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1.发明授权Method for dispensing solder paste on a non-planar substrate using an array of ultrasonically agitated pins 失效使用超声波搅拌销的阵列在非平面基板上分配焊膏的方法
公开(公告)号：US5909839A
公开(公告)日：1999-06-08
申请号：US857159
申请日：1997-05-15
CPC分类号： H05K3/3484 , H02G3/266 , H05K1/0284 , H05K2201/09018 , H05K2203/0195 , H05K2203/0338
摘要： A method is provided for applying a fluid to a plurality of locations on a non-planar substrate. The apparatus used includes a movable base and an array of pins connected to the base. Each pin has a distal end which is vertically movable with respect to the base independently of the rest of the array of pins. Each distal end is adapted to transfer fluid to a location on the substrate by having a greater affinity for the fluid than the fluid has for itself and a lesser affinity for the fluid than the fluid has for the substrate. Accordingly, the distal ends may be dipped in the fluid and moved into contact with the substrate such that the distal ends may collapse toward the base as the distal ends engage the substrate to facilitate further movement of the base toward the substrate for application of fluid to each of the plurality of locations.
摘要翻译： 提供了一种将流体施加到非平面基底上的多个位置的方法。 所使用的装置包括可移动基座和连接到基座的销的阵列。 每个销具有远端，该远端相对于底座可垂直移动，而与销的其余部分无关。 每个远端适合于通过对流体具有比流体本身更大的亲和力并且对流体具有比流体对底物更小的亲和力，将流体转移到基底上的位置。 因此，远端可以浸入流体中并且移动到与基底接触，使得当远端接合基底时，远端可能朝向基部折叠，以便于基部朝向基底的进一步移动以将流体施加到 多个位置中的每一个。
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公开(公告)号：US5705104A
公开(公告)日：1998-01-06
申请号：US644398
申请日：1996-05-10
CPC分类号： B60R16/0207
摘要： A method, and an article produced according to the method, for embedding conductors in a structure having a signal distribution function associated therewith such as a vehicle instrument panel. The method includes embedding a conductor in a film, and molding a material to the film such that the material and the film integrally form the structure. The method also includes attaching a connector to the integral structure so that the connector is provided in communication with the conductor.
摘要翻译： 根据该方法制造的方法和制品，用于将导体嵌入具有与其相关联的信号分配功能的结构中，例如车辆仪表板。 该方法包括将导体嵌入到膜中，并将材料模制成膜，使得材料和膜一体地形成结构。 该方法还包括将连接器附接到整体结构，使得连接器设置成与导体连通。
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公开(公告)号：US06528736B1
公开(公告)日：2003-03-04
申请号：US08786494
申请日：1997-01-21
申请人： Daniel Phillip Dailey , Robert Edward Belke, Jr. , Jay DeAvis Baker , Achyuta Achari , Myron Lemecha , Michael George Todd
发明人： Daniel Phillip Dailey , Robert Edward Belke, Jr. , Jay DeAvis Baker , Achyuta Achari , Myron Lemecha , Michael George Todd
IPC分类号： H01R909
CPC分类号： H05K3/4092 , H05K3/4685
摘要： Method of manufacturing a multi-layer printed circuit board adapted for reduce interfacial sheer stresses includes a laminate substrate having a top layer forming a first major surface, a middle layer having a predetermined thickness and a bottom layer forming a second major surface opposed to the first major surface. Etch resists are disposed on the first and second surfaces corresponding to reverse images of desired conductor patterns. The first and second surfaces are thereafter etched and the photoresist removed. The laminate substrate is secured via a low modules adhesive layer to a major surface of a base. The middle layer of the laminate substrate is thereafter selectively etched so as to isolate selected portions of the first and second surfaces and to define inner connect regions therebetween having a height equal to the predetermined thickness.
摘要翻译： 适用于减少界面剪切应力的多层印刷电路板的制造方法包括具有形成第一主表面的顶层，具有预定厚度的中间层和形成与第一主表面相对的第二主表面的底层的层压基板 主要表面。 蚀刻抗蚀剂设置在对应于所需导体图案的反向图像的第一和第二表面上。 此后蚀刻第一表面和第二表面，并除去光致抗蚀剂。 层压基板通过低模块粘合剂层固定到基体的主表面。 之后选择性地蚀刻层压基板的中间层，以隔离第一和第二表面的选定部分，并且限定其间具有等于预定厚度的高度的内部连接区域。
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公开(公告)号：US06555015B1
公开(公告)日：2003-04-29
申请号：US09712838
申请日：2000-11-09
申请人： Daniel Phillip Dailey , Robert Edward Belke, Jr. , Jay DeAvis Baker , Achyuta Achari , Myron Lemecha , Michael George Todd
发明人： Daniel Phillip Dailey , Robert Edward Belke, Jr. , Jay DeAvis Baker , Achyuta Achari , Myron Lemecha , Michael George Todd
IPC分类号： H01B1300
CPC分类号： H05K3/4092 , H05K3/4685
摘要： Method of manufacturing a multi-layer printed circuit board adapted for reduce interfacial sheer stresses includes a laminate substrate having a top layer forming a first major surface, a middle layer having a predetermined thickness and a bottom layer forming a second major surface opposed to the first major surface. Etch resists are disposed on the first and second surfaces corresponding to reverse images of desired conductor patterns. The first and second surfaces are thereafter etched and the photoresist removed. The laminate substrate is secured via a low modules adhesive layer to a major surface of a base. The middle layer of the laminate substrate is thereafter selectively etched so as to isolate selected portions of the first and second surfaces and to define inner connect regions therebetween having a height equal to the predetermined thickness.
