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公开(公告)号：US11107743B2
公开(公告)日：2021-08-31
申请号：US16673127
申请日：2019-11-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seung-Tae Hwang , Jae-Choon Kim , Kyung-Suk Oh , Woon-Bae Kim , Jae-Min Jung
IPC: H01L23/31 , H01L23/498 , H05K1/14
Abstract: A chip on film package includes; a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.
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2.发明授权公开(公告)号：US09362333B2
公开(公告)日：2016-06-07
申请号：US14327138
申请日：2014-07-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jae-Min Jung , Jeong-Kyu Ha
IPC: H01L27/15 , H01L23/498 , H01L23/538 , H01L23/14 , H01L23/00
CPC classification number: H01L27/15 , H01L23/145 , H01L23/4985 , H01L23/5387 , H01L24/16 , H01L2224/131 , H01L2224/16227 , H01L2224/73204 , H01L2924/12041 , H01L2924/12044 , H01L2924/00 , H01L2924/014
Abstract: Semiconductor packages are provided. A semiconductor package may include a semiconductor chip. The semiconductor package may include a substrate and first and second conductive regions on the substrate. In some embodiments, the substrate may be a flexible substrate, and the first and second conductive regions may be on the same surface of the flexible substrate. Display devices including semiconductor packages are also provided. In some embodiments, a display device may include a flexible substrate that is bent such that first and second conductive regions thereof are connected to each other via an intervening third conductive region.
Abstract translation: 提供半导体封装。 半导体封装可以包括半导体芯片。 半导体封装可以包括衬底和衬底上的第一和第二导电区域。 在一些实施例中，衬底可以是柔性衬底，并且第一和第二导电区域可以在柔性衬底的相同表面上。 还提供了包括半导体封装的显示装置。 在一些实施例中，显示装置可以包括弯曲的柔性基板，使得其第一和第二导电区域经由居间的第三导电区域相互连接。
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公开(公告)号：US09313889B2
公开(公告)日：2016-04-12
申请号：US14262658
申请日：2014-04-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyoungsuk Yang , Jeong-Kyu Ha , PaLan Lee , Narae Shin , Soyoung Lim , Jae-Min Jung , KyongSoon Cho
CPC classification number: H05K1/118 , H05K1/147 , H05K1/189 , H05K2201/0949 , H05K2201/10128
Abstract: Provided is a display apparatus. The display apparatus includes a display panel, a flexible circuit film having a rear surface connected to the display panel, and a front surface opposite to the rear surface, the front surface having a chip mounted thereon, and a first lead bonding portion electrically connecting the chip to the display panel. The first lead bonding portion includes a first portion connected to the chip and overlying a portion of the flexible circuit film, a second portion passing through the flexible circuit film, and a third portion disposed between the flexible circuit film and the display panel on the rear surface of the flexible circuit film, where the third portion overlaps the first portion.
Abstract translation: 提供了一种显示装置。 显示装置包括显示面板，具有连接到显示面板的后表面的柔性电路薄膜和与背面相对的前表面，前表面具有安装在其上的芯片，以及第一引线接合部分， 芯片到显示面板。 第一引线接合部分包括连接到芯片并覆盖柔性电路膜的一部分的第一部分，穿过柔性电路膜的第二部分和设置在柔性电路膜和后面的显示面板之间的第三部分 柔性电路膜的表面，其中第三部分与第一部分重叠。
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4.发明公开公开(公告)号：US20240079311A1
公开(公告)日：2024-03-07
申请号：US18229035
申请日：2023-08-01
Applicant: SAMSUNG ELECTRONICS CO.,LTD
Inventor： Seung Hyun CHO , Jeong-Kyu Ha , Jae-Min Jung
IPC: H01L23/498 , B32B7/12 , B32B27/06
CPC classification number: H01L23/4985 , B32B7/12 , B32B27/06 , H01L23/49822 , H01L24/16 , H01L2224/16225
Abstract: A semiconductor package includes a film substrate; a wiring layer provided on the film substrate; and a semiconductor chip provided on the wiring layer and electrically connected to the wiring layer. The film substrate includes a first layer, wherein the first layer is an insulating layer having the wiring layer thereon. The film substrate further includes a second layer, wherein the second layer is attached to a bottom of the first layer and comprises a gas. The second layer is configured to be peeled off of the first layer.
