公开(公告)号：US08227732B2

公开(公告)日：2012-07-24

申请号：US12637503

申请日：2009-12-14

申请人： Satoshi Kito ,  Junichi Suzuki ,  Norio Imaoka ,  Satoshi Fujii

发明人： Satoshi Kito ,  Junichi Suzuki ,  Norio Imaoka ,  Satoshi Fujii

IPC分类号： G01J1/32

CPC分类号： H01Q1/26 ,  G03B21/2026 ,  H05B41/2806 ,  Y02B20/22

摘要： A light source device includes an elliptical resonator, an electric discharge lamp that has an electric discharge tube and an electrode connected to the electric discharge tube and is disposed at one of two confocal points of the elliptical resonator, and a power supply antenna that supplies a microwave to the electric discharge lamp and is disposed at the other confocal point.

摘要翻译： 光源装置包括椭圆形谐振器，具有放电管的放电灯和连接到放电管并且设置在椭圆形谐振器的两个共焦点之一的电极的放电灯，以及供电天线 微波至放电灯并设置在另一共焦点处。

公开(公告)号：US08459842B2

公开(公告)日：2013-06-11

申请号：US12958636

申请日：2010-12-02

申请人： Satoshi Kito ,  Junichi Suzuki ,  Norio Imaoka

发明人： Satoshi Kito ,  Junichi Suzuki ,  Norio Imaoka

IPC分类号： F21V7/09 ,  F21V23/00 ,  H01J1/50 ,  G03B21/28

CPC分类号： H01J65/044

摘要： A light source device includes: a microwave power source which generates microwaves; a central conductor which radiates the microwaves; and a light emitter which emits light by receiving the microwaves, wherein the central conductor and the light emitter are spaced from each other.

摘要翻译： 光源装置包括：产生微波的微波功率源; 辐射微波的中心导体; 以及通过接收微波发光的发光体，其中中心导体和光发射器彼此间隔开。

公开(公告)号：US07112863B2

公开(公告)日：2006-09-26

申请号：US10823652

申请日：2004-04-14

申请人： Norio Imaoka

发明人： Norio Imaoka

IPC分类号： H01L31/0232

CPC分类号： H01L31/02019 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1469 ,  H01L31/02327 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/05548 ,  H01L2224/16225 ,  H01L2924/00014 ,  H04N5/2257 ,  H01L2224/05599 ,  H01L2224/05124

摘要： The invention provides an optical device that enables a mutual electrical connection between the stacked semiconductor substrates to be realized with ease and high reliability and to provide for miniaturization. The optical device has a first semiconductor substrate having an optical part and a first pad, a second semiconductor substrate having an integrated circuit and a second pad which is stacked under the first semiconductor substrate, a through-hole continuously extending through the first and the second semiconductor substrate, and a conductive part so formed as to include the inside of the through-hole.

摘要翻译： 本发明提供一种能够容易且高可靠性地实现叠层半导体基板之间的互电连接并提供小型化的光学装置。 光学器件具有第一半导体衬底，其具有光学部件和第一焊盘，具有集成电路的第二半导体衬底和堆叠在第一半导体衬底下方的第二焊盘，连续延伸穿过第一和第二焊盘的通孔 半导体衬底和形成为包括通孔内部的导电部分。

公开(公告)号：US06872081B2

公开(公告)日：2005-03-29

申请号：US10201777

申请日：2002-07-25

申请人： Norio Imaoka

发明人： Norio Imaoka

IPC分类号： H05K1/11 ,  H01L21/60 ,  H01L23/498 ,  H01R31/06 ,  H05K1/02 ,  H05K1/18 ,  H05K3/36 ,  H01R12/00

CPC分类号： H01R12/62 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2924/0002 ,  H01R12/7076 ,  H01R31/06 ,  H05K1/111 ,  H05K1/117 ,  H05K3/361 ,  H05K2201/09418 ,  H05K2201/10681 ,  H01L2924/00

摘要： An electronic device includes first and second electronic components. Each of terminals of a first group of the first electronic component is disposed on one of a plurality of first lines passing through a first point. Each of terminals of a second group of the second electronic component is disposed on one of a plurality of second lines passing through a second point. The first and second points coincide with each other, and the first and second lines overlap. The terminals of at least one of the first and second groups are formed to extend along first lines or second lines.

