Nonvolatile memory cell with high programming efficiency
    1.
    发明授权
    Nonvolatile memory cell with high programming efficiency 有权
    具有高编程效率的非易失性存储单元

    公开(公告)号:US06734490B2

    公开(公告)日:2004-05-11

    申请号:US09919341

    申请日:2001-07-30

    CPC classification number: H01L29/66825 G11C16/0416 H01L27/11521 H01L29/7885

    Abstract: The memory cell is formed in a body of a P-type semiconductor material forming a channel region and housing N-type drain and source regions at two opposite sides of the channel region. A floating gate region extends above the channel region. A P-type charge injection region extends in the body contiguously to the drain region, at least in part between the channel region and the drain region. An N-type base region extends between the drain region, the charge injection region, and the channel region. The charge injection region and the drain region are biased by special contact regions so as to forward bias the PN junction formed by the charge injection region and the base region. The holes thus generated in the charge injection region are directly injected through the base region into the body, where they generate, by impact, electrons that are injected towards the floating gate region.

    Abstract translation: 存储单元形成在形成沟道区域的P型半导体材料的主体中,并且在沟道区域的两个相对侧容纳N型漏极和源极区域。 浮动栅极区域在沟道区域的上方延伸。 P型电荷注入区域至少部分地在沟道区域和漏极区域之间在体内连续地延伸到漏极区域。 N型基极区域在漏极区域,电荷注入区域和沟道区域之间延伸。 电荷注入区域和漏极区域被特殊的接触区域偏置,以使由电荷注入区域和基极区域形成的PN结正向偏置。 这样在电荷注入区域中产生的孔直接通过基底区域注入到体内,在那里它们通过冲击产生被注入到浮动栅极区域的电子。

    Memory device with a cell array in triple well, and related
manufacturing process
    2.
    发明授权
    Memory device with a cell array in triple well, and related manufacturing process 失效
    具有三阱单元阵列的存储器件及相关制造工艺

    公开(公告)号:US5990526A

    公开(公告)日:1999-11-23

    申请号:US27343

    申请日:1998-02-20

    CPC classification number: H01L27/11519 H01L27/11521

    Abstract: A memory device comprising a semiconductor material substrate with a dopant of a first type, a first semiconductor material well with a dopant of a second type formed in the substrate; a second semiconductor material well with a dopant of the first type formed in the first well, an array of memory cells formed within the second well. Each memory cell comprises a first electrode and a second electrode respectively formed by a first and a second doped regions with dopant of the second type formed in the second well, and a control gate electrode. The memory array comprises a first plurality of strips of conductive material extending over the second well in a first direction and forming rows of memory cells, a second plurality of strips of conductive material extending over the second well in a second direction substantially orthogonal to the first direction and forming columns of memory cells, each strip of the second plurality electrically contacting the first electrodes of a respective group of memory cells, a third plurality of strips of conductive material extending over the second well in the second direction and intercalated to the strips of the second plurality, electrically contacting the second electrodes of the cells. A fourth plurality of strips of conductive material is provided extending over the second well in the second direction and intercalated to the strips of the second and the third pluralities, electrically contacting the second well in a succession of contact points distributed longitudinally to each strip of the fourth plurality.

    Abstract translation: 一种存储器件,包括具有第一类型的掺杂剂的半导体材料衬底,在衬底中形成的具有第二类型的掺杂剂的第一半导体材料; 具有形成在第一阱中的第一类型的掺杂剂的第二半导体材料,形成在第二阱内的存储器单元的阵列。 每个存储单元包括分别由形成在第二阱中的第二类型的掺杂剂的第一和第二掺杂区域以及控制栅极电极分别形成的第一电极和第二电极。 所述存储器阵列包括在第一方向上在所述第二阱上延伸的第一多个导电材料条,并且形成行的存储器单元;第二多个导电材料条,沿第二方向在第二方向上延伸,所述第二方向基本上垂直于所述第一 方向和形成存储器单元的列,第二多个的每个条带电接触相应组的存储单元的第一电极;第三多个导电材料条,沿着第二方向在第二阱上延伸并插入到 所述第二多个电极与所述电池的第二电极电接触。 提供了第四多个导电材料条,其沿着第二方向在第二阱上延伸并且插入第二和第三多个的条带中,并且将第二阱的一系列接触点电连接到纵向分配到每个条带 第四个。

    Memory device with a memory cell array in triple well, and related
manufacturing process
    3.
    发明授权
    Memory device with a memory cell array in triple well, and related manufacturing process 有权
    具有三阱存储单元阵列的存储器件及相关制造工艺

