公开(公告)号：US20150130083A1

公开(公告)日：2015-05-14

申请号：US14488707

申请日：2014-09-17

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Sang-Sick PARK ,  In-Young LEE ,  Byoung-Soo KWAK ,  Min-Soo KIM ,  Sang-Wook PARK ,  Tae-Je CHO

IPC分类号： H01L25/065 ,  H01L23/34 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/36 ,  H01L23/481 ,  H01L23/49816 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83191 ,  H01L2224/94 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/00

摘要： A semiconductor device and a method of fabricating the same includes providing a first semiconductor chip which has first connection terminals, providing a second semiconductor chip which comprises top and bottom surfaces facing each other and has second connection terminals and a film-type first underfill material formed on the bottom surface thereof, bonding the first semiconductor chip to a mounting substrate by using the first connection terminals, bonding the first semiconductor chip and the second semiconductor chip by using the first underfill material, and forming a second underfill material which fills a space between the mounting substrate and the first semiconductor chip and covers side surfaces of the first semiconductor chip and at least part of side surfaces of the second semiconductor chip.

摘要翻译： 一种半导体器件及其制造方法包括提供具有第一连接端子的第一半导体芯片，提供第二半导体芯片，该第二半导体芯片包括彼此相对的顶表面和底表面，并且具有第二连接端子和形成的膜型第一底部填充材料 在其底面上，通过使用第一连接端子将第一半导体芯片接合到安装基板，通过使用第一底部填充材料接合第一半导体芯片和第二半导体芯片，以及形成填充第二底部填充材料之间的空间的第二底部填充材料 安装基板和第一半导体芯片，并且覆盖第一半导体芯片的侧表面和第二半导体芯片的至少一部分侧表面。

公开(公告)号：US20210407949A1

公开(公告)日：2021-12-30

申请号：US17220299

申请日：2021-04-01

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Sang-Sick PARK ,  Un-Byoung KANG ,  Seon Gyo KIM ,  Joon Ho JUN

IPC分类号： H01L23/00 ,  H01L23/48

摘要： A semiconductor package including a first stack; a plurality of TSVs passing through the first stack; a second stack on the first stack and including a second surface facing a first surface of the first stack; a first pad on the first stack and in contact with the TSVs; a second pad on the second stack; a bump connecting the first and second pads; a first redundancy pad on the first surface of the first stack, spaced apart from the first pad, and not in contact with the TSVs; a second redundancy pad on the second surface of the second stack and spaced apart from the second pad; and a redundancy bump connecting the first redundancy pad and the second redundancy pad, wherein the first pad and first redundancy pad are electrically connected to each other, and the second pad and second redundancy pad are electrically connected to each other.

公开(公告)号：US20130258188A1

公开(公告)日：2013-10-03

申请号：US13828618

申请日：2013-03-14

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Sang-Sick PARK ,  Myung-Sung KANG ,  Ji-Seok HONG

IPC分类号： H04N5/225

CPC分类号： H04N5/2251 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2924/0002 ,  H04N5/2257 ,  Y10T29/53178 ,  H01L2924/00

摘要： Bi-directional camera modules and flip chip bonders including the same are provided. The module includes a circuit board on which an upper sensor and a lower sensor are mounted, an upper lens and a lower lens disposed on the upper sensor and under the lower sensor, respectively, and a housing fixing the upper lens and the lower lens spaced apart from the upper sensor and the lower sensor, respectively. The housing surrounds the circuit board. The housing has a plurality of inlets and an outlet through which air flows, and the housing has an air passage connected from the inlets to the outlet via a space between lower lens and the lower sensor.

摘要翻译： 提供了包括其的双向相机模块和倒装芯片接合器。 模块包括分别安装有上传感器和下传感器的电路板，分别设置在上传感器和下传感器下的上透镜和下透镜，以及固定上透镜和下透镜间隔开的壳体 分别是上传感器和下传感器。 外壳围绕电路板。 壳体具有多个入口和空气流过的出口，并且壳体具有通过下透镜和下传感器之间的空间从入口连接到出口的空气通道。

公开(公告)号：US20180331076A1

公开(公告)日：2018-11-15

申请号：US16046471

申请日：2018-07-26

申请人： Samsung Electronics Co., Ltd.

发明人： Sang-Sick PARK ,  Geol Nam ,  Tae Hong Min ,  Jihwan Hwang

IPC分类号： H01L25/065 ,  H01L23/31 ,  H01L25/00 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13117 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16113 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/9211 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/06586 ,  H01L2924/01058 ,  H01L2924/0665 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2224/83 ,  H01L2224/81

摘要： A semiconductor package includes a plurality of semiconductor chips on a substrate. The semiconductor chips include a first semiconductor chip, a second semiconductor chip, and a third semiconductor chip that are sequentially stacked on the substrate. The semiconductor package further includes a plurality of non-conductive layers between the substrate and the first semiconductor chip and between adjacent semiconductor chips among the semiconductor chips. The semiconductor chips include smaller widths as a distance from the substrate increases. Each of the non-conductive layers includes an extension protruding outward from a side surface of an overlying one of the semiconductor chips.

