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    Methods And Systems Of Forming Metal Interconnect Layers Using Engineered Templates
    1.
    发明申请
    Methods And Systems Of Forming Metal Interconnect Layers Using Engineered Templates 有权

    公开(公告)号：US20250069900A1

    公开(公告)日：2025-02-27

    申请号：US18943381

    申请日：2024-11-11

    Applicant: Rashid Mavliev

    Inventor： Rashid Mavliev

    IPC: H01L21/48 ,  B29C33/42 ,  B29C43/50 ,  C25D5/02 ,  C25D7/06 ,  C25D17/00 ,  H01L21/683 ,  H01L21/768 ,  H01L23/528 ,  H05K3/06 ,  H05K3/10 ,  H05K3/24

    Abstract: Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This “off-device” approach of forming MILs reduces the complexity and costs of the overall process, allows using semiconductor processes, and reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template May be reused to form multiple MILs, having the same design. During the transfer, the engineered template and device substrate are stacked together and then separated while the MIL is transitioned from the engineered template to the device substrate.

    Control of removal profile in electrochemically assisted CMP
    7.
    发明授权
    Control of removal profile in electrochemically assisted CMP 失效
    电化学辅助CMP中去除曲线的控制

    公开(公告)号：US06991526B2

    公开(公告)日：2006-01-31

    申请号：US10244697

    申请日：2002-09-16

    Applicant: Lizhong Sun ,  Liang-Yuh Chen ,  Siew Neo ,  Feng Q. Liu ,  Alain Duboust ,  Stan D. Tsai ,  Rashid Mavliev

    Inventor： Lizhong Sun ,  Liang-Yuh Chen ,  Siew Neo ,  Feng Q. Liu ,  Alain Duboust ,  Stan D. Tsai ,  Rashid Mavliev

    IPC: B24B1/00 ,  C25F7/00

    CPC classification number: B24B37/042 ,  B23H5/08

    Abstract: Aspects of the invention generally provide a method and apparatus for polishing a substrate using electrochemical deposition techniques. In one aspect, an apparatus for polishing a substrate comprises a counter-electrode and a pad positioned between a substrate and the counter-electrode and a pad positioned between a substrate and the counter-electrode. A dielectric insert is positioned between the counter-electrode and the substrate. The dielectric insert has a plurality of zones, each zone permitting a separate current density between the counter-electrode and the substrate. In another embodiment, an apparatus for polishing a substrate that include a conductive layer comprises a counter-electrode to the material layer. The counter-electrode comprises a plurality of electrically isolated conductive elements. An electrical connector is separately coupled to each of the conductive elements.

    Abstract translation: 本发明的各方面通常提供使用电化学沉积技术来抛光衬底的方法和装置。 一方面，用于研磨衬底的装置包括对电极和位于衬底和对电极之间的衬垫以及位于衬底和对电极之间的衬垫。 电介质插入件位于对电极和衬底之间。 电介质插入件具有多个区域，每个区域允许在对电极和衬底之间分开的电流密度。 在另一个实施例中，用于抛光包括导电层的衬底的装置包括与材料层相对的对电极。 对电极包括多个电绝缘的导电元件。 电连接器分别耦合到每个导电元件。

    Methods and apparatus for polishing a substrate
    9.
    发明申请
    Methods and apparatus for polishing a substrate 审中-公开
    抛光基材的方法和设备

    公开(公告)号：US20050092620A1

    公开(公告)日：2005-05-05

    申请号：US10957199

    申请日：2004-10-01

    Applicant: Rashid Mavliev ,  Alain Duboust ,  Stan Tsai

    Inventor： Rashid Mavliev ,  Alain Duboust ,  Stan Tsai

    IPC: B23H5/08 ,  B24B37/04 ,  B24B57/02 ,  C25F3/02 ,  H01L21/321 ,  B23H3/00

    CPC classification number: B24B37/345 ,  B23H5/08 ,  B24B37/042 ,  B24B57/02 ,  C25F3/02 ,  H01L21/32125

    Abstract: Polishing compositions and methods for removing conductive material and barrier layer materials from a substrate surface are provided. Generally, variable amounts of abrasive particles are used for removing conductive material and barrier layer materials. In one aspect, a process is provided including providing an polishing composition between the first electrode and the substrate, wherein the polishing composition comprises a first concentration of abrasive particles, applying a bias between the first electrode and the second electrode, providing relative motion between the substrate and the polishing article, removing conductive layer material from the substrate, introducing abrasive particles to the polishing composition to form a second concentration of abrasive particles greater than a first concentration of abrasive particles, and removing barrier layer material from the substrate. The abrasive particles may be incrementally introduced or pulsed during a polishing process.

    Abstract translation: 提供了抛光组合物和从衬底表面去除导电材料和阻挡层材料的方法。 通常，可用量的磨料颗粒用于去除导电材料和阻挡层材料。 在一个方面，提供了一种方法，包括在第一电极和衬底之间提供抛光组合物，其中抛光组合物包含第一浓度的磨料颗粒，在第一电极和第二电极之间施加偏压， 衬底和抛光制品，从衬底移除导电层材料，将磨料颗粒引入抛光组合物以形成大于第一浓度的磨料颗粒的第二浓度的磨料颗粒，以及从衬底去除阻挡层材料。 研磨颗粒可以在抛光过程中递增地引入或脉冲。

    System and method for characterization of inclusions in liquid samples
    10.
    发明授权
    System and method for characterization of inclusions in liquid samples 有权

    公开(公告)号：US11125673B2

    公开(公告)日：2021-09-21

    申请号：US16889647

    申请日：2020-06-01

    Applicant: Rashid Mavliev

    Inventor： Rashid Mavliev

    IPC: G01N15/14 ,  G01N21/05 ,  G01N15/02 ,  G01N21/53 ,  G01N15/00

    Abstract: Described are systems and methods for optical characterization of inclusions, such as solids and liquids, in liquid samples. An inclusion characterization system may include a radiation source, a radiation detector, a sample optical cell, and a sample delivery mechanism. The radiation detector may be configured to perform time resolved measurements. The sample may be delivered to the sample optical cell by the sample delivery mechanism at a flow rate set for preserving the sample integrity (i.e., the transport rate). The inclusion characterization in the sample may be performed at flow rates set for sample analysis (i.e., the analysis rate). The analysis rate may differ from the transport rate. The rate difference may be achieved by diverting only a portion of the overall sample into the sample optical cell. Also provided are examples of disengagement of sample transport and analysis flow rates.

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