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公开(公告)号：US09280182B2
公开(公告)日：2016-03-08
申请号：US14195352
申请日：2014-03-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jeong-Kyu Ha , Kwan-Jai Lee , Jae-Min Jung , Kyong-Soon Cho , Na-Rae Shin , Kyoung-Suk Yang , Pa-Lan Lee , So-Young Lim
CPC classification number: G06F3/0412 , G06F1/1626 , G06F1/1637 , G06F1/1643 , G06F1/1652 , G06F3/0416 , G06F2203/04102 , H01L27/323 , H01L27/3276 , H01L2251/5338
Abstract: A chip on film package includes a flexible base film having a first surface and a second surface opposite to each other that includes at least one through hole therein, a plurality of wirings disposed on the first surface and the second surface of the base film, respectively, that include a first lead and a second lead connected to each other through the at least one through hole, and a display panel driving chip and a touch panel sensor chip, each mounted on any one of the first surface and the second surface of the base film, wherein at least one of the display panel driving panel and the touch panel sensor chip is electrically connected to the first and second leads.
Abstract translation: 薄膜封装上的芯片包括柔性基膜，其具有彼此相对的第一表面和第二表面，所述第一表面和第二表面在其中包括至少一个通孔，分别设置在基膜的第一表面和第二表面上的多个布线 ，其包括通过所述至少一个通孔彼此连接的第一引线和第二引线，以及显示面板驱动芯片和触摸面板传感器芯片，每个安装在所述第一引线和所述第二表面中的任何一个上 其中所述显示面板驱动面板和所述触摸面板传感器芯片中的至少一个电连接到所述第一和第二引线。
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Patent Agency Ranking
6.发明授权Chip on film (COF) substrate, COF package and display device including the same 有权贴膜（COF）基板，COF封装和包括其的显示装置公开(公告)号：US09059162B2
公开(公告)日：2015-06-16
申请号：US13933185
申请日：2013-07-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jeong-Kyu Ha , Kwan-Jai Lee , Jae-Min Jung , Kyong-Soon Cho , Na-Rae Shin , Kyoung-Suk Yang , Pa-Lan Lee , So-Young Lim
IPC: H01L23/498
CPC classification number: H01L23/49838 , H01L23/4985 , H01L2924/0002 , H01L2924/00
Abstract: A COF substrate may include a base film, first upper conductive patterns, at least one second upper conductive pattern and lower conductive patterns. The first upper conductive patterns may be arranged on an upper surface of the base film. Each of the first upper conductive patterns may have an inner pattern and an outer pattern spaced apart from each other. The second upper conductive pattern may be arranged on the upper surface of the base film between the first upper conductive patterns. The lower conductive patterns may be arranged on a lower surface of the base film. The lower conductive patterns may be electrically connected between the inner pattern and the outer pattern. Thus, conductive materials causing a short between the panel patterns may not exist between the inner pattern and the outer pattern on the upper surface of the base film.
