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公开(公告)号：US12302679B2
公开(公告)日：2025-05-13
申请号：US18671619
申请日：2024-05-22
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Jae Kwon Kim , Min Chan Heo , Kyoung Wan Kim , Jong Kyu Kim , Hyun A Kim , Joon Sup Lee
IPC: H10H20/857 , H10H20/814 , H10H20/841 , H10H29/14
Abstract: A light emitting diode includes a first conductivity type semiconductor layer, a mesa disposed on the first conductivity type semiconductor layer, and including an active layer and a second conductivity type semiconductor layer, and a lower insulation layer covering the mesa and at least a portion of the first conductivity type semiconductor layer exposed around the mesa, and having a first opening for allowing electrical connection to the first conductivity type semiconductor layer and a second opening for allowing electrical connection to the second conductivity type semiconductor layer. The active layer generates light having a peak wavelength of about 500 nm or less, and the lower insulation layer includes a distributed Bragg reflector.
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公开(公告)号：US09893051B2
公开(公告)日：2018-02-13
申请号：US14991829
申请日：2014-07-10
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Seom Geun Lee , Yeo Jin Yoon , Jae Kwon Kim , So Ra Lee , Myoung Hak Yang
CPC classification number: H01L27/0255 , H01L25/167 , H01L27/15 , H01L33/06 , H01L33/32 , H01L33/405 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: Disclosed herein is a light emitting diode chip having ESD protection. An exemplary embodiment provides a flip-chip type light emitting diode chip, which includes a light emitting diode part aligned on a substrate, and a reverse-parallel diode part disposed on the substrate and connected to the light emitting diode part. Within the flip-chip type light emitting diode chip, the light emitting diode part is placed together with reverse-parallel diode part, thereby providing a light emitting diode chip exhibiting strong resistance to electrostatic discharge.
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公开(公告)号：US20170365638A9
公开(公告)日：2017-12-21
申请号：US15409306
申请日：2017-01-18
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Jong Kyu Kim , So Ra Lee , Yeo Jin Yoon , Jae Kwon Kim , Joon Sup Lee , Min Woo Kang , Se Hee Oh , Hyun A Kim , Hyoung Jin Lim
CPC classification number: H01L27/156 , H01L33/08 , H01L33/36 , H01L33/38 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L2224/16225 , H01L2224/32245 , H01L2924/181 , H01L2924/19107 , H01L2933/0016 , H01L2924/00012
Abstract: A light-emitting element includes a light-emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first conductive semiconductor layer and the second conductive semiconductor layer; a first contact electrode and a second contact electrode located on the light-emitting structure, and respectively making ohmic contact with the first conductive semiconductor layer and the second conductive semiconductor layer; an insulation layer for covering a part of the first contact electrode and the second contact electrode so as to insulate the first contact electrode and the second contact electrode; a first electrode pad and a second electrode pad electrically connected to each of the first contact electrode and the second contact electrode; and a radiation pad formed on the insulation layer, and radiating heat generated from the light-emitting structure.
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公开(公告)号：US09680060B2
公开(公告)日：2017-06-13
申请号：US15003928
申请日：2016-01-22
Applicant: Seoul Viosys Co., Ltd.
Inventor： Jae Kwon Kim , Yeo Jin Yoon , Jong Kyu Kim , So Ra Lee , Sum Geun Lee , Hyun Haeng Lee
IPC: H01L33/00 , H01L33/22 , H01L27/15 , H01L33/08 , H01L33/62 , H01L33/06 , H01L33/32 , H01L33/42 , H01L33/20
CPC classification number: H01L27/153 , H01L27/156 , H01L33/06 , H01L33/08 , H01L33/20 , H01L33/22 , H01L33/32 , H01L33/38 , H01L33/42 , H01L33/62
Abstract: A light emitting diode includes a substrate including a concave-convex pattern having concave portions and convex portions, a first light emitting unit disposed on the substrate, a second light emitting unit disposed on the substrate, a first wire connecting the first light emitting unit to the second light emitting unit over the concave-convex pattern, and an insulation layer disposed between the concave-convex pattern and the wire. The insulation layer has a shape corresponding to the concave-convex pattern.
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公开(公告)号：US09634061B2
公开(公告)日：2017-04-25
申请号：US15150863
申请日：2016-05-10
Applicant: Seoul Viosys Co., Ltd.
