公开(公告)号：US20050139984A1

公开(公告)日：2005-06-30

申请号：US11016034

申请日：2004-12-17

申请人： David Tuckerman ,  Richard Crisp ,  Belgacem Haba ,  Giles Humpston ,  Jae Park

发明人： David Tuckerman ,  Richard Crisp ,  Belgacem Haba ,  Giles Humpston ,  Jae Park

IPC分类号： H01L21/00 ,  H01L21/50 ,  H01L23/52 ,  H01L23/60 ,  H03H9/02 ,  H03H9/10

CPC分类号： H03H9/1092 ,  H01L23/60 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H03H9/02921 ,  H01L2924/00

摘要： According to one aspect of the invention, a capped chip is provided which includes a chip having a front surface, a back surface opposite the front surface and a plurality of bond pads exposed at at least one of the front and back surfaces. A cap is joined to the chip, the cap overlying one of the front and back surfaces of the chip. The cap includes a plurality of contacts which are conductively interconnected to the bond pads, and one or more temporary ties which conductively connect two or more of the contacts. The temporary ties are severable after the contacts are conductively interconnected to the bond pads.

摘要翻译： 根据本发明的一个方面，提供了一种封盖芯片，其包括具有前表面，与前表面相对的后表面的芯片和暴露在前表面和后表面中的至少一个上的多个接合焊盘。 盖子连接到芯片，盖子覆盖芯片的前表面和后表面之一。 盖包括导电地互连到接合焊盘的多个触点，以及一个或多个导电地连接两个或更多个触点的临时连接。 在触点与接合垫导电互连之后，临时接头是可分离的。

公开(公告)号：US20050181655A1

公开(公告)日：2005-08-18

申请号：US10985126

申请日：2004-11-10

申请人： Belgacem Haba ,  Masud Beroz ,  Giles Humpston ,  Jae Park

发明人： Belgacem Haba ,  Masud Beroz ,  Giles Humpston ,  Jae Park

IPC分类号： H01L21/48 ,  H01L23/13 ,  H01R13/24 ,  H01R13/62

CPC分类号： H01L23/13 ,  H01L21/4846 ,  H01L2924/0002 ,  H01R13/2414 ,  H01R13/2464 ,  H01L2924/00

摘要： A microelectronic package includes a mounting structure, a microelectronic element associated with the mounting structure, and a plurality of conductive posts physically connected to the mounting structure and electrically connected to the microelectronic element. The conductive posts project from the mounting structure in an upward direction, at least one of the conductive posts being an offset post. Each offset post has a base connected to the mounting structure, the base of each offset post defining a centroid. Each offset post also defines an upper extremity having a centroid, the centroid of the upper extremity being offset from the centroid of the base in a horizontal offset direction transverse to the upward direction. The mounting structure is adapted to permit tilting of each offset post about a horizontal axis so that the upper extremities may wipe across a contact pad of an opposing circuit board.

摘要翻译： 微电子封装包括安装结构，与安装结构相关联的微电子元件以及物理连接到安装结构并电连接到微电子元件的多个导电柱。 导电柱从安装结构沿向上的方向突出，至少一个导电柱是偏移柱。 每个偏移柱具有连接到安装结构的基座，每个偏置柱的基部限定质心。 每个偏移柱还限定具有质心的上肢，上肢的质心在垂直于向上方向的水平偏移方向上偏离基部的质心。 安装结构适于允许每个偏移柱绕水平轴线倾斜，使得上端部可以擦过相对电路板的接触垫。

公开(公告)号：US20080003402A1

公开(公告)日：2008-01-03

申请号：US11717587

申请日：2007-03-13

申请人： Belgacem Haba ,  Yoichi Kubota ,  Teck-Gyu Kang ,  Jae Park

发明人： Belgacem Haba ,  Yoichi Kubota ,  Teck-Gyu Kang ,  Jae Park

IPC分类号： C23F1/00 ,  B32B7/00

CPC分类号： H01L24/14 ,  H01L21/4828 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/11 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K3/061 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/0369 ,  H05K2203/0597 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T428/24174 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method includes applying a final etch-resistant material to an in-process substrate so that the final etch-resistant material at least partially covers first microcontact portions integral with the substrate and projecting upwardly from a surface of the substrate, and etching the surface of the substrate so as to leave second microcontact portions below the first microcontact portions and integral therewith, the final etch-resistant material at least partially protecting the first microcontact portions from etching during the further etching step. A microelectronic unit includes a substrate, and a plurality of microcontacts projecting in a vertical direction from the substrate, each microcontact including a base region adjacent the substrate and a tip region remote from the substrate, each microcontact having a horizontal dimension which is a first function of vertical location in the base region and which is a second function of vertical location in the tip region.