摘要翻译： 电子设备包括第一和第二电子部件。 第一组电子部件的第一组的端子设置在通过第一点的多条第一线之一上。 第二组电子部件的第二组的每个端子设置在通过第二点的多条第二线中的一条上。 第一和第二点彼此重合，第一和第二行重叠。 第一组和第二组中的至少一个的端子形成为沿着第一线或第二线延伸。

公开(公告)号：US20050012213A1

公开(公告)日：2005-01-20

申请号：US10856997

申请日：2004-06-01

申请人： Norio Imaoka

发明人： Norio Imaoka

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K3/32 ,  H05K3/36 ,  H05K3/46 ,  H01L23/48

CPC分类号： H01L21/563 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K1/111 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599

摘要： A wiring board has a substrate and an interconnect pattern formed on the substrate. The interconnect pattern includes a plurality of lands. Each of the lands includes a base section and an additional section extending from the base section, the base section of each of the lands having the same shape. When a spiral curve is rotated around an origin and disposed to pass over the base section, the additional section is formed to extend from the base section of any one of the lands in a direction along the spiral curve.

摘要翻译： 布线基板具有形成在基板上的基板和布线图案。 互连图案包括多个焊盘。 每个焊盘包括基部和从基部延伸的附加部分，每个焊盘的基部具有相同的形状。 当螺旋曲线围绕原点旋转并且设置成越过基部时，附加部分形成为沿着沿着螺旋曲线的方向从任意一个焊盘的基部延伸。

公开(公告)号：US07064443B2

公开(公告)日：2006-06-20

申请号：US10807438

申请日：2004-03-24

申请人： Norio Imaoka

发明人： Norio Imaoka

IPC分类号： H01L23/48 ,  H01L29/41

CPC分类号： H01L23/50 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05023 ,  H01L2224/05025 ,  H01L2224/05548 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A semiconductor chip includes a semiconductor substrate, terminals of A (A is an integer equal to or larger than two groups that are included in each of groups, and an integrated circuit. A plurality of terminals in each of the groups are arranged in accordance with predetermined basic terminal arrangement. Each of the A groups is disposed at each of positions that are defined by rotating one of the positions around a point. Each of the groups includes same-function terminals Vdd (Vss, OE, and WE) to achieve the same function at the same positions of the basic terminal arrangement to enable the same semiconductor chips to be stacked.

摘要翻译： 半导体芯片包括半导体衬底，A（A是包括在每个组中的等于或大于两组的整数）的端子和集成电路，每组中的多个端子根据 每个组包括相同功能的端子Vdd（Vss，OE和WE），以实现这些位置， 在基本端子装置的相同位置具有相同的功能，以使得能够堆叠相同的半导体芯片。

公开(公告)号：US5821614A

公开(公告)日：1998-10-13

申请号：US435465

申请日：1995-05-05

申请人： Nobuaki Hashimoto ,  Norio Nakamura ,  Hiroyuki Suemori ,  Hiroshi Sugai ,  Norio Imaoka ,  Kazuyoshi Noake

发明人： Nobuaki Hashimoto ,  Norio Nakamura ,  Hiroyuki Suemori ,  Hiroshi Sugai ,  Norio Imaoka ,  Kazuyoshi Noake

IPC分类号： H05K1/18 ,  H01L23/50 ,  H01L25/10 ,  H01L25/18 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K7/14 ,  H01L23/02 ,  G06K19/06 ,  H05K1/00

CPC分类号： H05K3/3415 ,  H01L24/50 ,  H05K1/148 ,  H05K7/1431 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K1/141 ,  H05K2201/10159 ,  H05K2201/10681 ,  H05K2201/10689 ,  H05K2203/0173 ,  H05K2203/1476 ,  H05K2203/1572 ,  H05K3/3421 ,  H05K3/36 ,  H05K3/361 ,  Y02P70/613

