利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

38 条记录 (耗时 0.025 秒)

    Oxidation resistant nanocrystalline MCrAl(Y) coatings and methods of forming such coatings
    2.
    发明授权
    Oxidation resistant nanocrystalline MCrAl(Y) coatings and methods of forming such coatings 有权
    耐氧化纳米晶MCrAl（Y）涂层和形成这种涂层的方法

    公开(公告)号：US08790791B2

    公开(公告)日：2014-07-29

    申请号：US12760864

    申请日：2010-04-15

    申请人： Narayana S. Cheruvu ,  Ronghua Wei

    发明人： Narayana S. Cheruvu ,  Ronghua Wei

    IPC分类号： B32B15/04 ,  C23C14/18 ,  C23C14/35 ,  C23C14/16 ,  C22C19/07 ,  C22C38/00 ,  C22C30/00 ,  C22C19/05 ,  C23C14/34

    CPC分类号： C23C14/165 ,  C22C19/05 ,  C22C19/07 ,  C22C30/00 ,  C22C38/00 ,  C23C14/345 ,  C23C14/354 ,  Y10T428/12014 ,  Y10T428/12576

    摘要： The present disclosure relates to an oxidation resistant nanocrystalline coating and a method of forming an oxidation resistant nanocrystalline coating. An oxidation resistant coating comprising an MCrAl(Y) alloy may be deposited on a substrate, wherein M, includes iron, nickel, cobalt, or combinations thereof present greater than 50 wt % of the MCrAl(Y) alloy, chromium is present in the range of 15 wt % to 30 wt % of the MCrAl(Y) alloy, aluminum is present in the range of 6 wt % to 12 wt % of the MCrAl(Y) alloy and yttrium, is optionally present in the range of 0.1 wt % to 0.5 wt % of the MCrAl(Y) alloy. In addition, the coating may exhibit a grain size of 200 nm or less as deposited.

    摘要翻译： 本公开内容涉及抗氧化纳米晶体涂层和形成耐氧化纳米晶体涂层的方法。 包含MCrAl（Y）合金的抗氧化涂层可以沉积在基底上，其中M包括大于MCrAl（Y）合金的50重量％的铁，镍，钴或其组合，铬存在于 范围为MCrAl（Y）合金的15重量％〜30重量％，铝以MCrAl（Y）合金和钇的6重量％〜12重量％的范围存在，任选以0.1重量％ ％至0.5wt％的MCrAl（Y）合金。 此外，涂层可以表现出沉积的200nm或更小的晶粒尺寸。

    SYSTEM AND METHOD FOR DEPOSITING COATINGS ON INNER SURFACE OF TUBULAR STRUCTURE
    3.
    发明申请
    SYSTEM AND METHOD FOR DEPOSITING COATINGS ON INNER SURFACE OF TUBULAR STRUCTURE 审中-公开
    用于在管状结构的内表面沉积涂层的系统和方法

    公开(公告)号：US20110111132A1

    公开(公告)日：2011-05-12

    申请号：US12939248

    申请日：2010-11-04

    申请人： Ronghua Wei ,  Christopher Rincon ,  Edward Langa ,  Narayana S. Cheruvu

    发明人： Ronghua Wei ,  Christopher Rincon ,  Edward Langa ,  Narayana S. Cheruvu

    IPC分类号： C23C14/02 ,  B29C71/04

    CPC分类号： C23C16/045 ,  C23C16/26 ,  H01J37/32596

    摘要： A system and method for depositing coatings on an inner surface of a tubular structure includes at least one pump for creating and maintaining a vacuum in the tubular structure, a meshed electrode adapted to be positioned in a center of the tubular structure, and a biased voltage power supply connected to the meshed electrode. The biased voltage power supply is adapted to apply a negative voltage to the meshed electrode such that the negative voltage causes a hollow cathode discharge inside the meshed electrode. The creation of the hollow cathode discharge causes ions to be drawn out of a mesh on the meshed electrode and accelerate onto an inner surface of the tubular structure, thereby coating the inner surface with a desired coating.

