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    Apparatus and method for thermally controlled processing of microelectronic workpieces
    4.
    发明授权
    Apparatus and method for thermally controlled processing of microelectronic workpieces 失效
    微电子工件热控加工的装置和方法

    公开(公告)号：US07252714B2

    公开(公告)日：2007-08-07

    申请号：US10295302

    申请日：2002-11-15

    申请人： Kyle M. Hanson ,  Robert W. Batz, Jr. ,  Rajesh Baskaran ,  Nolan Zimmerman ,  Zhongmin Hu ,  Gregory J. Wilson ,  Paul R. McHugh

    发明人： Kyle M. Hanson ,  Robert W. Batz, Jr. ,  Rajesh Baskaran ,  Nolan Zimmerman ,  Zhongmin Hu ,  Gregory J. Wilson ,  Paul R. McHugh

    IPC分类号： B05C3/00

    CPC分类号： H01L21/6723 ,  C23C18/1676 ,  H01L21/67109 ,  Y10T137/0318

    摘要： Apparatus and method for thermally controlled processing of microelectronic workpieces with liquids. An apparatus in accordance with and embodiment of the invention includes a process vessel configured to carry a processing liquid, such as an electroless processing liquid. The vessel has a thermally transmissive wall for transferring heat to and/or from the processing liquid within. A heat transfer device, such as a reservoir that receives processing liquid spilling over from the process vessel, transfers heat to or from the processing liquid within the process vessel. The heat transfer device can also transfer heat to or from an internal or external heat source, such as a conduit carrying a heat transfer fluid, or an electrical resistance heater. The interaction between the microelectronic workpiece and the processing liquid can be further controlled by controlling the rate at which the microelectronic workpiece rotates and/or the manner in which the microelectronic workpiece is introduced to and/or withdrawn from the processing liquid.

    摘要翻译： 用液体对微电子工件进行热处理的装置和方法。 根据本发明的实施例的装置包括配置成承载诸如无电处理液体的处理液体的处理容器。 容器具有用于将热量传递到和/或内部的处理液体的热传递壁。 传热装置，例如容纳从处理容器溢出的处理液体的储存器，将热量传递到处理容器内或从处理容器内的处理液体。 传热装置还可以将热量传递到内部或外部热源，例如承载传热流体的导管或电阻加热器。 通过控制微电子工件旋转的速度和/或微电子工件被引入和/或从处理液中取出的方式，可以进一步控制微电子工件和处理液之间的相互作用。

    Electroplating reactor including back-side electrical contact apparatus
    5.
    发明授权
    Electroplating reactor including back-side electrical contact apparatus 失效
    包括背面电接触装置的电镀反应器

    公开(公告)号：US06849167B2

    公开(公告)日：2005-02-01

    申请号：US10338200

    申请日：2003-01-07

    申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Robert W. Batz, Jr. ,  James T. Kuechmann

    发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Robert W. Batz, Jr. ,  James T. Kuechmann

    IPC分类号： C25D7/12 ,  H01L21/687 ,  C25B9/12 ,  C25D17/06

    CPC分类号： H01L21/68728 ,  C25D17/001 ,  H01L21/68785

    摘要： An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface. An actuator is provided for driving the workpiece support between a first position in which the at least one electrical contact of the workpiece and the at least one contact of the workpiece holding structure are disengaged from one another, and a second position in which the at least one surface clamps the workpiece in a position in which the at least one electrical contact of the workpiece holding structure electrically engages the at least one electrical contact of the workpiece.