摘要翻译： 一种方法包括将最终的耐蚀刻材料施加到工艺衬底，使得最终耐蚀刻材料至少部分地覆盖与衬底成一体的第一微接触部分并从衬底的表面向上突出，并且蚀刻表面 衬底，以便将第二微接触部分留在第一微接触部分下方并与之成一体，最后的抗蚀刻材料在另外的蚀刻步骤期间至少部分地保护第一微接触部分免受蚀刻。 微电子单元包括衬底以及从衬底沿垂直方向突出的多个微接点，每个微接触器包括邻近衬底的基极区域和远离衬底的尖端区域，每个微接触体具有作为第一功能的水平尺寸 在基部区域中垂直位置，并且其是尖端区域中垂直位置的第二函数。

公开(公告)号：US20050279916A1

公开(公告)日：2005-12-22

申请号：US11120711

申请日：2005-05-03

申请人： Teck-Gyu Kang ,  Michael Estrella ,  Jae Park ,  Kenneth Thompson ,  Craig Mitchell ,  Belgacem Haba

发明人： Teck-Gyu Kang ,  Michael Estrella ,  Jae Park ,  Kenneth Thompson ,  Craig Mitchell ,  Belgacem Haba

IPC分类号： H01L27/00 ,  H01L27/146 ,  H01L31/0203 ,  H04N5/225

CPC分类号： H01L27/14618 ,  H01L31/0203 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H04M2250/52 ,  H04N5/2253 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2924/00

摘要： An image sensor package is disclosed that reduces the overall size of known image sensor packages. The image sensor package includes an image sensor and image sensor controller that are arranged on a substrate so that the surfaces of the image sensor and image sensor controller are directly adjacent one another. A package in accordance with the present invention reduces the amount of space in the package by allowing at least one surface of the image sensor controller and at least one surface of the image sensor to be directly attached or connected to one another. Electrical conductive material in the nature of anisotropic conductive materials is also preferably applied to the substrate in the form of an adhesive layer to allow for the image sensor controller and the image sensor to be in electrical communication with one another.

摘要翻译： 公开了一种降低已知图像传感器封装的总体尺寸的图像传感器封装。 图像传感器封装包括图像传感器和图像传感器控制器，其布置在基板上，使得图像传感器和图像传感器控制器的表面彼此直接相邻。 根据本发明的包装通过允许图像传感器控制器的至少一个表面和图像传感器的至少一个表面直接附接或彼此连接来减少包装中的空间量。 各向异性导电材料性质的导电材料也优选以粘合剂层的形式施加到基底上，以允许图像传感器控制器和图像传感器彼此电连通。

公开(公告)号：US20050243529A1

公开(公告)日：2005-11-03

申请号：US11111145

申请日：2005-04-21

申请人： Masud Beroz ,  Jae Park ,  Belgacem Haba ,  Fion Tan ,  Philip Osborn

发明人： Masud Beroz ,  Jae Park ,  Belgacem Haba ,  Fion Tan ,  Philip Osborn

IPC分类号： H01L21/60 ,  H01L23/13 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01R9/00 ,  H01R12/04 ,  H05K1/11

CPC分类号： H01L23/13 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05647 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/4824 ,  H01L2224/48463 ,  H01L2224/48471 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00

摘要： A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate either by being bonded to contacts or being embedded in the substrate. The connection component can be formed, in one embodiment, by stitch bonding wire leads across the gap. In another embodiment, a prefabricated lead assembly supporting spaced apart parallel leads is juxtaposed and transferred to the substrate. The connection component is juxtaposed overlying a semiconductor chip whereby leads extending over the gap may have one end detached and bonded to an underlying chip contact.