公开(公告)号：US20140196280A1

公开(公告)日：2014-07-17

申请号：US14217744

申请日：2014-03-18

申请人： Samsung Electronics Co., Ltd

发明人： Chang-Seong JEON ,  Ho-Geon SONG ,  Mitsuo UMEMOTO ,  Sang-Sick PARK

IPC分类号： H01L23/00 ,  H01L21/67

CPC分类号： H01L24/74 ,  H01L21/67 ,  H01L23/16 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32151 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/7501 ,  H01L2224/7515 ,  H01L2224/7525 ,  H01L2224/75252 ,  H01L2224/75804 ,  H01L2224/75824 ,  H01L2224/759 ,  H01L2224/7598 ,  H01L2224/7901 ,  H01L2224/81011 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/8385 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T29/53178 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method and apparatus to manufacture a flip chip package includes dotting a flux on a first preliminary bump of a package substrate, attaching a preliminary bump of a first semiconductor chip to the first preliminary bump of the package substrate via the flux, dotting a flux on a second preliminary bump of the package substrate, and attaching a preliminary bump of a second semiconductor chip to the second preliminary bump of the package substrate via the flux. Accordingly, an evaporation of the flux on the preliminary bump of the package substrate may be suppressed.

摘要翻译： 制造倒装芯片封装的方法和装置包括将焊剂点到封装衬底的第一预备凸块上，通过焊剂将第一半导体芯片的初步凸点附着到封装衬底的第一初步凸块上，点焊焊剂 封装衬底的第二初步凸块，以及通过焊剂将第二半导体芯片的预备凸块附接到封装衬底的第二初级凸块。 因此，可以抑制在封装衬底的初步凸块上的焊剂的蒸发。

公开(公告)号：US20230223373A1

公开(公告)日：2023-07-13

申请号：US18119397

申请日：2023-03-09

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Sang-Sick PARK ,  Un-Byoung KANG ,  Seon Gyo KIM ,  Joon Ho JUN

IPC分类号： H01L23/00 ,  H01L23/48 ,  H01L25/065 ,  H01L25/18

CPC分类号： H01L24/17 ,  H01L24/06 ,  H01L24/16 ,  H01L23/481 ,  H01L24/14 ,  H01L24/13 ,  H01L2224/1416 ,  H01L2224/17107 ,  H01L2224/13082 ,  H01L25/0657 ,  H01L2224/06182 ,  H01L2224/05562 ,  H01L2224/73204 ,  H01L2224/02375 ,  H01L2224/02372 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L24/73 ,  H01L2224/16148 ,  H01L25/18 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2224/05024 ,  H01L2224/06158 ,  H01L2224/14152 ,  H01L2224/0401 ,  H01L2224/05078 ,  H01L2224/02381 ,  H01L2224/16145 ,  H01L24/05 ,  H01L2224/0233

摘要： A semiconductor package including a first stack; a plurality of TSVs passing through the first stack; a second stack on the first stack and including a second surface facing a first surface of the first stack; a first pad on the first stack and in contact with the TSVs; a second pad on the second stack; a bump connecting the first and second pads; a first redundancy pad on the first surface of the first stack, spaced apart from the first pad, and not in contact with the TSVs; a second redundancy pad on the second surface of the second stack and spaced apart from the second pad; and a redundancy bump connecting the first redundancy pad and the second redundancy pad, wherein the first pad and first redundancy pad are electrically connected to each other, and the second pad and second redundancy pad are electrically connected to each other.

公开(公告)号：US20220406755A1

公开(公告)日：2022-12-22

申请号：US17669773

申请日：2022-02-11

申请人： Samsung Electronics Co., Ltd.

发明人： Jongpa HONG ,  Hwail JIN ,  Sang-Sick PARK

IPC分类号： H01L25/065 ,  H01L23/48 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00

摘要： Disclosed are semiconductor packages and their fabricating methods. The semiconductor package comprises connection terminals between a first die and a second die. The first die has signal and peripheral regions and includes first vias on the peripheral region. The second die is on the first die and has second vias on positions that correspond to the first vias. The connection terminals connect the second vias to the first vias. The peripheral region includes first regions adjacent to corners of the first die and second regions adjacent to lateral surfaces of the first die. The connection terminals include first connection terminals on the first regions and second connection terminals on the second regions. A sum of areas of the first connection terminals per unit area on the first regions is greater than that of areas of the second connection terminals per unit area on the second regions.