    摘要翻译： 公开了一种用于电镀工件的设备，其中该设备包括工件保持结构。 工件保持结构包括具有至少一个表面的工件支撑件，所述至少一个表面设置成与工件的前侧相接合，以及至少一个电触点，该电触点设置成用于与工件的背面上的至少一个对应的电触点接触。 所述工件包括在所述至少一个对应的电触点和所述工件的前侧之间的一个或多个导电路径，以便于所述前侧表面的电镀。 提供致动器，用于在第一位置和第二位置之间驱动工件支撑件，在第一位置，工件的至少一个电触点与工件保持结构的至少一个触点彼此脱离，第二位置至少 一个表面将工件夹紧在其中工件保持结构的至少一个电接触与工件的至少一个电接触电接合的位置。

    Electroplating reactor including back-side electrical contact apparatus
    6.
    发明授权
    Electroplating reactor including back-side electrical contact apparatus 失效
    包括背面电接触装置的电镀反应器

    公开(公告)号：US06527926B2

    公开(公告)日：2003-03-04

    申请号：US09805502

    申请日：2001-03-13

    申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Robert W. Batz, Jr. ,  James T. Kuechmann

    发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Robert W. Batz, Jr. ,  James T. Kuechmann

    IPC分类号： C25B900

    CPC分类号： H01L21/68728 ,  C25D17/001 ,  H01L21/68785

    摘要： An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface. An actuator is provided for driving the workpiece support between a first position in which the at least one electrical contact of the workpiece and the at least one contact of the workpiece holding structure are disengaged from one another, and a second position in which the at least one surface clamps the workpiece in a position in which the at least one electrical contact of the workpiece holding structure electrically engages the at least one electrical contact of the workpiece.

    摘要翻译： 公开了一种用于电镀工件的设备，其中该设备包括工件保持结构。 工件保持结构包括具有至少一个表面的工件支撑件，所述至少一个表面设置成与工件的前侧相接合，以及至少一个电触点，该电触点设置成用于与工件的背面上的至少一个对应的电触点接触。 所述工件包括在所述至少一个对应的电触点和所述工件的前侧之间的一个或多个导电路径，以便于所述前侧表面的电镀。 提供致动器，用于在第一位置和第二位置之间驱动工件支撑件，在第一位置，工件的至少一个电触点与工件保持结构的至少一个触点彼此脱离，第二位置至少 一个表面将工件夹紧在其中工件保持结构的至少一个电接触与工件的至少一个电接触电接合的位置。

    Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
    7.
    发明授权
    Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces 有权

    公开(公告)号：US07048841B2

    公开(公告)日：2006-05-23

    申请号：US10354649

    申请日：2003-01-28

    申请人： Robert W. Batz, Jr. ,  John M. Pedersen ,  John L. Klocke ,  LinLin Chen

    发明人： Robert W. Batz, Jr. ,  John M. Pedersen ,  John L. Klocke ,  LinLin Chen

    IPC分类号： C23C28/00 ,  C25D17/00

    CPC分类号： C25D17/06 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  H01L21/288 ,  H01L21/2885 ,  Y10T29/49002

    摘要： Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system coupled to the support member. The support member, for example, can be a ring or another structure that has an inner wall defining an opening configured to allow the workpiece to move through the support member along an access path. In one embodiment, the support member is a conductive ring having a plurality of posts depending from the ring that are spaced apart from one another by gaps. The contact system can be coupled to the posts of the support member. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member and transversely with respect to the access path. The contact members can comprise electrically conductive biasing elements, such as fingers, that have a contact site and a dielectric coating covering at least a portion of the biasing elements. The contact members can also have a raised feature configured to engage the seed-layer on the workpiece for conducting the current to the seed-layer.

    Apparatus and methods for controlling workpiece surface exposure to processing liquids during the fabrication of microelectronic components
    8.
    发明授权
    Apparatus and methods for controlling workpiece surface exposure to processing liquids during the fabrication of microelectronic components 失效
    用于在制造微电子部件期间控制工件表面暴露于处理液体的装置和方法

    公开(公告)号：US06602383B1

    公开(公告)日：2003-08-05

    申请号：US09386200

    申请日：1999-08-31

    申请人： Robert W. Batz, Jr. ,  Reed A. Blackburn ,  Steven E. Kelly ,  James W. Doolittle