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5.发明授权Fully additive method of applying a circuit pattern to a three-dimensional, nonconductive part 失效将电路图案应用于三维非导电部件的全加法方法
公开(公告)号：US5837609A
公开(公告)日：1998-11-17
申请号：US784886
申请日：1997-01-16
CPC分类号： H05K3/182 , H05K1/0284
摘要： A fully additive method of applying a circuit pattern to a three-dimensional, nonconductive part comprises: pretreating the surface of the part; pad-printing a surface catalyst in a solvent carrier onto the surface in the shape of a desired circuit pattern; and applying an electroless copper deposit onto the surface catalyst, thereby providing a copper layer on the surface in the desired circuit pattern shape.
摘要翻译： 将电路图案应用于三维非导电部件的完全添加方法包括：预处理部件的表面; 将溶剂载体中的表面催化剂以期望的电路图形形式在表面上印刷到表面上; 以及将表面催化剂上的无电镀铜层施加到表面上，由此在所希望的电路图案形状的表面上形成铜层。
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6.发明授权Method for reworking a multi-layer circuit board using a shape memory alloy material 失效使用形状记忆合金材料对多层电路板进行再加工的方法
公开(公告)号：US5925298A
公开(公告)日：1999-07-20
申请号：US494509
申请日：1995-06-26
CPC分类号： B29C53/063 , H05K3/0014 , B29C61/006 , H05K2201/0308 , H05K2203/1105 , H05K2203/302 , Y10S264/04 , Y10S264/66
摘要： A method and apparatus for forming a rigid circuit board has a circuit board with a reduced thickness in a bend region. The bend region may have several layers of laminate and conductive material. The circuit board is heated to the glass transition temperature which allows the circuit board to become flexible. The apparatus has a clamping member and a stationary member. The clamping member uses a shape memory alloy actuator with a transition temperature about the same as the glass transition temperature of the laminate. The actuator is used to form the bend region to a predetermined shape around the stationary member. When the circuit board is cooled, the circuit board again becomes rigid in its predetermined shape.
摘要翻译： 用于形成刚性电路板的方法和装置具有在弯曲区域中具有减小的厚度的电路板。 弯曲区域可以具有多层层压体和导电材料。 电路板被加热到允许电路板变得柔性的玻璃化转变温度。 该装置具有夹紧构件和固定构件。 夹紧构件使用形状记忆合金致动器，其转变温度与层叠体的玻璃化转变温度大致相同。 致动器用于将弯曲区域形成为围绕固定构件的预定形状。 当电路板被冷却时，电路板再次变成其预定形状的刚性。
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公开(公告)号：US5909012A
公开(公告)日：1999-06-01
申请号：US730618
申请日：1996-10-21
CPC分类号： H05K3/403 , H05K1/0218 , H05K1/0272 , H05K3/187 , B29C2045/0079 , B29C45/0053 , B29C45/1704 , B29L2031/3493 , H05K1/0284 , H05K2201/09118 , H05K2201/09163 , H05K2201/09627 , H05K2201/09981
摘要： A gas assisted injection molded part includes internal cavities extending between two surfaces of the part. The cavities are plated for electrical conductivity after a surface cleaning and etching process. The part may be an automobile instrument panel wherein the internal cavities are plated to create a series of "bus" conductor lines. These lines carry power, ground and/or electrical signals over relatively large distances, allowing other components to attach at points along the structure eliminating the need for discrete wiring and wire harness interconnect assemblies.
