公开(公告)号：US20170283610A1

公开(公告)日：2017-10-05

申请号：US15316880

申请日：2016-09-14

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Hui LI ,  Kehong FANG ,  Yongjing XU

IPC: C08L63/10 ,  C08L35/06 ,  C08G59/40 ,  H05K1/03

Abstract: The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

公开(公告)号：US20170253013A1

公开(公告)日：2017-09-07

申请号：US15525665

申请日：2014-12-02

Applicant: Shengyi Technology Co., Ltd.

Inventor： Hui LI ,  Kehong FANG

IPC: B32B27/38 ,  B32B27/30 ,  H05K1/03 ,  C08J5/24 ,  C08J5/04 ,  B32B27/28 ,  C08L79/04

CPC classification number: B32B27/38 ,  B32B27/04 ,  B32B27/285 ,  B32B27/302 ,  B32B2260/046 ,  B32B2307/306 ,  B32B2371/00 ,  B32B2457/08 ,  C08G59/3218 ,  C08G61/02 ,  C08G73/065 ,  C08G2261/724 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/12 ,  C08J2379/04 ,  C08J2425/08 ,  C08J2435/06 ,  C08J2463/00 ,  C08J2471/10 ,  C08J2471/12 ,  C08L61/14 ,  C08L63/00 ,  C08L79/04 ,  C08L2201/02 ,  C08L2203/20 ,  C08L2205/035 ,  H05K1/024 ,  H05K1/03 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  C08K3/36 ,  C08L35/06 ,  C08L71/12

Abstract: A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.

公开(公告)号：US20170298218A1

公开(公告)日：2017-10-19

申请号：US15318787

申请日：2016-09-08

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Hui LI ,  Kehong FANG ,  Yongjing XU

IPC: C08L63/00 ,  C08G59/50 ,  C08G59/62 ,  C08J5/04 ,  C08G59/42 ,  H01B3/40 ,  C08L63/08 ,  C08J5/24 ,  H05K1/03

CPC classification number: C08L63/00 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B7/04 ,  B32B15/06 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B25/02 ,  B32B25/042 ,  B32B27/08 ,  B32B27/20 ,  B32B27/26 ,  B32B27/28 ,  B32B27/281 ,  B32B27/285 ,  B32B27/302 ,  B32B27/32 ,  B32B27/325 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  B32B2250/05 ,  B32B2255/02 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/0214 ,  B32B2264/0257 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/107 ,  B32B2264/12 ,  B32B2270/00 ,  B32B2307/204 ,  B32B2307/21 ,  B32B2307/302 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/308 ,  B32B2307/4026 ,  B32B2307/724 ,  B32B2307/748 ,  B32B2457/08 ,  C08G14/06 ,  C08G59/40 ,  C08G59/42 ,  C08G59/4238 ,  C08G59/4284 ,  C08G59/5046 ,  C08G59/621 ,  C08G73/0233 ,  C08G73/06 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2363/08 ,  C08K3/01 ,  C08K5/0025 ,  C08K13/02 ,  C08L35/06 ,  C08L61/34 ,  C08L63/08 ,  C08L79/04 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/02 ,  C08L2205/05 ,  H01B3/40 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0242

Abstract: The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

公开(公告)号：US20170198135A1

公开(公告)日：2017-07-13

申请号：US15313669

申请日：2014-12-02

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Hui LI ,  Kehong FANG

IPC: C08L63/08 ,  H05K1/03 ,  C08J5/24 ,  C08J5/04 ,  C08L63/00 ,  C08G59/58

CPC classification number: C08L63/08 ,  B32B15/092 ,  C08G59/42 ,  C08G59/58 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/02 ,  C08J2363/08 ,  C08J2425/02 ,  C08J2435/00 ,  C08J2471/12 ,  C08K3/36 ,  C08K5/0066 ,  C08K5/3445 ,  C08K5/49 ,  C08L35/06 ,  C08L63/00 ,  C08L63/04 ,  C08L71/12 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/02 ,  C08L2205/03 ,  C08L2205/05 ,  C08L2312/00 ,  H05K1/0373 ,  H05K2201/012 ,  C08F212/12 ,  C08F222/06

Abstract: The present invention relates to a halogen-free resin composition and a prepreg and a laminated board prepared therefrom. The halogen-free resin composition contains the following components in parts by weight: 50-100 parts of an epoxy resin; 20-70 parts of benzoxazine; 5-40 parts of a polyphenyl ether; 5-40 parts of allyl benzene-maleic anhydride; 10-60 parts of a halogen-free flame retardant; 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and laminated board prepared from the halogen-free resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance, cohesiveness and moisture resistance, etc., and are suitable for use in a halogen-free high multilayer circuit board.