公开(公告)号：US20170154201A1

公开(公告)日：2017-06-01

申请号：US15177805

申请日：2016-06-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Il KWON ,  Tah Joon PARK ,  Joon Seok CHAE ,  Jong Woo CHOI

IPC: G06K9/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/09 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K1/0271 ,  G06K9/0002 ,  H05K1/09 ,  H05K1/112 ,  H05K1/144 ,  H05K1/183 ,  H05K3/4688 ,  H05K3/4697 ,  H05K2201/049 ,  H05K2201/10151

Abstract: A fingerprint sensing device includes a board having a sensor array, a sub-board disposed on a bottom surface of the board, a circuit element disposed on the bottom surface of the board, and a through hole disposed through the sub-board, wherein the circuit element is further disposed in the through hole. A thickness of the sub-board is substantially similar to a thickness of the circuit element.

公开(公告)号：US20220066022A1

公开(公告)日：2022-03-03

申请号：US17232300

申请日：2021-04-16

Applicant: Samsung Electro-Mechanics Co., Ltd

Inventor： Young Ki LEE ,  Joon Seok CHAE ,  Seog Moon CHOI ,  Tae Gyu RYU

IPC: G01S13/86 ,  G02B7/09 ,  G03B13/36 ,  G02B27/64 ,  G03B5/00 ,  G02B13/00 ,  B60R11/04 ,  G01S13/931 ,  H04N5/232 ,  H04N5/225

Abstract: A sensing device includes a fixed member, a rotation member disposed at both ends of the fixed member, a camera installed on the fixed member, and respective radar units installed on the rotation members, where the respective radar units are configured to sense respective objects at edges of a viewing angle of the camera and respective objects outside of the viewing angle of the camera.

公开(公告)号：US20140096380A1

公开(公告)日：2014-04-10

申请号：US14133157

申请日：2013-12-18

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Chang Hyun LIM ,  Jung Eun KANG ,  Heung Soo PARK ,  Seog Moon CHOI ,  Kwang Soo KIM ,  Joon Seok CHAE ,  Sung Keun PARK

IPC: H05K3/44 ,  H05K3/10

CPC classification number: H05K3/10 ,  H05K1/0203 ,  H05K1/053 ,  H05K3/108 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/062 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2203/0315 ,  Y10T29/4913

Abstract: Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.

Abstract translation: 本文公开了包括金属芯层的混合散热基板; 氧化物绝缘芯层，其形成在所述金属芯层的厚度方向上，以形成所述氧化物绝缘芯层与所述金属芯层一体形成的形状;氧化物绝缘层，其形成在所述金属芯层的一个表面或两个表面上 金属芯层，以及被配置为包括形成在氧化物绝缘芯层上的第一电路图案和形成在氧化物绝缘层上的第二电路图案的电路层及其制造方法。

公开(公告)号：US20250029904A1

公开(公告)日：2025-01-23

申请号：US18664941

申请日：2024-05-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sijoong YANG ,  Joon Seok CHAE ,  Dongsoon WOO ,  Daeyoung CHOI ,  Taeseok KO

IPC: H01L23/495 ,  H01L23/31

Abstract: A semiconductor package is provided. The semiconductor package includes a first semiconductor frame that includes a first lead frame and a first insulating layer disposed below the first lead frame; a second semiconductor frame that includes a second lead frame that faces the first lead frame and a second insulating layer disposed on the second lead frame; a semiconductor element that is disposed between the first semiconductor frame and the second semiconductor frame; and a molding portion that surrounds and seals at least a portion of the first semiconductor frame, at least a portion of the second semiconductor frame, and the semiconductor element.

公开(公告)号：US20210344847A1

公开(公告)日：2021-11-04

申请号：US17075776

申请日：2020-10-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hoon KIM ,  Joon Seok CHAE

IPC: H04N5/247 ,  H04N5/225 ,  H04N5/232 ,  B60R1/00

Abstract: A vehicle camera system includes: an around view camera device including a front camera, a left camera, a right camera, and a rear camera, and configured to vary a field of view of one or more of the cameras in response to a control signal; and a control device configured to control the field of view by generating the control signal, in response to an operating mode.

