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1.发明授权Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate 有权环氧树脂，固化剂和仲氨基硅烷偶联剂或磷酸盐的密封剂公开(公告)号：US07544727B2
公开(公告)日：2009-06-09
申请号：US11260463
申请日：2005-10-28
CPC分类号： H01L23/293 , C08K5/521 , C08K5/5455 , H01L24/97 , H01L2224/05554 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49175 , H01L2224/73265 , H01L2224/97 , H01L2924/09701 , H01L2924/12044 , H01L2924/1301 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , Y10T428/31511 , C08L63/00 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein.The encapsulating epoxy resin molding material for thin semiconductor devices according to this invention is excellent in fluidity, and the semiconductor device encapsulated therein, which is a semiconductor device having a semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or on a mounted substrate such as organic substrate or organic film, is free of molding defects such as wire sweep, voids etc. as shown in the Examples, and thus its industrial value is significant.
摘要翻译： 一种包封环氧树脂成型材料，其包含（A）环氧树脂，（B）固化剂和（C）具有仲氨基或（D）磷酸酯的硅烷偶联剂以及封装在其中的半导体器件。 根据本发明的用于薄半导体器件的封装环氧树脂模制材料具有优异的流动性，并且封装在其中的半导体器件是半导体器件，半导体器件具有布置在薄的多引脚长线，窄焊盘 或者在有机基板或有机膜等的安装基板上，如实施例所示，没有成型缺陷，例如电线扫描，空隙等，因此其工业价值是显着的。
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公开(公告)号：US20060074150A1
公开(公告)日：2006-04-06
申请号：US11260463
申请日：2005-10-28
CPC分类号： H01L23/293 , C08K5/521 , C08K5/5455 , H01L24/97 , H01L2224/05554 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49175 , H01L2224/73265 , H01L2224/97 , H01L2924/09701 , H01L2924/12044 , H01L2924/1301 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , Y10T428/31511 , C08L63/00 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein. The encapsulating epoxy resin molding material for thin semiconductor devices according to this invention is excellent in fluidity, and the semiconductor device encapsulated therein, which is a semiconductor device having a semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or on a mounted substrate such as organic substrate or organic film, is free of molding defects such as wire sweep, voids etc. as shown in the Examples, and thus its industrial value is significant.
摘要翻译： 一种包封环氧树脂成型材料，其包含（A）环氧树脂，（B）固化剂和（C）具有仲氨基或（D）磷酸酯的硅烷偶联剂和封装在其中的半导体器件。 根据本发明的用于薄半导体器件的封装环氧树脂模制材料具有优异的流动性，并且封装在其中的半导体器件是半导体器件，半导体器件具有布置在薄的多引脚长线，窄焊盘 或者在有机基板或有机膜等的安装基板上，如实施例所示，没有成型缺陷，例如电线扫描，空隙等，因此其工业价值是显着的。
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公开(公告)号：US4717811A
公开(公告)日：1988-01-05
申请号：US913251
申请日：1986-09-30
申请人： Masanobu Fujii
发明人： Masanobu Fujii
摘要： A humidity detector includes a first heat-sensing element for an electric signal corresponding to the temperature of steam to be detected and a second heat-sensing element for an atmosphere temperature whose vapor is to be detected or a temperature close to it. A comparator compares the electric signals from the first and second heat-sensing elements. The vapor detection characteristics may be adjusted through variation in the heating temperature of the first heat-sensing element.
摘要翻译： 湿度检测器包括用于与要检测的蒸汽的温度相对应的电信号的第一热敏元件和用于要检测蒸汽的气氛温度或接近其的温度的第二热敏元件。 比较器比较来自第一和第二感温元件的电信号。 可以通过第一感热元件的加热温度的变化来调节蒸汽检测特性。
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公开(公告)号：US4803324A
公开(公告)日：1989-02-07
申请号：US134551
申请日：1987-12-15
申请人： Masanobu Fujii , Tatsuya Tsuda
发明人： Masanobu Fujii , Tatsuya Tsuda
IPC分类号： H05B6/80
CPC分类号： H05B6/6494 , H05B6/6482
摘要： A heating appliance including a microwave heating source for heating an object, and an infrared ray heating source for heating the object in response to the operation of the microwave heating source by receiving energy from the microwave heating source and thus radiating infrared rays. Therefore, infrared ray heating is carried out in addition to the microwave heating.
