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1.
公开(公告)号:US06350840B1
公开(公告)日:2002-02-26
申请号:US09336633
申请日:1999-06-18
申请人: Rose Ann Schultz , Donald Herr , Chaodong Xiao
发明人: Rose Ann Schultz , Donald Herr , Chaodong Xiao
IPC分类号: C08F12054
CPC分类号: H01L23/293 , C08F290/06 , C08F290/065 , C08G18/2875 , C09J4/00 , H01L2924/0002 , C08F226/02 , H01L2924/00
摘要: Underfill encapsulants are prepared from allylated amide compounds and a curing initiator.
摘要翻译: 底层填充密封剂由烯丙基化酰胺化合物和固化引发剂制备。
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2.
公开(公告)号:US06350841B1
公开(公告)日:2002-02-26
申请号:US09876721
申请日:2001-06-07
申请人: Rose Ann Schultz , Donald Herr , Chaodong Xiao
发明人: Rose Ann Schultz , Donald Herr , Chaodong Xiao
IPC分类号: C08F12058
CPC分类号: H01L23/293 , C08F290/06 , C08F290/065 , C08G18/2875 , C09J4/00 , H01L2924/0002 , C08F226/02 , H01L2924/00
摘要: This invention relates to underfill encapsulant compositions prepared from allylated amide compounds to protect and reinforce the interconnections between an electronic component and a substrate in a microelectronic device.
摘要翻译: 本发明涉及由烯丙化酰胺化合物制备的底部填充密封剂组合物,以保护和加强微电子器件中的电子部件和基底之间的互连。
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公开(公告)号:US06265530B1
公开(公告)日:2001-07-24
申请号:US09336245
申请日:1999-06-18
IPC分类号: C08G7312
CPC分类号: H01L24/29 , C08F290/06 , C08F290/065 , C08G18/282 , C08G18/2875 , C08G18/75 , C08G77/42 , C09J4/06 , C09J183/10 , H01L24/83 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29364 , H01L2224/29369 , H01L2224/29386 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/14 , H01L2924/15747 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/05432 , H01L2924/05442 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要: A thermoplastic or thermosetting curable adhesive composition for bonding an electronic component to a substrate in which the adhesive is cured in situ comprises one or more poly- or mono-functional maleimide compounds, or one or more poly- or mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers.
摘要翻译: 用于将电子部件粘合到其中粘合剂原位固化的基材的热塑性或热固性可固化粘合剂组合物包含一种或多种聚或单官能马来酰亚胺化合物,或一种或多种除了 马来酰亚胺化合物或马来酰亚胺和乙烯基化合物的组合,固化引发剂和任选的一种或多种填料。
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公开(公告)号:US20070117917A1
公开(公告)日:2007-05-24
申请号:US11474772
申请日:2006-06-26
申请人: Donald Herr , Shengqian Kong , Stijn Gillissen
发明人: Donald Herr , Shengqian Kong , Stijn Gillissen
IPC分类号: C09D5/02
CPC分类号: C08G59/24 , C08G59/4007 , C08G75/045 , C08G75/12 , H01L23/10 , H01L51/5246 , H01L2924/0002 , H01L2924/00
摘要: A curable barrier sealant comprises a curable resin having a cycloaliphatic backbone and a reactive functional group present at a level that provides an equivalent weight of less than 400 grams per mole of reactive functional group.
摘要翻译: 可固化阻挡密封剂包括具有脂环族骨架和反应性官能团的可固化树脂,其水平提供小于400克/摩尔反应性官能团的当量。
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公开(公告)号:US20070043136A1
公开(公告)日:2007-02-22
申请号:US11393496
申请日:2006-03-30
申请人: Jie Cao , Donald Herr
发明人: Jie Cao , Donald Herr
IPC分类号: B29C71/04
CPC分类号: C09J11/04 , C08K5/3415 , C08L33/02 , C08L2666/02 , C09J133/02 , Y10T428/10 , Y10T428/1059 , Y10T428/1073 , Y10T428/1082 , Y10T428/2809 , Y10T428/2852 , Y10T428/287 , Y10T428/2891 , Y10T428/31884
摘要: A radiation-curable desiccant-filled adhesive/sealant composition comprising a radiation-curable resin, one or more desiccant fillers, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.
摘要翻译: 包含辐射固化树脂,一种或多种干燥剂填料,一种或多种光引发剂或光敏剂以及任选的一种或多种无机或有机填料的可辐射固化的干燥剂填充的粘合剂/密封剂组合物。
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公开(公告)号:US20060223937A1
公开(公告)日:2006-10-05
申请号:US11098115
申请日:2005-04-04
申请人: Donald Herr , Shengqian Kong
发明人: Donald Herr , Shengqian Kong
IPC分类号: C09D5/02
CPC分类号: C08G59/24 , C08G59/4007 , C08G75/045 , C08G75/12 , H01L23/10 , H01L51/5246 , H01L2924/0002 , H01L2924/00
摘要: A curable barrier sealant comprises a curable resin having a cycloaliphatic backbone and a reactive functional group present at a level that provides an equivalent weight of less than 400 grams per mole of reactive functional group.