摘要翻译： 用于半导体芯片的连接部件包括具有间隙的基板，多个平行间隔开的​​引线延伸。 引线的端部通过结合到触点或嵌入基板中而粘附到基板上。 在一个实施例中，连接部件可以通过将导线穿过间隙缝合而形成。 在另一个实施例中，支撑间隔开的平行引线的预制引线组件并置并转移到衬底。 连接部件并置在半导体芯片上，由此在间隙上延伸的引线可以具有一端分离并结合到下面的芯片触点。

公开(公告)号：US20050284658A1

公开(公告)日：2005-12-29

申请号：US11166982

申请日：2005-06-24

申请人： Yoichi Kubota ,  Teck-Gyu Kang ,  Jae Park ,  Belgacem Haba

发明人： Yoichi Kubota ,  Teck-Gyu Kang ,  Jae Park ,  Belgacem Haba

IPC分类号： H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H05K1/11 ,  H05K3/06 ,  H05K3/40

CPC分类号： H05K1/0366 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K3/06 ,  H05K3/4007 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2203/063 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49156 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.

摘要翻译： 封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48） ）暴露在介电层的外表面处，焊盘通过迹线连接到柱。 电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。 还公开了制造连接部件的方法。

公开(公告)号：US20050040540A1

公开(公告)日：2005-02-24

申请号：US10901407

申请日：2004-07-28

申请人： Belgacem Haba ,  Jae Park ,  Teck-Gyu Kang ,  Nicholas Colella

发明人： Belgacem Haba ,  Jae Park ,  Teck-Gyu Kang ,  Nicholas Colella

IPC分类号： H01L21/60 ,  H01L23/48

CPC分类号： H01L24/16 ,  H01L24/11 ,  H01L24/12 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13655 ,  H01L2224/81143 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4913 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A microelectronic element such as a semiconductor chip has springs such as coil springs bonded to contacts so that the springs serve as electrical connections to a circuit panel. The unit can be tested readily and can be surface-mounted to a circuit panel by bonding the distal ends of the springs, remote from the microelectronic element, to the panel. The springs can also serve as antennas so as to provide a miniaturized phased array.

摘要翻译： 诸如半导体芯片的微电子元件具有弹簧，例如键合到触点的螺旋弹簧，使得弹簧用作与电路板的电连接。 该单元可以容易地测试，并且可以通过将远离微电子元件的弹簧的远端粘合到面板上而被表面安装到电路板。 弹簧也可以用作天线，以便提供小型化的相控阵列。

公开(公告)号：USD706292S1

公开(公告)日：2014-06-03

申请号：US29425189

申请日：2012-06-20

申请人： Cara Lyn Tyler ,  Theodore Aaron Haberman ,  Sogol Malekzadeh ,  Jae Park ,  Kristina Voros ,  Jonathan Aroner

设计人： Cara Lyn Tyler ,  Theodore Aaron Haberman ,  Sogol Malekzadeh ,  Jae Park ,  Kristina Voros ,  Jonathan Aroner

公开(公告)号：USD705244S1

公开(公告)日：2014-05-20

申请号：US29425191

申请日：2012-06-20

申请人： Jeffery G. Arnold ,  Priyanka Singhal ,  Ryan T. Bickel ,  Chad Michael Roberts ,  Lori Beth Kratzer ,  Jae Park

设计人： Jeffery G. Arnold ,  Priyanka Singhal ,  Ryan T. Bickel ,  Chad Michael Roberts ,  Lori Beth Kratzer ,  Jae Park

公开(公告)号：US20080106497A1

公开(公告)日：2008-05-08

申请号：US11957890

申请日：2007-12-17

申请人： Woong MIN ,  Jung Kang ,  Jae Park

发明人： Woong MIN ,  Jung Kang ,  Jae Park

IPC分类号： G09G3/28

CPC分类号： H01J11/32 ,  H01J11/12 ,  H01J11/24 ,  H01J11/28 ,  H01J2211/245 ,  H01J2211/323

摘要： The present invention relates to a plasma display panel, and more particularly, to an electrode structure of a plasma display panel capable of improving brightness and efficiency. According to the present invention, in the plasma display, assuming that a distance from the center of a discharge region between a pair of transparent electrodes to the center of metal electrodes is “d” and a distance between both ends of the pair of the transparent electrodes is “h”, a location on the transparent electrodes of metal electrodes satisfies d

摘要翻译： 等离子体显示面板技术领域本发明涉及等离子体显示面板，更具体地，涉及能够提高亮度和效率的等离子体显示面板的电极结构。 根据本发明，在等离子体显示器中，假设从一对透明电极之间的放电区域的中心到金属电极的中心的距离为“d”，并且该对透明电极的两端之间的距离 电极为“h”，金属电极的透明电极上的位置满足d