摘要翻译： 一种加热器具，包括用于加热物体的微波加热源和用于通过从微波加热源接收能量并因此辐射红外线而响应微波加热源的操作来加热物体的红外线加热源。 因此，除了微波加热之外还进行红外线加热。
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公开(公告)号：US20120163438A1
公开(公告)日：2012-06-28
申请号：US13393962
申请日：2010-08-24
IPC分类号： H04L29/02
CPC分类号： H04B1/001 , H04B1/1036 , H04B2001/1045 , H04B2001/1072
摘要： A signal processing device includes a mixer 6 to perform frequency conversion of a received high-frequency signal into an intermediate-frequency signal corresponding to signal components of a desired channel, an ADC 8 to convert the intermediate-frequency signal into a digital signal, and a digital demodulation unit 300 to demodulate the digital signal. The demodulation unit 300 includes a band limiting filter 9 to switch a pass band for the digital signal, and a detecting unit 10 to detect a power distribution of the signal components of the desired channel and a power distribution of signal components of a neighboring channel adjacent to the desired channel from the digital signal before being input to the filter 9, wherein the pass band of the filter 9 is switched to a pass band selected based on the power distributions of the desired and neighboring channels detected by the detecting unit 10.
摘要翻译： 信号处理装置包括混频器6，用于将接收到的高频信号进行频率转换为对应于期望信道的信号分量的中频信号，ADC 8将中频信号转换为数字信号;以及 一个解调数字信号的数字解调单元300。 解调单元300包括用于切换数字信号的通带的带限滤波器9和检测单元10，用于检测所需信道的信号分量的功率分布和相邻信道相邻信道的信号分量的功率分布 在输入到滤波器9之前从数字信号到期望的信道，其中滤波器9的通带被切换到基于由检测单元10检测到的期望和相邻信道的功率分布所选择的通带。
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公开(公告)号：US06768052B2
公开(公告)日：2004-07-27
申请号：US10279597
申请日：2002-10-24
申请人： Tsukasa Yamada , Ren Sugiyama , Masanobu Fujii
发明人： Tsukasa Yamada , Ren Sugiyama , Masanobu Fujii
IPC分类号： H05K900
CPC分类号： H05K1/0218 , H05K1/0393
摘要： In a flexible printed circuit (10) for electrically connecting between a fixed portion and a movable portion comprising a flexible base layer (11), a conductive layer (13) formed on a principal surface (11a) of the flexible base layer through a first adhesive agent (12), and a cover lay (15) formed on the conductive layer through a second adhesive agent (14), copper foil (22) is pasted on an upper surface (15a) of the cover lay through a conductive adhesive agent (21). The copper foil is electrically connected to a ground portion (110) using solder. The fixed portion may be an optical disc drive's body (300). The movable portion may be an optical pickup unit (100) comprising an electromagnetic radiation source (200). The copper foil is for shielding electromagnetic noises radiated from the electromagnetic radiation source. The copper foil may be disposed only the vicinity of the electromagnetic radiation source.
摘要翻译： 在柔性印刷电路（10）中，用于电连接固定部分和包括柔性基底层（11）的可移动部分之间的导电层（13），所述导电层（13）通过第一 粘合剂（12）和通过第二粘合剂（14）形成在导电层上的覆盖层（15），铜箔（22）被粘贴在盖的上表面（15a）上，通过导电粘合剂 （21）。 铜箔使用焊料电连接到接地部分（110）。 固定部分可以是光盘驱动器本体（300）。 可移动部分可以是包括电磁辐射源（200）的光学拾取单元（100）。 铜箔用于屏蔽从电磁辐射源辐射的电磁噪声。 铜箔可以仅设置在电磁辐射源附近。
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公开(公告)号：US4986865A
公开(公告)日：1991-01-22
申请号：US437609
申请日：1989-11-17
申请人： Masanobu Fujii
发明人： Masanobu Fujii
IPC分类号： B29C43/18 , B29C51/00 , B29C51/08 , B29C51/14 , B29C51/26 , B29C51/32 , B29C63/04 , B29C69/02 , B29L9/00 , B29L31/58 , B32B7/04 , B60R13/02
CPC分类号： B32B7/04 , B29C43/184 , B29C51/14 , B29C63/04 , B29C2793/00 , B29C51/00 , B29C51/082 , B29L2007/002 , B29L2009/00 , B29L2031/3005 , B60R13/02 , B60R13/0225 , Y10T156/1031 , Y10T156/1034 , Y10T156/1049 , Y10T156/1051 , Y10T156/108
摘要： Disclosed herein is a method of producing a trim board, which comprises by steps: (a) hot-pressing trimming and piercing a resin-impregnated substrate at the same time to produce a shaped substrate; (b) laying an outer skin member onto one surface of the shaped substrate with an interposal of a hot-melt sheet therebetween; (c) pressing the outer skin member against the shaped substrate while the shaped substrate is still hot, thereby to produce a skin covered unfinished trim board; (d) trimming and piercing the outer skin member at portions which correspond to the portions of the shaped substrate at which the trimming and piercing have been carried out at the step (a), the step (d) being so made that a peripheral portion of the outer skin member at which the trimming and piercing have been effected protrudes by a certain degree beyond a peripheral edge of the shaped substrate at which the trimming and piercing have been effected; and (e) turning back the protruding peripheral portion of the outer skin member and fixing the same to a peripheral back portion of the shaped substrate.