摘要翻译: 可固化阻挡密封剂包括具有脂环族骨架和反应性官能团的可固化树脂,其水平提供小于400克/摩尔反应性官能团的当量。
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公开(公告)号:US09735299B2
公开(公告)日:2017-08-15
申请号:US13989087
申请日:2011-11-23
申请人: Donald Herr , Brian A. Harkins
发明人: Donald Herr , Brian A. Harkins
CPC分类号: H01L31/0512 , C08K3/04 , C08K3/08 , C09J7/22 , C09J7/28 , C09J7/385 , C09J9/02 , C09J2201/602 , C09J2203/322 , C09J2205/102 , C09J2400/163 , C09J2433/00 , H01L31/022425 , Y02E10/50 , Y10T428/252 , Y10T428/256 , Y10T428/2852 , Y10T428/2857 , Y10T428/287 , Y10T428/2874 , Y10T428/2887 , Y10T428/2891 , Y10T428/2896 , Y10T442/10
摘要: A reactive pressure sensitive adhesive composition is disclosed. A tape formed using the reactive pressure sensitive adhesive is also disclosed. In its cured state, the pressure sensitive adhesive shows superior mechanical and electrical properties compared to conventional, non-curable charge collection tapes. The tape has a cure profile pre-selected to correspond to that of a photovoltaic cell fabrication process, such that curing can take place during cell fabrication and may occur simultaneously with one or more other curing steps employed in cell fabrication.
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公开(公告)号:US20070203254A1
公开(公告)日:2007-08-30
申请号:US11789873
申请日:2007-04-26
申请人: Yuxia Liu , Donald Herr
发明人: Yuxia Liu , Donald Herr
IPC分类号: C08J3/28 , C08G59/68 , C07C381/00 , C07D335/10
CPC分类号: C07C381/12 , C07D335/16 , C08G59/688 , G03F7/0045 , G03F7/038 , Y10S430/122 , Y10S430/123 , Y10S430/124 , Y10S430/125 , Y10S430/126
摘要: Sulfonium salt photoinitiator compositions, precursors useful in the preparation of such photoinitiators and the use of these photoinitiators in, e.g., UV curable adhesives, UV curable sealants, UV curable coating compositions, such as printing inks and varnishes, and UV curable encapsulants.
摘要翻译: 锍盐光引发剂组合物,可用于制备这种光引发剂的前体和这些光引发剂在例如UV可固化粘合剂,UV可固化密封剂,UV可固化涂料组合物如印刷油墨和清漆中的用途以及UV可固化的密封剂。
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公开(公告)号:US20060009539A1
公开(公告)日:2006-01-12
申请号:US10889202
申请日:2004-07-12
申请人: Donald Herr , Darwin Bull
发明人: Donald Herr , Darwin Bull
IPC分类号: C07D209/48
CPC分类号: C08J3/246 , C08F255/00 , C08F257/02 , C08F287/00 , C08F291/00 , C08K5/0025 , C08K5/3415 , C08L51/003 , C08L51/006 , C08L2666/02
摘要: The invention is directed to aromatic maleimides as photocrosslinkers for unsaturated compositions. The maleimides utilized are multifunctional, and are attached to a polymeric backbone. As such, they are polymeric or polymer-bound photoinitiators/photocrosslinkers. The polymeric maleimides are necessarily aromatic, but may or may not exhibit substituents at the 3- and 4-position of the maleimide ring. These maleimide photocrosslinkers may be used alone or in conjunction with a photosensitizer to effectively crosslink unsaturated materials.
摘要翻译: 本发明涉及芳族马来酰亚胺作为不饱和组合物的光交联剂。 所使用的马来酰亚胺是多功能的,并且连接到聚合物主链上。 因此,它们是聚合物或聚合物结合的光引发剂/光致交联剂。 聚合马来酰亚胺必须是芳族的,但在马来酰亚胺环的3-和4-位上可以或不表现出取代基。 这些马来酰亚胺光交联剂可以单独使用或与光敏剂结合使用以有效地交联不饱和物质。
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公开(公告)号:US20050095528A1
公开(公告)日:2005-05-05
申请号:US10700754
申请日:2003-11-04
申请人: Yuxia Liu , Donald Herr
发明人: Yuxia Liu , Donald Herr
IPC分类号: C07C19/075 , C07C381/12 , C07D335/10 , C07D335/16 , C08F2/50 , C08G59/00 , C09D7/12 , C09D163/00 , C09D201/02 , C09J11/06 , C09J201/02 , C09K3/10 , G03C1/76
CPC分类号: C07C381/12 , C07D335/16 , C08G59/688 , G03F7/0045 , G03F7/038 , Y10S430/122 , Y10S430/123 , Y10S430/124 , Y10S430/125 , Y10S430/126
摘要: Sulfonium salt photoinitiator compositions, precursors useful in the preparation of such photoinitiators and the use of these photoinitiators in, e.g., UV curable adhesives, UV curable sealants, UV curable coating compositions, such as printing inks and varnishes, and UV curable encapsulants.
摘要翻译: 锍盐光引发剂组合物,可用于制备这种光引发剂的前体和这些光引发剂在例如UV可固化粘合剂,UV可固化密封剂,UV可固化涂料组合物如印刷油墨和清漆中的用途以及UV可固化的密封剂。
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