公开(公告)号：US07544727B2

公开(公告)日：2009-06-09

申请号：US11260463

申请日：2005-10-28

申请人： Ryoichi Ikezawa ,  Masanobu Fujii ,  Shinsuke Hagiwara

发明人： Ryoichi Ikezawa ,  Masanobu Fujii ,  Shinsuke Hagiwara

IPC分类号： C08K3/36 ,  C08K7/18 ,  C08L61/08 ,  C08L61/12 ,  C08L63/02 ,  C08L63/04 ,  H01L21/56 ,  H01L23/29

CPC分类号： H01L23/293 ,  C08K5/521 ,  C08K5/5455 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  Y10T428/31511 ,  C08L63/00 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein.The encapsulating epoxy resin molding material for thin semiconductor devices according to this invention is excellent in fluidity, and the semiconductor device encapsulated therein, which is a semiconductor device having a semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or on a mounted substrate such as organic substrate or organic film, is free of molding defects such as wire sweep, voids etc. as shown in the Examples, and thus its industrial value is significant.

摘要翻译： 一种包封环氧树脂成型材料，其包含（A）环氧树脂，（B）固化剂和（C）具有仲氨基或（D）磷酸酯的硅烷偶联剂以及封装在其中的半导体器件。 根据本发明的用于薄半导体器件的封装环氧树脂模制材料具有优异的流动性，并且封装在其中的半导体器件是半导体器件，半导体器件具有布置在薄的多引脚长线，窄焊盘 或者在有机基板或有机膜等的安装基板上，如实施例所示，没有成型缺陷，例如电线扫描，空隙等，因此其工业价值是显着的。

公开(公告)号：US20060074150A1

公开(公告)日：2006-04-06

申请号：US11260463

申请日：2005-10-28

申请人： Ryoichi Ikezawa ,  Masanobu Fujii ,  Shinsuke Hagiwara

发明人： Ryoichi Ikezawa ,  Masanobu Fujii ,  Shinsuke Hagiwara

IPC分类号： C08L63/00 ,  H01L21/56 ,  B32B27/38

CPC分类号： H01L23/293 ,  C08K5/521 ,  C08K5/5455 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  Y10T428/31511 ,  C08L63/00 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein. The encapsulating epoxy resin molding material for thin semiconductor devices according to this invention is excellent in fluidity, and the semiconductor device encapsulated therein, which is a semiconductor device having a semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or on a mounted substrate such as organic substrate or organic film, is free of molding defects such as wire sweep, voids etc. as shown in the Examples, and thus its industrial value is significant.

摘要翻译： 一种包封环氧树脂成型材料，其包含（A）环氧树脂，（B）固化剂和（C）具有仲氨基或（D）磷酸酯的硅烷偶联剂和封装在其中的半导体器件。 根据本发明的用于薄半导体器件的封装环氧树脂模制材料具有优异的流动性，并且封装在其中的半导体器件是半导体器件，半导体器件具有布置在薄的多引脚长线，窄焊盘 或者在有机基板或有机膜等的安装基板上，如实施例所示，没有成型缺陷，例如电线扫描，空隙等，因此其工业价值是显着的。

公开(公告)号：US20060214153A1

公开(公告)日：2006-09-28

申请号：US10552441

申请日：2004-04-07

申请人： Ryoichi Ikezawa ,  Naoki Nara ,  Hideyuki Chaki ,  Yoshihiro Mizukami ,  Yoshinori Endou ,  Takaki Kashihara ,  Fumio Furusawa ,  Masaki Yoshii ,  Shinsuke Hagiwara ,  Mitsuo Katayose

发明人： Ryoichi Ikezawa ,  Naoki Nara ,  Hideyuki Chaki ,  Yoshihiro Mizukami ,  Yoshinori Endou ,  Takaki Kashihara ,  Fumio Furusawa ,  Masaki Yoshii ,  Shinsuke Hagiwara ,  Mitsuo Katayose

IPC分类号： H01L29/08 ,  C08G59/14

CPC分类号： H01L23/295 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/00 ,  H01L2224/0401

摘要： 1. An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 μm or less and a specific surface area of 3.0 m2/g or more.