摘要翻译： 气体辅助注塑部件包括在部件的两个表面之间延伸的内部空腔。 在表面清洁和蚀刻工艺之后，这些空腔被电镀以获得导电性。 该部件可以是汽车仪表板，其中内部空腔被电镀以产生一系列“总线”导体线。 这些线路在相对较大的距离上承载电力，地面和/或电信号，允许其他部件在沿着结构的点处附接，消除对分立布线和线束互连组件的需要。
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公开(公告)号：US5655291A
公开(公告)日：1997-08-12
申请号：US494747
申请日：1995-06-26
CPC分类号： H05K3/0014 , H05K2203/1105 , H05K2203/302 , Y10T29/49126
摘要： A method and apparatus for forming a rigid circuit board uses a circuit board with a reduced thickness in a bend region. The bend region may have several layers of laminate and conductive material. The circuit board is heated to the glass transition temperature which allows the circuit board to become flexible. The apparatus has two rollers used to form the bend region to a predetermined shape. When the circuit is cooled, the circuit board again becomes rigid in its predetermined shape.
摘要翻译： 用于形成刚性电路板的方法和装置在弯曲区域中使用厚度减小的电路板。 弯曲区域可以具有多层层压体和导电材料。 电路板被加热到允许电路板变得柔性的玻璃化转变温度。 该装置具有用于将弯曲区域形成为预定形状的两个辊。 当电路冷却时，电路板再次变成刚性的预定形状。
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公开(公告)号：US06326241B1
公开(公告)日：2001-12-04
申请号：US08999153
申请日：1997-12-29
申请人： Robert Edward Belke, Jr. , Brian John Hayden , Cuong Van Pham , Rosa Lynda Nuno , Michael George Todd
发明人： Robert Edward Belke, Jr. , Brian John Hayden , Cuong Van Pham , Rosa Lynda Nuno , Michael George Todd
IPC分类号： H01L2144
CPC分类号： H01L24/81 , H01L21/563 , H01L24/29 , H01L2224/1134 , H01L2224/13139 , H01L2224/13144 , H01L2224/13164 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/81801 , H01L2224/83101 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/00 , H01L2924/3512 , H01L2924/00014
摘要： A solderless method for assembling a semiconductor electronic flip-chip device to an electrical interconnecting substrate including the steps of forming a plurality of raised electrical contacts and plurality of contact pads. The pads correspond in number and physical location with the electrical contacts. The pads and contact mate when brought together. A quantity of plastic material is interposed between the electrical device and substrate. The plastic material is heated so that it softens and flows. The electronic device and substrate are urged together. The urging step displaces the molten plastic material from between the contacts and pads. The contacts and pads are jointed directly without any adhesive, solder or conducive filler therebetween to electrically interconnect the electronic device and substrate. The plastic material is allowed to cool whereby the electronic device and substrate are adhesively bonded together and electrically interconnected.
摘要翻译： 一种用于将半导体电子倒装芯片器件组装到电互连衬底的无焊接方法，包括形成多个凸起的电触点和多个接触焊盘的步骤。 焊盘的数量和物理位置与电触点对应。 垫片和接触配合在一起时。 在电气设备和基板之间插入一定数量的塑料材料。 塑料材料被加热，使其软化和流动。 电子装置和基板一起被推动。 推动步骤使熔融的塑料材料从触点和焊盘之间移位。 触点和焊盘直接连接，而没有任何粘合剂，焊料或导电填料，以电连接电子器件和衬底。 允许塑料材料冷却，由此使电子器件和衬底粘合在一起并电连接。
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10.发明授权
公开(公告)号：US5914534A
公开(公告)日：1999-06-22
申请号：US642722
申请日：1996-05-03
IPC分类号： H05K1/00 , H05K1/11 , H05K1/14 , H05K3/36 , H05K3/46 , H01L21/44 , H01L23/02 , H01L23/16 , H01L29/41
CPC分类号： H05K3/462 , H05K1/119 , H05K1/144 , H01L2924/1515 , H05K1/0284 , H05K2201/09045 , H05K2201/09118 , H05K2201/09536 , H05K2201/096 , H05K2201/09845 , H05K2201/1059 , H05K2201/10666 , H05K2203/167 , H05K3/368 , H05K3/4623 , Y10S438/977
摘要： A three-dimensional multi-layer molded electronic device and method for manufacturing same, wherein the device comprises at least two molded, three-dimensional substrates having mating surfaces, each substrate including a layer of patterned conductive material on at least one surface and electrically conductive vias at selected locations of the substrate for interconnection of the conductive layers, wherein the substrates are electrically joined at their mating surfaces and the circuit layers are aligned and interconnected to form a multi-layer, three-dimensional circuit which may include molded-in structural features.
摘要翻译： 一种三维多层成型电子器件及其制造方法，其中所述器件包括至少两个具有配合表面的模制的三维衬底，每个衬底在至少一个表面上包括图案化的导电材料层并具有导电性 在基板的选定位置处的通孔，用于导电层的互连，其中基板在其配合表面处电连接，并且电路层被对准和互连以形成多层三维电路，其可以包括模制结构 特征。
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