ELECTRONIC DEVICE INCLUDING AN ACCESS REGION AND A PROCESS OF FORMING THE SAME

    公开(公告)号:US20190371909A1

    公开(公告)日:2019-12-05

    申请号:US15997122

    申请日:2018-06-04

    Abstract: An electronic device can include a channel layer; an access region having an aluminum content substantially uniform or increasing with distance from the channel layer; and a gate dielectric layer overlying and contacting the channel layer. A process of forming an electronic device can include providing a substrate and a channel layer of a III-V semiconductor material over the substrate; forming a masking feature over the channel layer; and forming an access region over the channel layer. In an embodiment, the channel layer can include GaN, and the access region has an aluminum content that is substantially uniform or increases with distance from the channel layer. In another embodiment, the process can include removing at least a portion the masking feature and forming a gate dielectric layer over the channel layer. A dielectric film of the masking feature or the gate dielectric layer contacts the channel layer.

    Electronic Device Including a HEMT Including a Buried Region

    公开(公告)号:US20200219871A1

    公开(公告)日:2020-07-09

    申请号:US16241172

    申请日:2019-01-07

    Abstract: An electronic device can include a high electron mobility transistor that includes a buried region, a channel layer overlying the buried region, a gate electrode, and a drain electrode overlying the buried region. The buried region can extend toward and does not underlie the gate electrode. In a particular aspect, the electronic device can further include a p-type semiconductor member overlying the channel layer. The gate electrode can overlie the channel layer, a p-type semiconductor member overlying the channel layer. The drain electrode can overlie and contact the buried region and the p-type semiconductor member. The p-type semiconductor member can be disposed between the gate and drain electrodes. In another embodiment, a source-side buried region may be used in addition to or in place of the buried region that is coupled to the drain electrode.

    ELECTRONIC DEVICE INCLUDING A TRANSISTOR AND A CURRENT LIMITING CONTROL STRUCTURE

    公开(公告)号:US20200083361A1

    公开(公告)日:2020-03-12

    申请号:US16123115

    申请日:2018-09-06

    Abstract: An electronic device can include a drain electrode of a high electron mobility transistor overlying a channel layer; a source electrode overlying the channel layer, wherein a lowermost portion of the source electrode overlies at least a portion of the channel layer; and a gate electrode of the high electron mobility transistor overlying the channel layer; and a current limiting control structure that controls current passing between the drain and source electrodes. The current limiting control structure can be disposed between the source and gate electrodes, the current limiting control structure can be coupled to the source electrode and the first high electron mobility transistor, and the current limiting control structure has a threshold voltage. The current limiting control structure can be a Schottky-gated HEMT or a MISHEMT.

    PROCESS OF FORMING AN ELECTRONIC DEVICE INCLUDING AN ACCESS REGION

    公开(公告)号:US20200006521A1

    公开(公告)日:2020-01-02

    申请号:US16025085

    申请日:2018-07-02

    Abstract: A process of forming an electronic device can include forming a channel layer overlying a substrate and forming a barrier layer overlying the channel layer. In an embodiment, the process can further include forming a p-type semiconductor layer over the barrier layer, patterning the p-type semiconductor layer to define at least part of a gate electrode of a transistor structure, and forming an access region layer over the barrier layer. In another embodiment, the process can further include forming an etch-stop layer over the barrier layer, forming a sacrificial layer over the etch-stop layer, patterning the etch-stop and sacrificial layers to define a gate region, forming an access region layer over the barrier layer after patterning the etch-stop and sacrificial layers, and forming a p-type semiconductor layer within the gate region.

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