VARIFOCAL LENS
    1.
    发明申请
    VARIFOCAL LENS 有权
    VARIFOCAL镜头

    公开(公告)号:US20130201436A1

    公开(公告)日:2013-08-08

    申请号:US13719299

    申请日:2012-12-19

    CPC classification number: G02F1/133526 G02F1/29 G02F2001/294

    Abstract: A varifocal lens including a first liquid crystal layer; a second liquid crystal layer disposed below the first liquid crystal layer; a common electrode disposed between the first liquid crystal layer and the second liquid crystal layer; a first electrode disposed above the first liquid crystal layer and having a curved shape; and a second electrode disposed below the second liquid crystal layer and having a curved shape.

    Abstract translation: 一种变焦透镜,包括第一液晶层; 设置在所述第一液晶层下方的第二液晶层; 设置在所述第一液晶层和所述第二液晶层之间的公共电极; 第一电极,其设置在第一液晶层的上方并具有弯曲的形状; 以及设置在第二液晶层下方并具有弯曲形状的第二电极。

    FLEXIBLE SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
    9.
    发明申请
    FLEXIBLE SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME 有权
    柔性半导体器件及其制造方法

    公开(公告)号:US20140054599A1

    公开(公告)日:2014-02-27

    申请号:US13937729

    申请日:2013-07-09

    Abstract: A flexible semiconductor device and a method of manufacturing the flexible semiconductor device are provided. The flexible semiconductor device may include at least one vertical semiconductor element that is at least partly embedded in a flexible material layer. The flexible semiconductor device may further include a first electrode formed on a first surface of the flexible material layer and a second electrode formed on a second surface of the flexible material layer. A method of manufacturing a flexible semiconductor device may include separating a flexible material layer, in which the at least one vertical semiconductor element is embedded, from a substrate by weakening or degrading an adhesive force between an underlayer and a buffer layer by using a difference in coefficients of thermal expansion of the underlayer and the buffer layer.

    Abstract translation: 提供了柔性半导体器件和制造柔性半导体器件的方法。 柔性半导体器件可以包括至少部分地嵌入柔性材料层中的至少一个垂直半导体元件。 柔性半导体器件还可以包括形成在柔性材料层的第一表面上的第一电极和形成在柔性材料层的第二表面上的第二电极。 制造柔性半导体器件的方法可以包括通过使用下层和缓冲层之间的差异来弱化或降低底层和缓冲层之间的粘合力来将其中嵌入至少一个垂直半导体元件的柔性材料层从衬底分离 底层和缓冲层的热膨胀系数。

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