公开(公告)号：US10678036B2

公开(公告)日：2020-06-09

申请号：US16021729

申请日：2018-06-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Woo Ha ,  Tetsuo Ariyoshi ,  Kyung Mi Moon ,  Jong Sup Song ,  Jong Pil Won

IPC: F21V5/04 ,  G02B19/00 ,  F21V7/00 ,  F21V13/04 ,  F21V5/00 ,  H01L33/62 ,  F21Y115/10 ,  F21Y105/14 ,  H01L33/56 ,  H01L33/60 ,  F21Y105/10

Abstract: An optical device is provided. The optical device includes a first surface that defines a concave light incident surface facing a central axis and a light source; a second surface disposed opposite the first surface which is configured to reflect light incident on the concave light incident surface; and an inclined light exit surface between the first surface and the second surface. The second surface includes a concave first reflective portion curving toward the first surface, and a substantially flat second reflective portion which portion is interposed between a first reflective portion edge of the first reflective portion and an outer second surface edge of the second surface. The first reflective portion is configured to totally reflect light incident at a predetermined angle or more with respect to a top surface of the light source once to the light exit surface.

公开(公告)号：US09680069B2

公开(公告)日：2017-06-13

申请号：US15098123

申请日：2016-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung Mi Moon ,  Won Soo Ji

IPC: H01L33/00 ,  H01L33/50

CPC classification number: H01L33/504 ,  H01L33/505 ,  H01L33/507 ,  H01L2224/16225 ,  H01L2933/0041

Abstract: A light emitting device package is provided. The package includes a light emitting device including a substrate, and a light emitting structure having a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer stacked on the substrate; and a wavelength conversion film disposed in a path of light emitted by the light emitting device and having phosphor layers stacked on each other. A portion of the phosphor layers includes phosphor structures including a wavelength conversion material receiving light emitted from the light emitting device and converting a wavelength thereof and a binding resin binding the wavelength conversion material, and a transparent resin filling spaces between the phosphor structures.

公开(公告)号：US09153759B2

公开(公告)日：2015-10-06

申请号：US14310664

申请日：2014-06-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hak Hwan Kim ,  Min Jung Kim ,  Kyung Mi Moon ,  Jong Sup Song ,  Jae Sung You ,  Ill Heoung Choi ,  Cheol Jun Yoo

IPC: H01L33/00 ,  H01L33/62 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L21/568 ,  H01L33/505 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/15153 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2224/83

Abstract: A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.

Abstract translation: 提供了一种发光二极管（LED）的制造方法和LED模块的制造方法。 LED的制造方法可以包括制造多个LED芯片，制造包括多个用于安装多个LED芯片的多个安装区域的荧光体预成型件，在磷光体预成型件内部施加粘合剂，安装多个LED芯片 的多个安装区域中的每一个中的LED芯片，并且将安装有多个LED芯片的荧光体预成型件切割成包括各个LED芯片的单元。

公开(公告)号：US09897266B2

公开(公告)日：2018-02-20

申请号：US15280253

申请日：2016-09-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyung Mi Moon ,  Sang Woo Ha ,  Jong Sup Song ,  Tetsuo Ariyoshi ,  Jun Cho ,  Won Soo Ji

IPC: F21K9/61 ,  F21V29/77 ,  F21V15/015 ,  F21K9/27 ,  F21V9/00 ,  F21V3/02 ,  H01L33/60 ,  H01L33/48 ,  F21Y115/10 ,  F21Y103/10

CPC classification number: F21K9/61 ,  F21K9/27 ,  F21V3/02 ,  F21V3/049 ,  F21V9/00 ,  F21V15/015 ,  F21V29/74 ,  F21V29/77 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  G02B6/00 ,  H01L33/486 ,  H01L33/60

Abstract: A light source module includes a light source, a light guide plate on the light source and including at least one recess portion in an upper surface thereof, and a filter sheet on an upper surface of the light guide plate and having a pattern. The pattern may be configured to partially reflect and partially transmit light emitted from the light source through the light guide plate.