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公开(公告)号：US10678036B2
公开(公告)日：2020-06-09
申请号：US16021729
申请日：2018-06-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sang Woo Ha , Tetsuo Ariyoshi , Kyung Mi Moon , Jong Sup Song , Jong Pil Won
IPC: F21V5/04 , G02B19/00 , F21V7/00 , F21V13/04 , F21V5/00 , H01L33/62 , F21Y115/10 , F21Y105/14 , H01L33/56 , H01L33/60 , F21Y105/10
Abstract: An optical device is provided. The optical device includes a first surface that defines a concave light incident surface facing a central axis and a light source; a second surface disposed opposite the first surface which is configured to reflect light incident on the concave light incident surface; and an inclined light exit surface between the first surface and the second surface. The second surface includes a concave first reflective portion curving toward the first surface, and a substantially flat second reflective portion which portion is interposed between a first reflective portion edge of the first reflective portion and an outer second surface edge of the second surface. The first reflective portion is configured to totally reflect light incident at a predetermined angle or more with respect to a top surface of the light source once to the light exit surface.
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公开(公告)号：US09680074B2
公开(公告)日：2017-06-13
申请号：US15058645
申请日：2016-03-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ji Hoon Yun , Jong Sup Song , Soo Hwan Lee , Saesil Kim , Mi Jeong Yun
CPC classification number: H01L33/58 , F21V3/02 , H01L33/24 , H01L33/382 , H01L33/505 , H01L2224/73204 , H01L2224/97 , H01L2933/0058
Abstract: An optical device may include a first surface having a shape of a quadrangle; and a second surface disposed to be opposite to the first surface and comprising a convex curved surface. The optical device has an aspherical shape in a cross-section taken along a diagonal direction of the quadrangle and has a semicircular shape in a cross-section taken along a direction connecting a central portion of a first side of the quadrangle and a central portion of a second side opposite to the first side of the quadrangle. In a cross-sectional view of the optical device, the second surface is continuously varied between the semicircular shape of the cross-section and the aspherical shape of the cross-section.
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公开(公告)号：US10777712B2
公开(公告)日：2020-09-15
申请号：US16109047
申请日：2018-08-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Mi Jeong Yun , Jong Sup Song
Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.
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公开(公告)号：US10121934B2
公开(公告)日：2018-11-06
申请号：US14963269
申请日：2015-12-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jong Sup Song
IPC: H01L33/00
Abstract: There is provided a method for manufacturing a semiconductor light emitting device package including steps of disposing a plurality of light emitting structures on a support substrate, each light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, shaping a mixture containing a wavelength conversion material and a glass composition on the plurality of light emitting structures, sintering the mixture to form a wavelength conversion part, removing the support substrate, and cutting the plurality of light emitting structures into individual device units.
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公开(公告)号：US11631791B2
公开(公告)日：2023-04-18
申请号：US17214992
申请日：2021-03-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Mi Jeong Yun , Jong Sup Song
Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.
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Patent Agency Ranking
公开(公告)号：US10205074B2
公开(公告)日：2019-02-12
申请号：US15232234
申请日：2016-08-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jong Sup Song
Abstract: A semiconductor light emitting device package includes a semiconductor light emitting device including a plurality of electrodes, a circuit board including a mounting region, the semiconductor light emitting device being positioned on the mounting region of the circuit board, and a plurality of electrode pads on the circuit board, the plurality of electrode pads being electrically connected to the plurality of electrodes, wherein each of the plurality of electrode pads includes a first region and a second region, the first region overlapping the mounting region, and the second region excluding the first region, and wherein the plurality of electrode pads is arranged in a shape of rotational symmetry around a pivot point of the mounting region.
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公开(公告)号：US09897266B2
公开(公告)日：2018-02-20
申请号：US15280253
申请日：2016-09-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyung Mi Moon , Sang Woo Ha , Jong Sup Song , Tetsuo Ariyoshi , Jun Cho , Won Soo Ji
IPC: F21K9/61 , F21V29/77 , F21V15/015 , F21K9/27 , F21V9/00 , F21V3/02 , H01L33/60 , H01L33/48 , F21Y115/10 , F21Y103/10
CPC classification number: F21K9/61 , F21K9/27 , F21V3/02 , F21V3/049 , F21V9/00 , F21V15/015 , F21V29/74 , F21V29/77 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , G02B6/00 , H01L33/486 , H01L33/60
Abstract: A light source module includes a light source, a light guide plate on the light source and including at least one recess portion in an upper surface thereof, and a filter sheet on an upper surface of the light guide plate and having a pattern. The pattern may be configured to partially reflect and partially transmit light emitted from the light source through the light guide plate.
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公开(公告)号：US10964854B2
公开(公告)日：2021-03-30
申请号：US17019439
申请日：2020-09-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Mi Jeong Yun , Jong Sup Song
Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.
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公开(公告)号：US10084118B2
公开(公告)日：2018-09-25
申请号：US14985784
申请日：2015-12-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Mi Jeong Yun , Jong Sup Song
CPC classification number: H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L2224/16225 , H01L2224/73253
Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.
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10.发明授权Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof 有权发光二极管及其制造方法，发光二极管模块及其制造方法公开(公告)号：US09153759B2
公开(公告)日：2015-10-06
申请号：US14310664
申请日：2014-06-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hak Hwan Kim , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
CPC classification number: H01L33/62 , H01L21/568 , H01L33/505 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/73265 , H01L2224/73267 , H01L2224/92144 , H01L2224/97 , H01L2924/15153 , H01L2933/0041 , H01L2924/00014 , H01L2224/83
Abstract: A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.
Abstract translation: 提供了一种发光二极管（LED）的制造方法和LED模块的制造方法。 LED的制造方法可以包括制造多个LED芯片，制造包括多个用于安装多个LED芯片的多个安装区域的荧光体预成型件，在磷光体预成型件内部施加粘合剂，安装多个LED芯片 的多个安装区域中的每一个中的LED芯片，并且将安装有多个LED芯片的荧光体预成型件切割成包括各个LED芯片的单元。
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