摘要翻译： 本发明公开了一种修剪板的制造方法，该方法包括以下步骤：（a）同时热压修整和刺穿树脂浸渍的基材，以制造成形基板; （b）将外皮部件放置在成形基板的一个表面上，其间夹有热熔片; （c）在成形基板仍然热的同时将外皮部件压靠在成形基板上，从而产生皮肤覆盖的未完成的装饰板; （d）在步骤（a）中对应于已经进行修整穿孔的成形基板的部分的部分修剪和刺穿外皮部件，步骤（d）使得外围部分 已经进行修整和刺穿的外部皮肤部件在一定程度上突出了已经进行修整和穿孔的成形基板的周边边缘; 和（e）使外皮部件的突出周边部分回转并将其固定到成形基板的周向后部。
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公开(公告)号：US4870255A
公开(公告)日：1989-09-26
申请号：US261903
申请日：1988-10-25
申请人： Masanobu Fujii , Tatsuya Tsuda
发明人： Masanobu Fujii , Tatsuya Tsuda
IPC分类号： H05B6/80
CPC分类号： H05B6/6494 , H05B6/6482
摘要： A heating appliance including a heat source for heating air, a convection fan for blowing the heated air into a heating chamber, and an infrared radiator disposed in the path of the heated air.
摘要翻译： 一种加热装置，包括用于加热空气的热源，用于将加热空气吹入加热室的对流风扇和设置在加热空气的路径中的红外辐射器。
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9.发明授权公开(公告)号：US06211277B1
公开(公告)日：2001-04-03
申请号：US09165202
申请日：1998-10-02
申请人： Tatsuo Kawata , Hiroki Sashima , Takaki Kashihara , Masanobu Fujii , Naoki Nara , Terumi Tsukahara , Hiroyuki Sakai
发明人： Tatsuo Kawata , Hiroki Sashima , Takaki Kashihara , Masanobu Fujii , Naoki Nara , Terumi Tsukahara , Hiroyuki Sakai
IPC分类号： C08K300
CPC分类号： H01L23/4951 , C08G59/245 , C08G59/687 , C08K3/40 , C08L63/00 , H01L24/45 , H01L24/48 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2924/01019 , H01L2924/0102 , H01L2924/01068 , H01L2924/01079 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： An LOC structure semiconductor device having a good solder heat resistance without electrical characteristic failures due to damages to the passivation film and the diffusion layer thereunder attributing to the filler can be obtained by encapsulating an LOC structure semiconductor chip with an encapsulating material comprising an epoxy resin, a curing agent, a curing promoter, and an inorganic filler, the filler having a smaller particle size than the distance between a inner lead and a semiconductor chip and being in an amount of 80 to 95% by weight based on the total weight of the encapsulating material.
摘要翻译： 通过用包含环氧树脂的封装材料封装LOC结构半导体芯片，可以获得具有良好的焊料耐热性而没有电特性故障的LOC结构半导体器件，这是由于由于对填料引起的钝化膜及其扩散层的损害， 固化剂，固化促进剂和无机填料，所述填料的粒径小于内引线和半导体芯片之间的距离，并且基于所述填料的总重量为80〜95重量％ 封装材料。
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10.发明授权Biphenyl epoxy resin, naphthalene-containing phenolic resin and accelerator triphenylphosphine/p-benzoquinone 失效联苯环氧树脂，含萘酚醛树脂和促进剂三苯基膦/对苯醌公开(公告)号：US06194491B1
公开(公告)日：2001-02-27
申请号：US09166128
申请日：1998-10-05
申请人： Masanobu Fujii , Haruaki Sue , Shinya Yamada
发明人： Masanobu Fujii , Haruaki Sue , Shinya Yamada
IPC分类号： C08K336
CPC分类号： H01L23/295 , C08G59/245 , C08L63/00 , H01L2924/0002 , C08L2666/22 , C08L61/04 , H01L2924/00
摘要： An epoxy resin composition comprises (A) a biphenyl epoxy resin, (B) a phenolic resin curing agent having a naphthalene structure, (C) a curing accelerator comprising an addition product of a triphenylphosphine and benzoquinone, and (D) an inorganic filler contained in an amount of 85 to 95% by weight based on the total amount of the composition, and a semiconductor device encapsulated by this resin composition.
摘要翻译： 环氧树脂组合物包含（A）联苯基环氧树脂，（B）具有萘结构的酚醛树脂固化剂，（C）包含三苯基膦和苯醌的加成产物的固化促进剂和（D）含有 相对于组合物的总量为85〜95重量％，由该树脂组合物包封的半导体装置。
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