摘要翻译： 1.一种包封环氧树脂成型材料，其包含（A）环氧树脂，（B）固化剂和（C）无机填料，其中所述无机填料（C）的平均粒径为12μm以下， 比表面积为3.0m 2 / g以上。

公开(公告)号：US07397139B2

公开(公告)日：2008-07-08

申请号：US10552441

申请日：2004-04-07

申请人： Ryoichi Ikezawa ,  Naoki Nara ,  Hideyuki Chaki ,  Yoshihiro Mizukami ,  Yoshinori Endou ,  Takaki Kashihara ,  Fumio Furusawa ,  Masaki Yoshii ,  Shinsuke Hagiwara ,  Mitsuo Katayose

发明人： Ryoichi Ikezawa ,  Naoki Nara ,  Hideyuki Chaki ,  Yoshihiro Mizukami ,  Yoshinori Endou ,  Takaki Kashihara ,  Fumio Furusawa ,  Masaki Yoshii ,  Shinsuke Hagiwara ,  Mitsuo Katayose

IPC分类号： H01L23/28

CPC分类号： H01L23/295 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/00 ,  H01L2224/0401

摘要： An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 μm or less and a specific surface area of 3.0 m2/g or more.

摘要翻译： 一种封装环氧树脂成型材料，其包含（A）环氧树脂，（B）固化剂和（C）无机填料，其中，所述无机填料（C）的平均粒径为12μm以下， 表面积为3.0m 2 / g以上。

公开(公告)号：US20090137717A1

公开(公告)日：2009-05-28

申请号：US11995372

申请日：2006-07-13

申请人： Ryoichi Ikezawa ,  Hidetaka Yoshizawa ,  Seiichi Akagi

发明人： Ryoichi Ikezawa ,  Hidetaka Yoshizawa ,  Seiichi Akagi

IPC分类号： C08K3/22

CPC分类号： C08L63/00 ,  C08K3/22 ,  H01L23/293 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00

摘要： The present invention relates to an encapsulated epoxy resin composition containing an epoxy resin (A), a hardening agent (B), and magnesium hydroxide (C), the magnesium hydroxide (C) comprising magnesium hydroxide particles with its crystal appearance in a hexagonal column shape having two hexagonal top and bottom base faces in parallel with each other and six peripheral prism faces formed between the base faces and having a length in the c-axis direction of 1.5×10−6 to 6.0×10−6 m, and provides an encapsulated epoxy resin composition favorable as a sealer for VLSI's that is superior in flame resistance and also in reliability such as moldability, reflow resistance, moisture resistance and high temperature storage characteristics and an electronic component device containing an element sealed with the composition.

摘要翻译： 本发明涉及包含环氧树脂（A），硬化剂（B）和氢氧化镁（C）的包封的环氧树脂组合物，所述氢氧化镁（C）包含氢氧化镁颗粒，其晶体外观为六方柱 具有彼此平行的两个六边形顶部和底部基面的形状，以及形成在基面之间并且在c轴方向上的长度为1.5×10 -6至6.0×10 -6 m的六个圆周棱镜面，并且提供了封装 环氧树脂组合物作为具有优异的阻燃性以及成型性，耐回流性，耐湿性和高温储存特性等可靠性的VLSI的密封剂，以及包含用该组合物密封的元素的电子部件装置。

公开(公告)号：US20080039556A1

公开(公告)日：2008-02-14

申请号：US11572155

申请日：2005-07-12

申请人： Ryoichi Ikezawa ,  Hidetaka Yoshizawa ,  Seiichi Akagi

发明人： Ryoichi Ikezawa ,  Hidetaka Yoshizawa ,  Seiichi Akagi

IPC分类号： C08L63/00 ,  C08K9/02

CPC分类号： C08L63/00 ,  C08G59/1483 ,  C08G59/621 ,  C08K9/02

摘要： The present invention relates to an encapsulated epoxy-resin molding compound, comprising an epoxy resin (A), a hardening agent (B), and magnesium hydroxide (C), wherein the magnesium hydroxide (C) contains magnesium hydroxide coated with silica, and provides a non-halogenated and non-antimony encapsulated epoxy-resin molding compound superior in flame resistance moldability and also in reliability such as reflow resistance, moisture resistance, high-temperature storage stability, and thus, favorable for sealing VLSI, and an electronic component device carrying an element sealed with the molding compound.

