Abstract:
The memory cell is formed in a body of a P-type semiconductor material forming a channel region and housing N-type drain and source regions at two opposite sides of the channel region. A floating gate region extends above the channel region. A P-type charge injection region extends in the body contiguously to the drain region, at least in part between the channel region and the drain region. An N-type base region extends between the drain region, the charge injection region, and the channel region. The charge injection region and the drain region are biased by special contact regions so as to forward bias the PN junction formed by the charge injection region and the base region. The holes thus generated in the charge injection region are directly injected through the base region into the body, where they generate, by impact, electrons that are injected towards the floating gate region.
Abstract:
A memory device comprising a semiconductor material substrate with a dopant of a first type, a first semiconductor material well with a dopant of a second type formed in the substrate; a second semiconductor material well with a dopant of the first type formed in the first well, an array of memory cells formed within the second well. Each memory cell comprises a first electrode and a second electrode respectively formed by a first and a second doped regions with dopant of the second type formed in the second well, and a control gate electrode. The memory array comprises a first plurality of strips of conductive material extending over the second well in a first direction and forming rows of memory cells, a second plurality of strips of conductive material extending over the second well in a second direction substantially orthogonal to the first direction and forming columns of memory cells, each strip of the second plurality electrically contacting the first electrodes of a respective group of memory cells, a third plurality of strips of conductive material extending over the second well in the second direction and intercalated to the strips of the second plurality, electrically contacting the second electrodes of the cells. A fourth plurality of strips of conductive material is provided extending over the second well in the second direction and intercalated to the strips of the second and the third pluralities, electrically contacting the second well in a succession of contact points distributed longitudinally to each strip of the fourth plurality.
Abstract:
A memory device comprising a semiconductor material substrate with a dopant of a first type; a first semiconductor material well with a dopant of a second type formed in the substrate; a second semiconductor material well with a dopant of the first type formed in said first well; an array of memory cells formed within said second well. Each memory cell comprises a first electrode and a second electrode respectively formed by a first and a second doped regions with dopant of the second type formed in said second well, and a control gate electrode. The memory array comprises a first plurality of strips of conductive material extending over said second well in a first direction and forming rows of memory cells, a second plurality of strips of conductive material extending over said second well in a second direction substantially orthogonal to said first direction and forming columns of memory cells, each strip of said second plurality electrically contacting the first electrodes of a respective group of memory cells, a third plurality of strips of conductive material extending over said second well in said second direction and intercalated to the strips of the second plurality, electrically contacting the second electrodes of the cells. A fourth plurality of strips of conductive material is provided extending over said second well in said second direction and intercalated to the strips of said second and third pluralities, electrically contacting the second well in a succession of contact points distributed longitudinally to each strip of said fourth plurality.
Abstract:
A plurality of bipolar transistors are formed by forming a common conduction region, a plurality of control regions extending each in an own active areas on the common conduction region, a plurality of silicide protection strips, and at least one control contact region. Silicide regions are formed on the second conduction regions and the control contact region. The second conduction regions may be formed by selectively implanting a first conductivity type dopant areas on a first side of selected silicide protection strips. The control contact region is formed by selectively implanting an opposite conductivity type dopant on a second side of the selected silicide protection strips.
Abstract:
A process for manufacturing a phase change memory array includes the steps of: forming a plurality of phase change memory cells in an array region of a semiconductor wafer, the phase change memory cells arranged in rows and columns according to a row direction and to a column direction, respectively; forming a control circuit in a control region of the semiconductor wafer; forming a plurality of first bit line portions for mutually connecting phase change memory cells arranged on a same column; forming first level electrical interconnection structures; and forming second level electrical interconnection structures above the first level electrical interconnection structures. The first level electrical interconnection structures include second bit line portions laying on and in contact with the first bit line portions and projecting from the first bit line portions in the column direction for connecting the first bit line portions to the control circuit.
Abstract:
A content addressable memory cell for a non-volatile content addressable memory, including a non-volatile storage element for storing a content digit, a selection input for selecting the memory cell, a search input for receiving a search digit, and a comparison circuit arrangement for comparing the search digit to the content digit and for driving a match output of the memory cell so as to signal a match between the content digit and the search digit. The non-volatile storage element include at least one phase-change memory element for storing in a non-volatile way the respective content digit.
Abstract:
In a method and system for reducing power consumed by a magnetic memory, magnetic memory cells are coupled to a bit line and are associated with a plurality of digit lines. A bit line current is provided in the bit line. Digit currents are provided in parallel in the digit lines at substantially the same time as the bit line current. The digit and bit line currents allow the magnetic memory cells to be written to a plurality of states in parallel.
Abstract:
A method of making a non-volatile MOS semiconductor memory device includes a formation step, in a semiconductor material substrate, of STI isolation regions (shallow trench isolation) filled by field oxide and of memory cells separated each other by said STI isolation regions. The memory cells include a gate electrode electrically isolated from said semiconductor material substrate by a first dielectric layer, and the gate electrode includes a floating gate self-aligned to the STI isolation regions. The method includes a formation phase of said floating gate exhibiting a substantially saddle shape including a concavity; the formation step of said floating gate includes a deposition step of a first conformal conductor material layer.
Abstract:
A process for manufacturing a phase change memory array, includes the steps of: forming a plurality of PCM cells, arranged in rows and columns; and forming a plurality of resistive bit lines for connecting PCM cells arranged on a same column, each resistive bit lines comprising a respective phase change material portion, covered by a respective barrier portion. After forming the resistive bit lines, electrical connection structures for the resistive bit lines are formed directly in contact with the barrier portions of the resistive bit lines.
Abstract:
The present invention proposes a Field Programmable Gate Array device comprising a plurality of configurable electrical connections, a plurality of controlled switches, each one adapted to activating/de-activating at least one respective electrical connection in response to a switch control signal and a control unit including an arrangement of a plurality of control cells. Each control cells controls at least one of said controlled switches by the respective switch control signal, each control cell including a volatile storage element adapted to storing in a volatile way a control logic value corresponding to a preselected status of the at least one controlled switch, and providing to the controlled switch said switch control signal corresponding to the stored logic value. Each control cell further includes a non-volatile storage element coupled to the volatile storage element, the non-volatile storage element being adapted to storing in a non-volatile way the control logic value.