Abstract translation: COF基板可以包括基膜，第一上导电图案，至少一个第二上导电图案和下导电图案。 第一上导电图案可以布置在基膜的上表面上。 每个第一上导电图案可以具有彼此间隔开的内图案和外图案。 第二上导电图案可以布置在第一上导电图案之间的基膜的上表面上。 下导电图案可以布置在基膜的下表面上。 下部导电图案可以电连接在内部图案和外部图案之间。 因此，在基片的上表面上的内图案和外图案之间可能不存在在面板图案之间引起短路的导电材料。
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公开(公告)号：US20140246687A1
公开(公告)日：2014-09-04
申请号：US14195352
申请日：2014-03-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jeong-Kyu Ha , Kwan-Jai Lee , Jae-Min Jung , Kyong-Soon Cho , Na-Rae Shin , Kyoung-Suk Yang , Pa-Lan Lee , So-Young Lim
IPC: H01L27/32
CPC classification number: G06F3/0412 , G06F1/1626 , G06F1/1637 , G06F1/1643 , G06F1/1652 , G06F3/0416 , G06F2203/04102 , H01L27/323 , H01L27/3276 , H01L2251/5338
Abstract: A chip on film package includes a flexible base film having a first surface and a second surface opposite to each other that includes at least one through hole therein, a plurality of wirings disposed on the first surface and the second surface of the base film, respectively, that include a first lead and a second lead connected to each other through the at least one through hole, and a display panel driving chip and a touch panel sensor chip, each mounted on any one of the first surface and the second surface of the base film, wherein at least one of the display panel driving panel and the touch panel sensor chip is electrically connected to the first and second leads.
Abstract translation: 薄膜封装上的芯片包括柔性基膜，其具有彼此相对的第一表面和第二表面，所述第一表面和第二表面在其中包括至少一个通孔，分别设置在基膜的第一表面和第二表面上的多个布线 ，其包括通过所述至少一个通孔彼此连接的第一引线和第二引线，以及显示面板驱动芯片和触摸面板传感器芯片，每个安装在所述第一引线和所述第二表面中的任何一个上 其中所述显示面板驱动面板和所述触摸面板传感器芯片中的至少一个电连接到所述第一和第二引线。
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公开(公告)号：US20240421056A1
公开(公告)日：2024-12-19
申请号：US18515441
申请日：2023-11-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jae-Min Jung
IPC: H01L23/498 , H01L23/00 , H01L25/065
Abstract: A semiconductor package includes: a substrate including a chip region and an edge region extending around the chip region; a plurality of film wirings on the substrate in the chip region; an input wiring and an output wiring on the substrate in the edge region and extending to the chip region in a direction parallel to an upper surface of the substrate; and a semiconductor chip on the substrate in the chip region and electrically connected to the input wiring and the output wiring. The substrate includes a through hole extending through the substrate in a second direction perpendicular to the first direction, and the through hole is between the film wirings.
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公开(公告)号：US11756850B2
公开(公告)日：2023-09-12
申请号：US17462269
申请日：2021-08-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seung-Tae Hwang , Jae-Choon Kim , Kyung-Suk Oh , Woon-Bae Kim , Jae-Min Jung
IPC: H01L23/31 , H01L23/498 , H05K1/14
CPC classification number: H01L23/3135 , H01L23/4985 , H01L23/49838 , H05K1/147 , H05K2201/049 , H05K2201/10128
Abstract: A chip on film package includes: a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.
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公开(公告)号：US09620389B2
公开(公告)日：2017-04-11
申请号：US14967490
申请日：2015-12-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jeong-Kyu Ha , Youngshin Kwon , KwanJai Lee , Jae-Min Jung , KyongSoon Cho , Sang-Uk Han
IPC: H01L23/14 , H01L23/498 , H01L21/48 , H05K1/11 , H05K3/10 , H01L23/00 , H01L23/495 , H05K3/00 , H01L21/56 , H01L21/78 , H05K1/18 , H05K3/42
CPC classification number: H01L21/486 , H01L21/4853 , H01L21/563 , H01L21/78 , H01L23/145 , H01L23/49524 , H01L23/49827 , H01L23/4985 , H01L24/50 , H01L2924/12042 , H05K1/114 , H05K1/115 , H05K1/189 , H05K3/0052 , H05K3/107 , H05K3/42 , H05K2203/1545 , Y10T156/1052 , H01L2924/00
Abstract: A tape film package is provided including an insulating pattern; a via contact in a via hole in the insulating pattern; first interconnection patterns extending from the via contact to a cutting surface of the insulating pattern; and second interconnection patterns connected to the via contact below the insulating pattern. The second interconnection patterns are parallel to the first interconnection patterns and spaced apart from the cutting surface of the insulating pattern.
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