Inventor： Seom Geun Lee , Jong Kyu Kim , Yeo Jin Yoon , Jae Kwon Kim , Mae Yi Kim
IPC: H01L33/00 , H01L27/15 , H01L33/62 , H01L33/42 , H01L33/08 , H01L33/46 , H01L33/06 , H01L33/10 , H01L33/32 , H01L33/38 , H01L33/14 , H01L33/44
CPC classification number: H01L27/15 , H01L27/156 , H01L33/007 , H01L33/0075 , H01L33/06 , H01L33/08 , H01L33/10 , H01L33/14 , H01L33/145 , H01L33/32 , H01L33/38 , H01L33/42 , H01L33/44 , H01L33/46 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2933/0066 , H01L2924/00
Abstract: A light emitting diode including a first light emitting cell and a second light emitting cell disposed on a substrate and spaced apart from each other to expose a surface of the substrate, a first transparent layer disposed on and electrically connected to the first light emitting cell, first connection section disposed on a portion of the first light emitting cell, a second connection section disposed on a portion of the second light emitting cell, a first interconnection and a second interconnection electrically connecting the first light emitting cell and the second light emitting cell, and an insulation layer disposed between the first and second interconnections and a side surface of the first light emitting cell.
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Patent Agency Ranking
公开(公告)号：US09269745B2
公开(公告)日：2016-02-23
申请号：US14087140
申请日：2013-11-22
Applicant: Seoul Viosys Co., Ltd.
Inventor： Jae Kwon Kim , Yeo Jin Yoon , Jong Kyu Kim , So Ra Lee , Sum Geun Lee , Hyun Haeng Lee
CPC classification number: H01L27/153 , H01L27/156 , H01L33/06 , H01L33/08 , H01L33/20 , H01L33/22 , H01L33/32 , H01L33/38 , H01L33/42 , H01L33/62
Abstract: Exemplary embodiments of the present invention provide a light emitting diode including light emitting units disposed on a substrate, and wires connecting the light emitting units to each other, wherein the light emitting units each include a parallelogram-shaped light emitting unit having two acute angles and two obtuse angles, or a triangular light emitting unit having three acute angles.
Abstract translation: 本发明的示例性实施例提供一种发光二极管，其包括设置在基板上的发光单元和将发光单元彼此连接的导线，其中发光单元各自包括具有两个锐角的平行四边形形状的发光单元， 两个钝角，或具有三个锐角的三角形发光单元。
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公开(公告)号：US12015112B2
公开(公告)日：2024-06-18
申请号：US17389025
申请日：2021-07-29
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Jae Kwon Kim , Min Chan Heo , Kyoung Wan Kim , Jong Kyu Kim , Hyun A Kim , Joon Sup Lee
CPC classification number: H01L33/62 , H01L27/156 , H01L33/10 , H01L33/46
Abstract: A light emitting diode includes a first conductivity type semiconductor layer, a mesa disposed on the first conductivity type semiconductor layer, and including an active layer and a second conductivity type semiconductor layer, and a lower insulation layer covering the mesa and at least a portion of the first conductivity type semiconductor layer exposed around the mesa, and having a first opening for allowing electrical connection to the first conductivity type semiconductor layer and a second opening for allowing electrical connection to the second conductivity type semiconductor layer. The active layer generates light having a peak wavelength of about 500 nm or less, and the lower insulation layer includes a distributed Bragg reflector.
