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公开(公告)号：US20170154201A1
公开(公告)日：2017-06-01
申请号：US15177805
申请日：2016-06-09
发明人： Yong Il KWON , Tah Joon PARK , Joon Seok CHAE , Jong Woo CHOI
CPC分类号： H05K1/0271 , G06K9/0002 , H05K1/09 , H05K1/112 , H05K1/144 , H05K1/183 , H05K3/4688 , H05K3/4697 , H05K2201/049 , H05K2201/10151
摘要： A fingerprint sensing device includes a board having a sensor array, a sub-board disposed on a bottom surface of the board, a circuit element disposed on the bottom surface of the board, and a through hole disposed through the sub-board, wherein the circuit element is further disposed in the through hole. A thickness of the sub-board is substantially similar to a thickness of the circuit element.
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公开(公告)号：US20220066022A1
公开(公告)日：2022-03-03
申请号：US17232300
申请日：2021-04-16
发明人： Young Ki LEE , Joon Seok CHAE , Seog Moon CHOI , Tae Gyu RYU
IPC分类号： G01S13/86 , G02B7/09 , G03B13/36 , G02B27/64 , G03B5/00 , G02B13/00 , B60R11/04 , G01S13/931 , H04N5/232 , H04N5/225
摘要： A sensing device includes a fixed member, a rotation member disposed at both ends of the fixed member, a camera installed on the fixed member, and respective radar units installed on the rotation members, where the respective radar units are configured to sense respective objects at edges of a viewing angle of the camera and respective objects outside of the viewing angle of the camera.
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公开(公告)号：US20140096380A1
公开(公告)日：2014-04-10
申请号：US14133157
申请日：2013-12-18
发明人： Chang Hyun LIM , Jung Eun KANG , Heung Soo PARK , Seog Moon CHOI , Kwang Soo KIM , Joon Seok CHAE , Sung Keun PARK
CPC分类号： H05K3/10 , H05K1/0203 , H05K1/053 , H05K3/108 , H05K3/44 , H05K3/445 , H05K2201/062 , H05K2201/09745 , H05K2201/10166 , H05K2203/0315 , Y10T29/4913
摘要： Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.
摘要翻译： 本文公开了包括金属芯层的混合散热基板; 氧化物绝缘芯层，其形成在所述金属芯层的厚度方向上，以形成所述氧化物绝缘芯层与所述金属芯层一体形成的形状;氧化物绝缘层，其形成在所述金属芯层的一个表面或两个表面上 金属芯层，以及被配置为包括形成在氧化物绝缘芯层上的第一电路图案和形成在氧化物绝缘层上的第二电路图案的电路层及其制造方法。
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公开(公告)号：US20210344847A1
公开(公告)日：2021-11-04
申请号：US17075776
申请日：2020-10-21
发明人： Tae Hoon KIM , Joon Seok CHAE
摘要： A vehicle camera system includes: an around view camera device including a front camera, a left camera, a right camera, and a rear camera, and configured to vary a field of view of one or more of the cameras in response to a control signal; and a control device configured to control the field of view by generating the control signal, in response to an operating mode.
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5.发明申请HEAT RADIATION SHEET FOR BOARD, MANUFACTURING METHOD THEREOF, AND HEAT RADIATION BOARD 审中-公开板材散热片及其制造方法及散热板公开(公告)号：US20150349230A1
公开(公告)日：2015-12-03
申请号：US14602725
申请日：2015-01-22
发明人： Kwang Soo KIM , Young Hoon KWAK , Joon Seok CHAE
CPC分类号： H01L33/641 , B32B15/08 , B32B15/20 , B32B27/20 , B32B2264/105 , B32B2264/107 , B32B2307/206 , B32B2307/302 , B32B2457/14 , Y10T428/252
摘要： A heat radiation sheet for a board including: composite fillers including metal particles and ceramic particles disposed on surfaces of the metal particles; and a base resin, and a manufacturing method of a heat radiation sheet for a board may include: preparing metal particles and ceramic particles; disposing the ceramic particles on surfaces of the metal particles by mixing the metal particles and the ceramic particles with each other; forming oxidized layers on exposed surfaces of the metal particles; and forming a prepreg by mixing composite fillers including the metal particles and the ceramic particles and a base resin with each other.