    发明人： Robert W. Batz, Jr. ,  Reed A. Blackburn ,  Steven E. Kelly ,  James W. Doolittle

    IPC分类号： H01L2100

    CPC分类号： H01L21/67253

    摘要： An apparatus for use in processing a workpiece to fabricate a microelectronic component is set forth. The apparatus comprises a process container having a process fluid therein for processing the workpiece and a workpiece holder configured to hold the workpiece. A position sensor is employed to provide position information indicative of the spacing between a surface of the workpiece and a surface of the process fluid. A drive system provides relative movement between the surface of the workpiece and the surface of the process fluid in response to the position information. Preferably, the relative movement provided by the drive system comprises a first motion that causes the surface of the workpiece to contact the surface of the process fluid, and a second motion opposite the direction all of and following the first to generate and maintain a column of process fluid between the surface of the process fluid and the surface of the workpiece. In this manner, the drive system causes the surface of the workpiece to contact the surface of the process fluid to the exclusion of other surfaces of the workpiece thereby limiting processing of the workpiece to only the desired surface. In accordance with one embodiment, the apparatus is configured to electroplate a material onto the surface of the workpiece.

    摘要翻译： 阐述了一种用于处理工件以制造微电子部件的装置。 该装置包括其中具有用于处理工件的工艺流体和构造成保持工件的工件保持器的处理容器。 使用位置传感器来提供指示工件的表面与工艺流体的表面之间的间隔的位置信息。 驱动系统响应于位置信息提供工件的表面和过程流体的表面之间的相对运动。 优选地，由驱动系统提供的相对运动包括使得工件的表面接触过程流体的表面的第一运动，以及与所述第一运动相反的第二运动，以产生并维持一列 工艺流体表面与工件表面之间的工艺流体。 以这种方式，驱动系统使得工件的表面与工艺流体的表面接触，排除了工件的其它表面，从而将工件仅仅处理到所需的表面。 根据一个实施例，该装置被配置为将材料电镀到工件的表面上。

    Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot
    10.
    发明授权
    Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot 有权
    使用具有密封套的工件接合电极组件对半导体工件进行电镀的方法

    公开(公告)号：US06461494B1

    公开(公告)日：2002-10-08

    申请号：US09390091

    申请日：1999-09-03

    申请人： Robert W. Batz, Jr. ,  Kenneth C. Haugan ,  Harry J. Geyer ,  Robert W. Berner

    发明人： Robert W. Batz, Jr. ,  Kenneth C. Haugan ,  Harry J. Geyer ,  Robert W. Berner

    IPC分类号： C25D712

    CPC分类号： H01L21/68728 ,  C25D5/022 ,  C25D7/123 ,  C25D17/001 ,  H01L21/68785

    摘要： Methods used in semiconductor electroplating systems, such as for plating copper, onto a semiconductor wafer or other semiconductor workpiece. The methods apply to patterned metal layers plated onto seed layer which is partially protected by an overlying photoresist or other coating. The methods employ an electrode assembly which has a boot which seals about a contact face of the electrode. The sealing is performed by engaging the seal against photoresist to prevent corrosion of the seal layer. The area enclosed by the sealing includes a via which is surrounded by the seal. The electrode contact extends through the via to provide electrical contact with the metallic seed layer. Plating of copper or other metal proceeds at exposed seed layer areas.

    摘要翻译： 在半导体电镀系统中使用的方法，例如用于电镀铜的方法到半导体晶片或其它半导体工件上。 该方法适用于通过覆盖的光致抗蚀剂或其它涂层部分保护的种子层上的图案化金属层。 该方法采用电极组件，其具有围绕电极的接触面密封的护罩。 通过将密封件接合光致抗蚀剂来进行密封以防止密封层的腐蚀。 由密封件包围的区域包括被密封件包围的通孔。 电极接触件延伸通过通孔以提供与金属种子层的电接触。 在暴露的种子层区域进行铜或其他金属的电镀。