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公开(公告)号：US20130248887A1
公开(公告)日：2013-09-26
申请号：US13845445
申请日：2013-03-18
Inventor： Romain Coffy , Eric Saugier , Hk Looi , Norbert Chevrier
IPC: H01L31/0203 , H01L31/18
CPC classification number: H01L31/0203 , G01S7/481 , G01S17/026 , H01L25/167 , H01L31/18 , H01L2224/48091 , H01L2224/49175 , H01L2924/181 , H03K17/941 , H03K2017/9455 , H03K2217/94026 , H03K2217/94112 , H01L2924/00014 , H01L2924/00012
Abstract: An optical electronic package includes transmitting chip and a receiving chip fixed to a wafer. A transparent encapsulation structure is formed by a transparent plate and a transparent encapsulation block that are formed over the transmitter chip and at least a portion of the receiver chip, with the transparent encapsulation block embedding the transmitter chip. An opaque encapsulation block extends over the transparent plate and includes an opening that reveals a front area of the transparent plate. The front area is situated above an optical transmitter of the transmitting chip and is offset laterally relative to an optical sensor of the receiving chip.
Abstract translation: 光学电子封装包括固定到晶片的透射芯片和接收芯片。 透明封装结构由形成在发射机芯片和接收芯片的至少一部分上的透明板和透明封装块形成，透明封装块嵌入发射器芯片。 不透明的封装块在透明板上延伸并且包括露出透明板的前部区域的开口。 前部区域位于发射芯片的光发射机之上，相对于接收芯片的光学传感器横向偏移。
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公开(公告)号：US09105766B2
公开(公告)日：2015-08-11
申请号：US13845445
申请日：2013-03-18
Inventor： Romain Coffy , Eric Saugier , Hk Looi , Norbert Chevrier
IPC: H01L33/48 , H01L31/0203 , H01L31/18 , G01S17/02 , H01L25/16 , H03K17/94 , G01S7/481 , H03K17/945
CPC classification number: H01L31/0203 , G01S7/481 , G01S17/026 , H01L25/167 , H01L31/18 , H01L2224/48091 , H01L2224/49175 , H01L2924/181 , H03K17/941 , H03K2017/9455 , H03K2217/94026 , H03K2217/94112 , H01L2924/00014 , H01L2924/00012
Abstract: An optical electronic package includes transmitting chip and a receiving chip fixed to a wafer. A transparent encapsulation structure is formed by a transparent plate and a transparent encapsulation block that are formed over the transmitter chip and at least a portion of the receiver chip, with the transparent encapsulation block embedding the transmitter chip. An opaque encapsulation block extends over the transparent plate and includes an opening that reveals a front area of the transparent plate. The front area is situated above an optical transmitter of the transmitting chip and is offset laterally relative to an optical sensor of the receiving chip.
Abstract translation: 光学电子封装包括固定到晶片的透射芯片和接收芯片。 透明封装结构由形成在发射机芯片和接收芯片的至少一部分上的透明板和透明封装块形成，透明封装块嵌入发射器芯片。 不透明的封装块在透明板上延伸并且包括露出透明板的前部区域的开口。 前部区域位于发射芯片的光发射机之上，相对于接收芯片的光学传感器横向偏移。
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公开(公告)号：US08860207B2
公开(公告)日：2014-10-14
申请号：US14177146
申请日：2014-02-10
Inventor： Yonggang Jin , Romain Coffy , Jerome Teysseyre
IPC: H01L23/34 , H01L21/00 , H01R43/16 , H01L23/498 , H01L23/36 , H01L23/31 , H01L21/768
CPC classification number: H01L23/498 , H01L21/561 , H01L21/76283 , H01L21/76802 , H01L21/76838 , H01L23/3114 , H01L23/34 , H01L23/36 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/19 , H01L24/96 , H01L2224/02331 , H01L2224/02375 , H01L2224/02379 , H01L2224/04105 , H01L2224/05008 , H01L2224/05082 , H01L2224/05124 , H01L2224/05155 , H01L2224/05548 , H01L2224/05553 , H01L2224/05562 , H01L2224/05572 , H01L2224/05644 , H01L2224/96 , H01L2924/00014 , H01L2924/181 , Y10T29/49124 , Y10T29/49174 , Y10T29/49204 , H01L2224/03 , H01L2224/05552 , H01L2924/00
Abstract: A fan-out wafer level package is provided with a semiconductor die embedded in a reconstituted wafer. A redistribution layer is positioned over the semiconductor die, and includes a land grid array on a face of the package. A copper heat spreader is formed in the redistribution layer over the die in a same layer as a plurality of electrical traces configured to couple circuit pads of the semiconductor die to respective contact lands of the land grid array. In operation, the heat spreader improves efficiency of heat transfer from the die to the circuit board.
