离 。
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5.发明授权Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner 失效用于以连续方式制造具有光可成像电介质层的电路化基板的装置公开(公告)号：US07827682B2
公开(公告)日：2010-11-09
申请号：US11110920
申请日：2005-04-21
CPC分类号： H05K3/4641 , H05K3/064 , H05K3/4069 , H05K3/427 , H05K3/44 , H05K3/445 , H05K3/462 , H05K2201/0355 , H05K2201/09536 , H05K2201/096 , H05K2201/10378 , H05K2203/0143 , H05K2203/068 , H05K2203/1545 , H05K2203/1572 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： Apparatus and method for making circuitized substrates using a continuous roll format in which a layer of conductor is fed into the apparatus, layers of photo-imageable dielectric are applied to opposite sides of the conductor layer, thru-holes are formed through the composite, and then metal layers are added over the dielectric and then patterns (e.g., circuit) are formed therein. Several operations are performed in addition to these to form the final end product, a circuitized substrate (e.g., printed circuit board), all while the conductor layer of the product is retained in a solid format, up to the final separation from the continuous layer.
摘要翻译： 使用连续辊式制造电路化基板的装置和方法，其中导体层被馈送到装置中，可光成像电介质层被施加到导体层的相对侧，穿过复合材料形成通孔， 然后在电介质上添加金属层，然后在其中形成图案（例如电路）。 除了这些之外，还进行了几个操作以形成最终终端产品，电路化基板（例如，印刷电路板），同时产品的导体层保持为固体形式，直到与连续层的最终分离 。
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公开(公告)号：US07627947B2
公开(公告)日：2009-12-08
申请号：US11797232
申请日：2007-05-02
申请人： Thomas J. Davis , Subahu D. Desai , John M. Lauffer , James J. McNamara, Jr. , Voya R. Markovich
发明人： Thomas J. Davis , Subahu D. Desai , John M. Lauffer , James J. McNamara, Jr. , Voya R. Markovich
CPC分类号： H05K3/429 , H05K3/0032 , H05K3/0038 , H05K3/427 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0355 , H05K2201/09536 , H05K2201/096 , H05K2203/0143 , H05K2203/0554 , H05K2203/1545 , H05K2203/1572 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： A method of making a multilayered circuitized substrate in which a continuous process is used to form electrically conductive layers which each will form part of a sub-composite. The sub-composites are then aligned such that openings within the conductive layers are also aligned, the sub-composites are then bonded together, and a plurality of holes are then laser drilled through the entire thickness of the bonded structure. The dielectric layers used in the sub-composites do not include continuous or semi-continuous fibers therein, thus expediting hole formation there-through.
摘要翻译： 制造多层电路化基板的方法，其中使用连续工艺来形成每个将形成子复合材料的一部分的导电层。 然后对准次级复合材料，使得导电层内的开口也对准，然后将该次级复合材料结合在一起，然后在结合结构的整个厚度上激光钻出多个孔。 在次级复合材料中使用的电介质层不包括其中的连续或半连续的纤维，因此加速了孔的形成。
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公开(公告)号：US07176383B2
公开(公告)日：2007-02-13
申请号：US10740398
申请日：2003-12-22
IPC分类号： H05K1/03
CPC分类号： H05K1/0216 , H05K1/0228 , H05K2201/09236 , H05K2201/09672 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： A printed circuit board and a method of making same in which the board includes a common power plane having dielectric layers on opposing sides thereof and a signal layer on each of said dielectric layers, each signal layer comprising a plurality of substantially parallel signal lines running in substantially similar directions across said signal layers. Predetermined portions of the signal lines in one signal layer are aligned relative to and also parallel to corresponding signal lines in the other signal layer, with the power plane being located between these portions. Through hole connections are provided between selected signal lines in the two layers, these occurring through clearance holes in the power plane so as to be isolated therefrom.
摘要翻译： 一种印刷电路板及其制造方法，其中所述板包括在其相对侧上具有电介质层的公共电源平面和每个所述电介质层上的信号层，每个信号层包括多条基本上平行的信号线， 基本相似的方向跨越所述信号层。 一个信号层中的信号线的预定部分相对于并且平行于另一个信号层中的相应的信号线，而功率平面位于这些部分之间。 在两层中的选定信号线之间提供通孔连接，这些连接通过电源平面中的间隙而发生，从而与其隔离。
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公开(公告)号：US07530167B2
公开(公告)日：2009-05-12
申请号：US11634287
申请日：2006-12-06
IPC分类号： H01K3/10
CPC分类号： H05K1/0216 , H05K1/0228 , H05K2201/09236 , H05K2201/09672 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： A method of making a printed circuit board in which the board includes a common power plane having dielectric layers on opposing sides thereof and a signal layer on each of said dielectric layers, each signal layer comprising a plurality of substantially parallel signal lines running in substantially similar directions across said signal layers. Predetermined portions of the signal lines in one signal layer are aligned relative to and also parallel to corresponding signal lines in the other signal layer, with the power plane being located between these portions. Through hole connections are provided between selected signal lines in the two layers, these occurring through clearance holes in the power plane so as to be isolated therefrom.
摘要翻译： 一种制造印刷电路板的方法，其中所述基板包括在其相对侧上具有电介质层的公共电源平面和每个所述电介质层上的信号层，每个信号层包括基本相似的多条基本上平行的信号线 跨越所述信号层的方向。 一个信号层中的信号线的预定部分相对于并且平行于另一个信号层中的相应的信号线，而功率平面位于这些部分之间。 在两层中的选定信号线之间提供通孔连接，这些连接通过电源平面中的间隙而发生，从而与其隔离。
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9.发明授权Method of inspecting articles using imaging inspection apparatus with directional cooling 有权使用具有定向冷却的成像检查装置检查物品的方法公开(公告)号：US07510324B2
公开(公告)日：2009-03-31
申请号：US11882473
申请日：2007-08-02
IPC分类号： H01J35/12
CPC分类号： G01N23/046 , G01N2223/419
摘要： A method of inspecting articles using an imaging inspection apparatus which utilizes a plurality of individual imaging devices for directing beams onto the articles having objects therein to detect the objects based on established criteria. The method involves the enhanced cooling of the heat-generating imaging devices in which a fan directs cooling fluid onto a plurality of deflectors which in turn direct said fluid onto selected ones of said imaging devices.
摘要翻译： 使用成像检查装置检查制品的方法，所述成像检查装置利用多个单独的成像装置将光束引导到其上具有物体的物品上，以根据建立的标准检测物体。 该方法涉及对发热成像装置进行增强的冷却，其中风扇将冷却流体引导到多个偏转器上，反过来将导流体引导到所选择的成像装置上。
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公开(公告)号：US07354197B2
公开(公告)日：2008-04-08
申请号：US11141494
申请日：2005-06-01
IPC分类号： H01J35/10 , H01J35/12 , H05G1/02 , G01N23/083
CPC分类号： G01N23/046 , G01N2223/3103 , G01N2223/419 , G01N2223/643 , H01J2235/1262
摘要： An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) positioned on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure to provide cooling to the imaging devices.
摘要翻译： 一种成像检查装置，其利用位于框架上的多个单独的成像装置（例如，X射线计算机断层摄影扫描装置），用于将光束引导到具有其中的物体的物品上，以根据建立的标准检测物体。 该装置利用冷却结构为成像装置提供冷却。
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