摘要翻译： 一种用于板的散热片，包括：包含设置在金属颗粒表面上的金属颗粒和陶瓷颗粒的复合填料; 和基础树脂，并且用于基板的散热片的制造方法可以包括：制备金属颗粒和陶瓷颗粒; 通过将金属颗粒和陶瓷颗粒彼此混合来将陶瓷颗粒设置在金属颗粒的表面上; 在金属颗粒的暴露表面上形成氧化层; 以及通过将包括金属颗粒和陶瓷颗粒的复合填料和基础树脂彼此混合来形成预浸料。
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6.发明申请SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE MANUFACTURING MOLD 审中-公开半导体封装及其制造方法及半导体封装制造模具公开(公告)号：US20140035157A1
公开(公告)日：2014-02-06
申请号：US13688430
申请日：2012-11-29
发明人： Si Joong YANG , Joon Seok CHAE , Tae Hyun KIM , Suk Ho LEE
CPC分类号： H01L23/481 , H01L21/561 , H01L21/565 , H01L24/97 , H01L2224/16245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48247 , H01L2224/97 , H01L2924/181 , H01L2924/19105 , H01L2224/85 , H01L2224/81 , H01L2924/00
摘要： There is provided a semiconductor package including: at least one internal lead having at least one electronic component mounted on a surface thereof; a molding unit sealing the electronic component and the internal lead; at least one external lead extending from the internal lead and protruding outwardly from ends of the molding unit; and a stopper provided on the external lead.
摘要翻译： 提供一种半导体封装，包括：至少一个内部引线，其具有安装在其表面上的至少一个电子部件; 密封电子部件和内部引线的成型单元; 从所述内部引线延伸并从所述模制单元的端部向外突出的至少一个外部引线; 以及设置在外部引线上的止动件。
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公开(公告)号：US20210297609A1
公开(公告)日：2021-09-23
申请号：US17076041
申请日：2020-10-21
发明人： Tae Hoon KIM , Joon Seok CHAE , Yun Tae LEE , Tae Kon KOO , Jae Chan LEE , Yong Woon PARK
摘要： A camera for a vehicle includes: an imaging unit configured to image an exterior of the vehicle; and a controller configured to enlarge a region of interest of the imaging unit in response to a driving speed of the vehicle being higher than a reference speed, and reduce the region of interest of the imaging unit in response to the driving speed being lower than the reference speed.
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公开(公告)号：US20150270217A1
公开(公告)日：2015-09-24
申请号：US14661844
申请日：2015-03-18
发明人： Kwang Soo KIM , Young Hoon KWAK , Chang Seob HONG , Joon Seok CHAE , Kee Ju UM
IPC分类号： H01L23/522 , H01L25/065 , H01L23/367
CPC分类号： H01L25/0655 , H01L23/36 , H01L23/3735 , H01L23/552 , H01L2224/48091 , H01L2224/49111 , H01L2924/00014
摘要： There is provided a power module package. The power module package includes: a base substrate provided with a pattern; a heat spreader formed by being stacked on an upper surface of the base substrate; and at least one first semiconductor device mounted on an upper surface of the heat spreader, wherein an outer circumferential surface of the heat spreader is provided with a coil.
摘要翻译： 提供了一个电源模块封装。 功率模块封装包括：具有图案的基底基板; 散热器，其通过堆叠在所述基底基板的上表面上而形成; 以及安装在散热器的上表面上的至少一个第一半导体器件，其中散热器的外圆周表面设置有线圈。
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公开(公告)号：US20150214199A1
公开(公告)日：2015-07-30
申请号：US14452524
申请日：2014-08-05
发明人： Kwang Soo KIM , Joon Seok CHAE , Young Hoon KWAK
IPC分类号： H01L25/16 , H01L25/00 , H01L21/56 , H01L23/00 , H01L23/31 , H01L23/495 , H01L23/373
CPC分类号： H01L25/165 , H01L21/565 , H01L23/3107 , H01L23/3735 , H01L23/3737 , H01L23/4334 , H01L23/49551 , H01L23/49568 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/85 , H01L25/50 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4516 , H01L2224/45166 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/85 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： Disclosed herein are a power module package and a method of manufacturing the same. According to a preferred embodiment of the present invention, the power module package includes: a lead frame on which a power device and a control IC electrically connected to the power device and controlling the power device are mounted; and a thermal sheet bonded to one surface of the lead frame, wherein the thermal sheet includes first and second resin layers which include a thermal conductive inorganic filler and are added with a mixture of phenyl glycidyl ether (PGE) and alkyl glycidyl ether (Alkyl (C12 to C14) glycidyl ether), and a thermal spreader of a metal material disposed at a bonded interface which is formed between the first and second resin layers. Therefore, it is possible to easily improve a thermal property of the power module package by a thermal spreading effect due to the thermal spreader.
摘要翻译： 这里公开了功率模块封装及其制造方法。 根据本发明的优选实施例，功率模块封装包括：引线框，其上安装有电连接到功率器件并控制功率器件的功率器件和控制IC; 以及热敏片，其结合到引线框架的一个表面，其中所述热敏片包括包含导热无机填料的第一和第二树脂层，并加入苯基缩水甘油醚（PGE）和烷基缩水甘油醚（烷基（ C12〜C14）缩水甘油醚）和设置在形成在第一和第二树脂层之间的键合界面处的金属材料的散热器。 因此，能够通过散热器的散热效果容易地提高功率组件封装的热性能。
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