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公开(公告)号：US11908968B2
公开(公告)日：2024-02-20
申请号：US17838929
申请日：2022-06-13
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Romain Coffy , Remi Brechignac , Jean-Michel Riviere
CPC classification number: H01L31/16 , H01L24/73 , H01L2224/73265
Abstract: An optoelectronic device includes an emitter of light rays and a receiver of light rays. The emitter is encapsulated in a transparent block. An opaque conductive layer is applied to a top surface and a side surface of the transparent block. The receiver is mounted to the opaque conductive layer at the top surface. An electrical connection is made between the receiver and the opaque conductive layer. A conductive strip is also mounted to the side surface of the transparent block and isolated from the opaque conductive layer. A further electrical connection is made between the receiver and the conductive strip.
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公开(公告)号：US11740416B2
公开(公告)日：2023-08-29
申请号：US17546314
申请日：2021-12-09
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Romain Coffy , Jean-Michel Riviere
IPC: G02B6/42
CPC classification number: G02B6/4239 , G02B6/4213 , G02B6/4274
Abstract: An optoelectronic element is located in a package. The package includes a first optical block and a second optical block that are attached to each other by a bonding layer. One of the first and second optical blocks is attached to lateral walls of the package by glue. The material of the bonding layer is configured to induce less stress to the first and second optical blocks than the glue.
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Patent Agency Ranking
公开(公告)号：US11546059B2
公开(公告)日：2023-01-03
申请号：US17169010
申请日：2021-02-05
Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor： Jean-Michel Riviere , Romain Coffy , Karine Saxod
Abstract: A cover for an electronic circuit package, including: a body having an opening extending therethrough; a first element located in the opening and having a surface continuing planar or rounded shapes of a surface of the cover; and a second element of connection of the first element to the body.
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公开(公告)号：US11038595B2
公开(公告)日：2021-06-15
申请号：US16409723
申请日：2019-05-10
Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor： Alexandre Coullomb , Romain Coffy , Jean-Michel Riviere
IPC: H04B10/40 , H01L31/0203 , H01L25/04 , H04B10/50 , H04B10/69
Abstract: An optoelectronic device includes a substrate and a first optoelectronic chip flush with a surface of the substrate. The device includes a cover that covers the substrate and the first optoelectronic chip. The cover comprises a cavity above a first optical transduction region of the first optoelectronic chip. The device also includes a second optoelectronic chip having a second optical transduction region spaced apart from the first optical transduction region and the cavity continues above the second optical transduction region.
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公开(公告)号：US10777710B2
公开(公告)日：2020-09-15
申请号：US16432561
申请日：2019-06-05
Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor： Romain Coffy , Jean-Michel Riviere
Abstract: A housing for a light source mounted on a substrate, the housing comprising: a barrel having first and second conducting columns; and a diffuser having a through-hole or partial hole filled with a conductive plug, the conductive plug electrically bridging a gap in an electrical connection between the first and second conducting columns.
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公开(公告)号：US10738985B2
公开(公告)日：2020-08-11
申请号：US16439308
申请日：2019-06-12
Applicant: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED , STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor： Joseph Hannan , Stuart Robertson , Romain Coffy , Jean-Michel Riviere
Abstract: The disclosure concerns a housing for a light source mounted on a substrate, the housing comprising: a molded body having an opening permitting the passage of a light beam generated by the light source; one or more surfaces for receiving a diffuser; and first and second conducting pins traversing the molded body.
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公开(公告)号：US09502361B2
公开(公告)日：2016-11-22
申请号：US14852711
申请日：2015-09-14
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Romain Coffy , Julien Pruvost
IPC: H01L23/488 , H01L23/00 , B81C3/00 , H01L23/31 , H01L25/065 , H01L21/48 , H01L21/56 , H01L23/14 , H01L23/498 , H01L25/00
CPC classification number: H01L23/562 , B81B2207/098 , B81C3/001 , B81C2201/0174 , B81C2203/0771 , H01L21/4853 , H01L21/561 , H01L21/563 , H01L23/14 , H01L23/3114 , H01L23/315 , H01L23/3157 , H01L23/49811 , H01L23/49838 , H01L23/564 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/16225 , H01L2225/06513 , H01L2225/06555 , H01L2924/15311 , H01L2924/18161
Abstract: An electronic device includes a first and a second integrated-circuit chip that are stacked at a distance from one another, and a plurality of electrical connection pillars and at least one protective barrier interposed between the chips. The protective barrier delimits a free space between mutually opposing local regions of the chips, and an encapsulation block extends around the chip that has the smaller mounting face and over the periphery of the mounting face of the other chip. The electrical connection pillars and the protective barrier are made of at least one identical metallic material with a view to simultaneous fabrication.
Abstract translation: 电子设备包括彼此间隔地堆叠的第一和第二集成电路芯片，以及插入在芯片之间的多个电连接柱和至少一个保护屏障。 保护屏障限定了芯片的相互相对的局部区域之间的自由空间，并且封装块围绕具有较小安装面的芯片延伸，并且在另一芯片的安装面的周边上延伸。 电连接柱和保护屏障由至少一种相同的金属材料制成，以同时制造。
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