    摘要翻译： 用于在管状结构的内表面上沉积涂层的系统和方法包括至少一个用于在管状结构中产生和保持真空的泵，适于定位在管状结构的中心的网状电极和偏置电压 电源连接到网状电极。 偏置电压电源适于向网状电极施加负电压，使得负电压在网状电极内部引起空心阴极放电。 空心阴极放电的产生导致离子从网状电极上的网状物拉出并加速到管状结构的内表面上，从而以期望的涂层涂覆内表面。

    Processing tubular surfaces using double glow discharge
    4.
    发明授权
    Processing tubular surfaces using double glow discharge 有权
    使用双辉光放电加工管状表面

    公开(公告)号：US09175381B2

    公开(公告)日：2015-11-03

    申请号：US12169837

    申请日：2008-07-09

    申请人： Ronghua Wei

    发明人： Ronghua Wei

    IPC分类号： C23C14/34 ,  C23C14/16 ,  C23C14/54 ,  C23C14/48 ,  C23C14/04

    CPC分类号： C23C14/345 ,  C23C14/046 ,  C23C14/16 ,  C23C14/165 ,  C23C14/48 ,  C23C14/541

    摘要： A method of sputtering a component includes positioning a conductive substrate into a vacuum chamber, wherein the conductive substrate is tubular and has a surface. A source electrode including a source material may be inserted into the conductive substrate. A first bias voltage ΔVac1 may be applied between the conductive substrate and the vacuum chamber and a second bias voltage ΔVas1 may be applied between the source electrode and the vacuum chamber, sputtering the source material onto the conductive substrate.

    摘要翻译： 溅射部件的方法包括将导电基板定位到真空室中，其中导电基板是管状的并具有表面。 可以将包括源材料的源电极插入到导电基板中。 可以在导电基板和真空室之间施加第一偏置电压＆amp; Vac1，并且可以在源电极和真空室之间施加第二偏压＆Dgr; Vas1，将源材料溅射到导电基板上。

    Method of in-situ displacement/stress control in electroplating
    8.
    发明授权
    Method of in-situ displacement/stress control in electroplating 有权
    电镀中原位位移/应力控制方法

    公开(公告)号：US06238539B1

    公开(公告)日：2001-05-29

    申请号：US09344729

    申请日：1999-06-25

    申请人： Richard J. Joyce ,  Ronghua Wei ,  Randall L. Kubena ,  Robert E. Doty

    发明人： Richard J. Joyce ,  Ronghua Wei ,  Randall L. Kubena ,  Robert E. Doty

    IPC分类号： C25D2112

    CPC分类号： C25D21/12

    摘要： The dominant physical parameter that affects the internal stress of electroplated metals on substrates have been identified and their effects have been systematically studied. Thin electroplated metals have very high internal stresses, even though the substrate displacements are small. Increasing the electroplated metal's thickness greatly reduces the magnitude of the stress, which can be either tensile or compressive depending on the plating conditions, but it may not necessarily reduce the displacement of the substrate. Based on the research done in connection to this application, the relationship between the plating temperatures and the current density needed to obtain near-zero-stress state for electroplated nickel on silicon substrate can be deduced.

    摘要翻译： 影响电镀金属对衬底内应力的主要物理参数已被确定，并对其影响进行了系统研究。 薄的电镀金属具有非常高的内应力，即使衬底位移较小。 增加电镀金属的厚度大大减小了应力的大小，其可以根据电镀条件而拉伸或压缩，但是它可能不一定会降低基板的位移。 基于与本申请相关的研究，可以推导出电镀温度与电解镍在硅衬底上获得接近零应力状态所需的电流密度之间的关系。

    Conformal magnetron sputter deposition
    10.
    发明授权
    Conformal magnetron sputter deposition 有权
    保形磁控溅射沉积

    公开(公告)号：US08277617B2

    公开(公告)日：2012-10-02

    申请号：US11838399

    申请日：2007-08-14

    申请人： Kuang-Tsan Kenneth Chiang ,  Ronghua Wei

    发明人： Kuang-Tsan Kenneth Chiang ,  Ronghua Wei

    IPC分类号： C23C14/00 ,  C23C14/32 ,  C25B9/00 ,  C25B11/00 ,  C25B13/00

    CPC分类号： C23C14/046 ,  C23C14/165 ,  C23C14/35 ,  C23C14/354 ,  H01J37/3405 ,  H01J37/342 ,  H01J37/3452

    摘要： An apparatus and method for magnetron sputter coating of an interior surface of a hollow substrate defining at least one irregular contour. The apparatus may contain a vacuum chamber and a target containing one or more metals having an exterior surface defining at least one irregular contour. The exterior surface of the target may be configured to conform to at least a portion of an irregular contour of the interior surface of the hollow substrate to be coated. A magnet assembly may be supplied which may include a plurality of magnets where the magnets are positioned substantially within a metallic target alloy.

    摘要翻译： 用于限定至少一个不规则轮廓的中空衬底的内表面的磁控溅射涂覆的装置和方法。 该装置可以包含真空室和包含一种或多种具有限定至少一个不规则轮廓的外表面的金属的靶。 靶的外表面可以被配置成符合待涂覆的中空基底的内表面的不规则轮廓的至少一部分。 可以提供磁体组件，其可以包括多个磁体，其中磁体基本上位于金属靶合金内。