摘要翻译： 本发明涉及包含环氧树脂（A），硬化剂（B）和氢氧化镁（C）的包封的环氧树脂模塑料，其中氢氧化镁（C）含有用二氧化硅涂覆的氢氧化镁，以及 提供了耐火成型性优异的非卤化和非锑封装的环氧树脂模塑料，以及耐回流性，耐湿性，高温储存稳定性等可靠性，因此有利于密封VLSI，电子部件 携带用模塑料密封的元件的装置。

公开(公告)号：US20050222300A1

公开(公告)日：2005-10-06

申请号：US10505008

申请日：2003-01-14

申请人： Ryoichi Ikezawa ,  Takayuki Akimoto ,  Yoshihiro Takahashi ,  Mitsuo Katayose ,  Naoki Watanabe ,  Shinya Nakamura

发明人： Ryoichi Ikezawa ,  Takayuki Akimoto ,  Yoshihiro Takahashi ,  Mitsuo Katayose ,  Naoki Watanabe ,  Shinya Nakamura

IPC分类号： C08G65/26 ,  H01L23/29 ,  C08L63/00

CPC分类号： C08G65/2654 ,  H01L23/296 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： There is disclosed an encapsulating epoxy resin composition, containing an epoxy resin (A), a curing agent (B), and a composite metal hydroxide (C), and having a mold release force under shearing after 10 shots of molding which is less than or equal to 200 KPa. The resin composition is preferably applied for encapsulating a semiconductor device having at least one of features including: (a) at least one of an encapsulating material of an upper side of a semiconductor chip and an encapsulating material of a lower side of the semiconductor chip has a thickness less than or equal to 0.7 mm; (b) a pin count is greater than or equal to 80; (c) a wire length is greater than or equal to 2 mm; (d) a pad pitch on the semiconductor chip is less than or equal to 90 (m; (e) a thickness of a package, in which the semiconductor chip is disposed on a mounting substrate, is less than or equal to 2 mm; and (f) an area of the semiconductor chip is greater than or equal to 25 mm2.

摘要翻译： 公开了一种包含环氧树脂（A），固化剂（B）和复合金属氢氧化物（C）的封装环氧树脂组合物，并且在10次成型后具有在剪切下的脱模力小于 或等于200KPa。 树脂组合物优选地用于封装具有以下特征中的至少一个的半导体器件：（a）半导体芯片的上侧的封装材料和半导体芯片的下侧的封装材料中的至少一个具有 厚度小于或等于0.7mm; （b）引脚数大于或等于80; （c）电线长度大于或等于2mm; （d）半导体芯片上的焊盘间距小于或等于90（m;（e）半导体芯片设置在安装基板上的封装的厚度小于或等于2mm; 和（f）半导体芯片的面积大于或等于25mm 2。

公开(公告)号：US20060014873A1

公开(公告)日：2006-01-19

申请号：US10504513

申请日：2003-01-14

申请人： Ryoichi Ikezawa ,  Takayuki Akimoto ,  Yoshihiro Takahashi ,  Mitsuo Katayose

发明人： Ryoichi Ikezawa ,  Takayuki Akimoto ,  Yoshihiro Takahashi ,  Mitsuo Katayose

IPC分类号： C08K3/22

CPC分类号： H01L23/296 ,  C08K3/22 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  C08L63/00 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： There is disclosed an encapsulating epoxy resin composition, containing an epoxy resin (A), a curing agent (B), and a composite metal hydroxide (C), and having a disk flow greater than or equal to 80 mm. The resin composition is preferably applied for encapsulating a semiconductor device having at least one of features including: (a) at least one of an encapsulating material of an upper side of a semiconductor chip and an encapsulating material of a lower side of the semiconductor chip has a thickness less than or equal to 0.7 mm; (b) a pin count is greater than or equal to 80; (c) a wire length is greater than or equal to 2 mm; (d) a pad pitch on the semiconductor chip is less than or equal to 90 μm; (e) a thickness of a package, in which the semiconductor chip is disposed on a mounting substrate, is less than or equal to 2 mm; and (f) an area of the semiconductor chip is greater than or equal to 25 mm2.

