MEMORY DEVICE
    3.
    发明申请
    MEMORY DEVICE 审中-公开

    公开(公告)号:US20190271742A1

    公开(公告)日:2019-09-05

    申请号:US16169107

    申请日:2018-10-24

    摘要: A semiconductor memory device includes first bumps positioned along a first direction; second bumps positioned in parallel to the first bumps along the first direction; first registers connected with the first bumps; and second registers connected with the second bumps. The first registers and the second registers are sequentially connected and form a shift register.