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公开(公告)号：US09923121B2
公开(公告)日：2018-03-20
申请号：US15501815
申请日：2015-08-04
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Se Hee Oh , Jong Kyu Kim , Jae Kwon Kim , Min Woo Kang , Hyun A Kim
IPC: H01L33/38 , H01L27/15 , H01L33/06 , H01L33/32 , H01L33/46 , H01L33/62 , H01L33/64 , H01L33/00 , F21K9/232 , F21K9/238 , F21V19/00 , F21S8/10 , F21V8/00 , H01L33/08 , F21Y115/10
CPC classification number: H01L33/387 , F21K9/232 , F21K9/238 , F21S41/141 , F21S41/143 , F21S41/255 , F21S41/285 , F21S45/43 , F21S45/47 , F21V19/003 , F21Y2115/10 , G02B6/00 , G02B6/0055 , H01L27/156 , H01L33/007 , H01L33/06 , H01L33/08 , H01L33/32 , H01L33/38 , H01L33/382 , H01L33/385 , H01L33/46 , H01L33/62 , H01L33/641 , H01L33/647 , H01L2933/0016 , H01L2933/0025 , H01L2933/0066 , H01L2933/0075
Abstract: A light-emitting diode and a manufacturing method therefor are disclosed. The light-emitting diode comprises: a first conductive semiconductor layer; at least two light-emitting units arranged by being spaced from each other on the first conductive semiconductor layer, respectively including an active layer and a second conductive semiconductor layer, and including one or more contact holes through which the first conductive semiconductor layer is partially exposed; an additional contact area located between the light-emitting units; a second electrode making ohmic contact with the second conductive semiconductor layer; a lower insulation layer; and a first electrode making ohmic contact with the first conductive semiconductor layer through the contact holes of each of the light-emitting units and the additional contact area.
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公开(公告)号：US20170236977A1
公开(公告)日：2017-08-17
申请号：US15501815
申请日：2015-08-04
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Se Hee Oh , Jong Kyu Kim , Jae Kwon Kim , Min Woo Kang , Hyun A Kim
IPC: H01L33/38 , H01L33/06 , H01L33/32 , H01L33/46 , H01L33/62 , F21V8/00 , H01L33/00 , F21K9/232 , F21K9/238 , F21V19/00 , F21S8/10 , H01L27/15 , H01L33/64
CPC classification number: H01L33/387 , F21K9/232 , F21K9/238 , F21S41/141 , F21S41/143 , F21S41/255 , F21S41/285 , F21S45/43 , F21S45/47 , F21V19/003 , F21Y2115/10 , G02B6/00 , G02B6/0055 , H01L27/156 , H01L33/007 , H01L33/06 , H01L33/08 , H01L33/32 , H01L33/38 , H01L33/382 , H01L33/385 , H01L33/46 , H01L33/62 , H01L33/641 , H01L33/647 , H01L2933/0016 , H01L2933/0025 , H01L2933/0066 , H01L2933/0075
Abstract: A light-emitting diode and a manufacturing method therefor are disclosed. The light-emitting diode comprises: a first conductive semiconductor layer; at least two light-emitting units arranged by being spaced from each other on the first conductive semiconductor layer, respectively including an active layer and a second conductive semiconductor layer, and including one or more contact holes through which the first conductive semiconductor layer is partially exposed; an additional contact area located between the light-emitting units; a second electrode making ohmic contact with the second conductive semiconductor layer; a lower insulation layer; and a first electrode making ohmic contact with the first conductive semiconductor layer through the contact holes of each of the light-emitting units and the additional contact area.
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10.发明申请SUBSTRATE HAVING CONCAVE-CONVEX PATTERN, LIGHT-EMITTING DIODE INCLUDING THE SUBSTRATE, AND METHOD FOR FABRICATING THE DIODE 审中-公开具有凹凸图案的基板，包括基板的发光二极管以及用于制造二极管的方法公开(公告)号：US20150270441A1
公开(公告)日：2015-09-24
申请号：US14732455
申请日：2015-06-05
Applicant: Seoul Viosys Co., Ltd.
Inventor： Jae Kwon Kim , Sum Geun Lee , Kyung Wan Kim , Yeo Jin Yoon , Duk Il Suh , Ji Hye Kim
CPC classification number: H01L33/20 , H01L27/153 , H01L33/007 , H01L33/06 , H01L33/10 , H01L33/14 , H01L33/16 , H01L33/22 , H01L33/32
Abstract: Provided are a substrate having concave-convex patterns, a light-emitting diode (LED) including the substrate, and a method of fabricating the LED. The LED includes a substrate, and concave-convex patterns disposed in an upper surface of the substrate and having convexes and concaves defined by the convexes. Unit light-emitting device having a first conductive semiconduct or layer, an active layer, and a second conductive semiconductor layer disposed on the substrate in sequence is present.
Abstract translation: 提供具有凹凸图案的基板，包括该基板的发光二极管（LED）以及制造该LED的方法。 LED包括基板和设置在基板的上表面中并具有由凸部限定的凸起和凹部的凹凸图案。 存在具有依次设置在基板上的第一导电半导体层或有源层，第二导电半导体层的单元发光器件。
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