摘要翻译： 公开了包含环氧树脂（A），固化剂（B）和复合金属氢氧化物（C），并且具有大于或等于80mm的盘流动的封装环氧树脂组合物。 树脂组合物优选地用于封装具有以下特征中的至少一个的半导体器件：（a）半导体芯片的上侧的封装材料和半导体芯片的下侧的封装材料中的至少一个具有 厚度小于或等于0.7mm; （b）引脚数大于或等于80; （c）电线长度大于或等于2mm; （d）半导体芯片上的焊盘间距小于或等于90μm; （e）半导体芯片设置在安装基板上的封装的厚度小于或等于2mm; 和（f）半导体芯片的面积大于或等于25mm 2。

公开(公告)号：US20140128505A1

公开(公告)日：2014-05-08

申请号：US14116979

申请日：2012-05-10

申请人： Mitsuyoshi Hamada ,  Fumio Furusawa ,  Ryoichi Ikezawa ,  Keizo Takemiya ,  Toru Baba

发明人： Mitsuyoshi Hamada ,  Fumio Furusawa ,  Ryoichi Ikezawa ,  Keizo Takemiya ,  Toru Baba

IPC分类号： C09K3/10

CPC分类号： C08K7/18 ,  C08G59/063 ,  C08G59/08 ,  C08G59/621 ,  C08G59/688 ,  C08K3/36 ,  C08K2201/005 ,  C08K2201/006 ,  C08L63/00 ,  C09K3/1006 ,  C09K2003/1078 ,  H01L23/296 ,  H01L2924/0002 ,  H01L2924/00

摘要： An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.

摘要翻译： 用于密封的环氧树脂成型材料包括（A）环氧树脂，（B）固化剂，（C）固化促进剂，（D）无机填料，（E1）含芳基氨基的烷氧基硅烷化合物和（E2 ）含环氧基的烷氧基硅烷化合物。

公开(公告)号：US20090143511A1

公开(公告)日：2009-06-04

申请号：US11572162

申请日：2005-07-12

申请人： Ryoichi Ikezawa ,  Hidetaka Yoshizawa ,  Seiichi Akagi

发明人： Ryoichi Ikezawa ,  Hidetaka Yoshizawa ,  Seiichi Akagi

IPC分类号： C08K5/523 ,  C08K3/22 ,  C08K5/098

CPC分类号： C08L63/00 ,  C08G59/621 ,  C08K3/22 ,  C08K5/523 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： The present invention relates to an encapsulated epoxy-resin molding compound, comprising an epoxy resin (A), a hardening agent (B), and magnesium hydroxide (C), wherein the magnesium hydroxide (C) has a [101]/[001] peak intensity ratio of 0.9 or more as determined by X-ray diffraction, a BET specific surface area of 1 to 4 m2/g, and an average particle diameter of 5 μm or less, and provides an encapsulated epoxy-resin molding compound superior in flame resistance moldability and also in reliability such as reflow resistance, moisture resistance, high-temperature storage stability, and thus, favorable for sealing VLSI, and an electronic component device carrying an element sealed with the molding compound.

摘要翻译： 本发明涉及包含环氧树脂（A），硬化剂（B）和氢氧化镁（C）的包封的环氧树脂模塑料，其中氢氧化钙（C）具有[101] / [001 ]峰强度比为0.9以上，通过X射线衍射测定，BET比表面积为1〜4m 2 / g，平均粒径为5μm以下，并且提供了包封的环氧树脂模塑料 耐燃性成型性以及耐回流性，耐湿性，高温保存稳定性等的可靠性，有利于密封VLSI的电子部件装置以及携带用模塑料密封的元件的电子部件装置。