    公开(公告)号:US6071778A

    公开(公告)日:2000-06-06

    申请号:US389955

    申请日:1999-09-03

    CPC classification number: H01L27/11521 H01L27/115

    Abstract: A memory device comprising a semiconductor material substrate with a dopant of a first type; a first semiconductor material well with a dopant of a second type formed in the substrate; a second semiconductor material well with a dopant of the first type formed in said first well; an array of memory cells formed within said second well. Each memory cell comprises a first electrode and a second electrode respectively formed by a first and a second doped regions with dopant of the second type formed in said second well, and a control gate electrode. The memory array comprises a first plurality of strips of conductive material extending over said second well in a first direction and forming rows of memory cells, a second plurality of strips of conductive material extending over said second well in a second direction substantially orthogonal to said first direction and forming columns of memory cells, each strip of said second plurality electrically contacting the first electrodes of a respective group of memory cells, a third plurality of strips of conductive material extending over said second well in said second direction and intercalated to the strips of the second plurality, electrically contacting the second electrodes of the cells. A fourth plurality of strips of conductive material is provided extending over said second well in said second direction and intercalated to the strips of said second and third pluralities, electrically contacting the second well in a succession of contact points distributed longitudinally to each strip of said fourth plurality.

    Abstract translation: 一种存储器件,包括具有第一类型的掺杂剂的半导体材料衬底; 在衬底中形成有第二类型的掺杂剂的第一半导体材料; 具有形成在所述第一阱中的第一类型的掺杂剂的第二半导体材料; 形成在所述第二井内的一组存储单元。 每个存储单元包括分别由形成在所述第二阱中的第二类型掺杂剂的第一掺杂区域和第二掺杂区域形成的第一电极和第二电极以及控制栅电极。 所述存储器阵列包括在第一方向上在所述第二阱上延伸的第一多个导电材料条,并且形成行存储器单元;第二多个导电材料条,沿着与所述第一 方向和形成存储器单元的列,所述第二多个的每个条带电接触相应组的存储单元的第一电极;第三多个导电材料条,沿着所述第二方向在所述第二阱上延伸并插入到 所述第二多个电极与所述电池的第二电极电接触。 提供了第四多个导电材料条带,其在所述第二方向上在所述第二阱上延伸并且插入所述第二和第三多个的条带中,并且将所述第二阱的一系列接触点电连接到所述第四部分 复数。

    Self-Aligned Bipolar Junction Transistors
    4.
    发明申请
    Self-Aligned Bipolar Junction Transistors 审中-公开
    自对准双极结晶体管

    公开(公告)号:US20110084247A1

    公开(公告)日:2011-04-14

    申请号:US12969652

    申请日:2010-12-16

    Abstract: A plurality of bipolar transistors are formed by forming a common conduction region, a plurality of control regions extending each in an own active areas on the common conduction region, a plurality of silicide protection strips, and at least one control contact region. Silicide regions are formed on the second conduction regions and the control contact region. The second conduction regions may be formed by selectively implanting a first conductivity type dopant areas on a first side of selected silicide protection strips. The control contact region is formed by selectively implanting an opposite conductivity type dopant on a second side of the selected silicide protection strips.

    Abstract translation: 通过形成公共导电区域,在公共导电区域上的自身有效区域中延伸的多个控制区域,多个硅化物保护带和至少一个控制接触区域来形成多个双极晶体管。 在第二导电区域和控制接触区域上形成硅化物区域。 可以通过在所选择的硅化物保护条的第一侧选择性地注入第一导电类型的掺杂剂区域来形成第二导电区域。 通过在所选择的硅化物保护带的第二侧选择性地注入相反的导电型掺杂剂来形成控制接触区域。

    Process for manufacturing a phase change memory array in Cu-damascene technology and phase change memory array thereby manufactured
    5.
    发明授权
    Process for manufacturing a phase change memory array in Cu-damascene technology and phase change memory array thereby manufactured 有权
    因此制造Cu-damascene技术和相变存储器阵列中的相变存储器阵列的制造方法

    公开(公告)号:US07606056B2

    公开(公告)日:2009-10-20

    申请号:US11317622

    申请日:2005-12-22

    Abstract: A process for manufacturing a phase change memory array includes the steps of: forming a plurality of phase change memory cells in an array region of a semiconductor wafer, the phase change memory cells arranged in rows and columns according to a row direction and to a column direction, respectively; forming a control circuit in a control region of the semiconductor wafer; forming a plurality of first bit line portions for mutually connecting phase change memory cells arranged on a same column; forming first level electrical interconnection structures; and forming second level electrical interconnection structures above the first level electrical interconnection structures. The first level electrical interconnection structures include second bit line portions laying on and in contact with the first bit line portions and projecting from the first bit line portions in the column direction for connecting the first bit line portions to the control circuit.