公开(公告)号：US20150349230A1

公开(公告)日：2015-12-03

申请号：US14602725

申请日：2015-01-22

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Kwang Soo KIM ,  Young Hoon KWAK ,  Joon Seok CHAE

IPC: H01L33/64 ,  B32B15/08

CPC classification number: H01L33/641 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B2264/105 ,  B32B2264/107 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2457/14 ,  Y10T428/252

Abstract: A heat radiation sheet for a board including: composite fillers including metal particles and ceramic particles disposed on surfaces of the metal particles; and a base resin, and a manufacturing method of a heat radiation sheet for a board may include: preparing metal particles and ceramic particles; disposing the ceramic particles on surfaces of the metal particles by mixing the metal particles and the ceramic particles with each other; forming oxidized layers on exposed surfaces of the metal particles; and forming a prepreg by mixing composite fillers including the metal particles and the ceramic particles and a base resin with each other.

Abstract translation: 一种用于板的散热片，包括：包含设置在金属颗粒表面上的金属颗粒和陶瓷颗粒的复合填料; 和基础树脂，并且用于基板的散热片的制造方法可以包括：制备金属颗粒和陶瓷颗粒; 通过将金属颗粒和陶瓷颗粒彼此混合来将陶瓷颗粒设置在金属颗粒的表面上; 在金属颗粒的暴露表面上形成氧化层; 以及通过将包括金属颗粒和陶瓷颗粒的复合填料和基础树脂彼此混合来形成预浸料。

公开(公告)号：US20140035157A1

公开(公告)日：2014-02-06

申请号：US13688430

申请日：2012-11-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Si Joong YANG ,  Joon Seok CHAE ,  Tae Hyun KIM ,  Suk Ho LEE

IPC: H01L23/48 ,  H01L21/56

CPC classification number: H01L23/481 ,  H01L21/561 ,  H01L21/565 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00

Abstract: There is provided a semiconductor package including: at least one internal lead having at least one electronic component mounted on a surface thereof; a molding unit sealing the electronic component and the internal lead; at least one external lead extending from the internal lead and protruding outwardly from ends of the molding unit; and a stopper provided on the external lead.

Abstract translation: 提供一种半导体封装，包括：至少一个内部引线，其具有安装在其表面上的至少一个电子部件; 密封电子部件和内部引线的成型单元; 从所述内部引线延伸并从所述模制单元的端部向外突出的至少一个外部引线; 以及设置在外部引线上的止动件。

公开(公告)号：US20250022779A1

公开(公告)日：2025-01-16

申请号：US18661992

申请日：2024-05-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sijoong YANG ,  Joon Seok CHAE ,  Dongsoon WOO ,  Daeyoung CHOI ,  Taeseok KO

IPC: H01L23/495 ,  H01L23/00

Abstract: A semiconductor package is provided. The semiconductor package includes a first lead frame and a second lead frame that face each other; and a semiconductor element that is disposed between the first lead frame and the second lead frame, wherein the semiconductor element is connected to the first lead frame through a first contacting portion, and is connected to the second lead frame through a second contacting portion. The second lead frame includes a hole that overlaps the second contacting portion.

公开(公告)号：US20210297609A1

公开(公告)日：2021-09-23

申请号：US17076041

申请日：2020-10-21

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Hoon KIM ,  Joon Seok CHAE ,  Yun Tae LEE ,  Tae Kon KOO ,  Jae Chan LEE ,  Yong Woon PARK

IPC: H04N5/345 ,  H04N5/355 ,  G07C5/08

Abstract: A camera for a vehicle includes: an imaging unit configured to image an exterior of the vehicle; and a controller configured to enlarge a region of interest of the imaging unit in response to a driving speed of the vehicle being higher than a reference speed, and reduce the region of interest of the imaging unit in response to the driving speed being lower than the reference speed.

公开(公告)号：US20150270217A1

公开(公告)日：2015-09-24

申请号：US14661844

申请日：2015-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Soo KIM ,  Young Hoon KWAK ,  Chang Seob HONG ,  Joon Seok CHAE ,  Kee Ju UM

IPC: H01L23/522 ,  H01L25/065 ,  H01L23/367

CPC classification number: H01L25/0655 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/552 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2924/00014

Abstract: There is provided a power module package. The power module package includes: a base substrate provided with a pattern; a heat spreader formed by being stacked on an upper surface of the base substrate; and at least one first semiconductor device mounted on an upper surface of the heat spreader, wherein an outer circumferential surface of the heat spreader is provided with a coil.

Abstract translation: 提供了一个电源模块封装。 功率模块封装包括：具有图案的基底基板; 散热器，其通过堆叠在所述基底基板的上表面上而形成; 以及安装在散热器的上表面上的至少一个第一半导体器件，其中散热器的外圆周表面设置有线圈。