    Abstract translation: 一种相变存储器阵列的制造方法包括以下步骤:在半导体晶片的阵列区域中形成多个相变存储单元,根据行方向排列成行和列的相变存储单元和列 方向; 在所述半导体晶片的控制区域中形成控制电路; 形成多个第一位线部分,用于相互连接布置在同一列上的相变存储器单元; 形成一级电互连结构; 以及在所述第一级电互连结构之上形成第二级电互连结构。 第一级电互连结构包括布置在第一位线部分上并与第一位线部分接触的第二位线部分,并且在列方向上从第一位线部分突出以将第一位线部分连接到控制电路。

    Content addressable memory cell
    6.
    发明授权
    Content addressable memory cell 有权
    内容可寻址存储单元

    公开(公告)号:US07227765B2

    公开(公告)日:2007-06-05

    申请号:US10970842

    申请日:2004-10-20

    Abstract: A content addressable memory cell for a non-volatile content addressable memory, including a non-volatile storage element for storing a content digit, a selection input for selecting the memory cell, a search input for receiving a search digit, and a comparison circuit arrangement for comparing the search digit to the content digit and for driving a match output of the memory cell so as to signal a match between the content digit and the search digit. The non-volatile storage element include at least one phase-change memory element for storing in a non-volatile way the respective content digit.

    Abstract translation: 一种用于非易失性内容可寻址存储器的内容可寻址存储器单元,包括用于存储内容数位的非易失性存储元件,用于选择存储单元的选择输入,用于接收搜索数字的搜索输入以及比较电路装置 用于将搜索数字与内容数字进行比较,并用于驱动存储器单元的匹配输出,以便发出内容数字和搜索数字之间的匹配。 非易失性存储元件包括用于以非易失性方式存储相应内容数字的至少一个相变存储器元件。

    Process for manufacturing a phase change memory array in Cu-damascene technology and phase change memory array manufactured thereby
    9.
    发明申请
    Process for manufacturing a phase change memory array in Cu-damascene technology and phase change memory array manufactured thereby 有权
    用于制造Cu-镶嵌技术中的相变存储器阵列的方法和由其制造的相变存储器阵列

    公开(公告)号:US20050064606A1

    公开(公告)日:2005-03-24

    申请号:US10902508

    申请日:2004-07-29

    Abstract: A process for manufacturing a phase change memory array, includes the steps of: forming a plurality of PCM cells, arranged in rows and columns; and forming a plurality of resistive bit lines for connecting PCM cells arranged on a same column, each resistive bit lines comprising a respective phase change material portion, covered by a respective barrier portion. After forming the resistive bit lines, electrical connection structures for the resistive bit lines are formed directly in contact with the barrier portions of the resistive bit lines.

    Abstract translation: 一种制造相变存储器阵列的方法,包括以下步骤:形成以行和列排列的多个PCM单元; 以及形成用于连接布置在同一列上的PCM单元的多个电阻位线,每个电阻位线包括由相应的阻挡部分覆盖的各个相变材料部分。 在形成电阻位线之后,电阻位线的电连接结构直接形成为与电阻位线的势垒部分接触。

    Field programmable gate array device
    10.
    发明申请
    Field programmable gate array device 有权
    现场可编程门阵列器件

    公开(公告)号:US20050062497A1

    公开(公告)日:2005-03-24

    申请号:US10948079

    申请日:2004-09-23

    CPC classification number: G11C13/0004 G11C16/0416 H03K3/0375 H03K19/1776

    Abstract: The present invention proposes a Field Programmable Gate Array device comprising a plurality of configurable electrical connections, a plurality of controlled switches, each one adapted to activating/de-activating at least one respective electrical connection in response to a switch control signal and a control unit including an arrangement of a plurality of control cells. Each control cells controls at least one of said controlled switches by the respective switch control signal, each control cell including a volatile storage element adapted to storing in a volatile way a control logic value corresponding to a preselected status of the at least one controlled switch, and providing to the controlled switch said switch control signal corresponding to the stored logic value. Each control cell further includes a non-volatile storage element coupled to the volatile storage element, the non-volatile storage element being adapted to storing in a non-volatile way the control logic value.

    Abstract translation: 本发明提出了一种现场可编程门阵列器件,其包括多个可配置的电连接,多个受控开关,每个控制开关适于响应于开关控制信号激活/去激活至少一个相应的电连接,控制单元 包括多个控制单元的布置。 每个控制单元通过相应的开关控制信号控制所述受控开关中的至少一个,每个控制单元包括易失性存储元件,其适于以易失性方式存储对应于至少一个受控开关的预选状态的控制逻辑值, 以及向受控开关提供与所存储的逻辑值对应的所述开关控制信号。 每个控制单元还包括耦合到易失性存储元件的非易失性存储元件,非易失性存储元件适于以非易失性方式存储控制逻辑值。

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