摘要： A card type semiconductor device includes a main circuit board and a first sub-circuit-board equipped with a main memory. The main circuit board is connected to the first sub-circuit-board through an FPC. A first TCP equipped with the CPU and a second TCP equipped with the I/O sub-system chip are mounted on the top and bottom surfaces of the main circuit board. The first and second TCPs are mounted to directly oppose each other. The card type semiconductor device is used as a card type computer. The main circuit board and the sub-circuit-board face each other by bending the FPC and enclosing the main circuit board and the sub-circuit-board in a card-shaped thin housing. The card type semiconductor device achieves a high density packaging in a small form factor. The card type semiconductor device supports high speed operations and provides a structure for adaptation to new applications quickly and inexpensively by allowing easy replacement of the sub-circuit-board with other sub-circuit boards that perform a wide range of functions.

摘要翻译： 卡式半导体器件包括主电路板和配备有主存储器的第一子电路板。 主电路板通过FPC连接到第一子电路板。 配备有CPU的第一TCP和配备有I / O子系统芯片的第二TCP安装在主电路板的顶表面和底表面上。 第一和第二TCP被安装成彼此直接相对。 卡式半导体器件用作卡式计算机。 主电路板和子电路板通过弯曲FPC并将主电路板和子电路板封装在卡形薄壳体中来彼此面对。 卡式半导体器件以小尺寸实现高密度封装。 卡式半导体器件支持高速操作，并且通过允许使用执行广泛功能的其他子电路板容易地更换子电路板来快速且低成本地提供用于适应新应用的结构。

公开(公告)号：US07591651B2

公开(公告)日：2009-09-22

申请号：US11837441

申请日：2007-08-10

申请人： Norio Imaoka

发明人： Norio Imaoka

IPC分类号： H01R12/00

CPC分类号： G02F1/1345

摘要： A mounting structure has a substrate with a plurality of terminals having helically curved portions superimposed and electrically connected to a plurality of identical helically curved terminals on a second substrate. This increases the precision of positioning the terminals on one substrate on to those on a second substrate by relatively rotating the first and second substrates which have reference points coincident with each other.

摘要翻译： 安装结构具有多个端子的基板，所述多个端子具有螺旋形弯曲部分，该第二端子叠加并电连接到第二基板上的多个相同的螺旋形弯曲端子。 这通过相对旋转具有彼此重合的参考点的第一和第二基板来增加将一个基板上的端子定位在第二基板上的精度。

公开(公告)号：US07129446B2

公开(公告)日：2006-10-31

申请号：US10829099

申请日：2004-04-21

申请人： Norio Imaoka

发明人： Norio Imaoka

IPC分类号： F27B9/06 ,  F27D11/00

CPC分类号： B23K3/047 ,  B23K1/008 ,  B23K2101/40

摘要： A device is provided to heat the whole heated surface of a carried member carried intermittently with a temperature change over time maintained constant. The device controls the driving of a belt-conveyer so that a heater moves in a carrying direction at a carry time movement velocity that is slower than the carry velocity of a TAB tape if the TAB tape is in a carried state. On the other hand, the heater moves in an opposite carrying direction at a carry standby time movement velocity derived from the difference between the carry velocity and the carry time movement velocity if the TAB tape is in a carry standby state.

摘要翻译： 提供了一种装置，用于随着时间的变化而间歇地承载携带部件的整个被加热表面，保持恒定。 该装置控制带式输送机的驱动，使得如果TAB带处于承载状态，加热器以比TAB带的进位速度慢的携带时间移动速度沿传送方向移动。 另一方面，如果TAB带处于进位待机状态，则加热器以从进位速度和进位时间移动速度之间的差导出的进位待机时间移动速度沿相反的传送方向移动。

公开(公告)号：US07122909B2

公开(公告)日：2006-10-17

申请号：US10856997

申请日：2004-06-01

申请人： Norio Imaoka

发明人： Norio Imaoka

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/563 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K1/111 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599

摘要： A wiring board has a substrate and an interconnect pattern formed on the substrate. The interconnect pattern includes a plurality of lands. Each of the lands includes a base section and an additional section extending from the base section, the base section of each of the lands having the same shape. When a spiral curve is rotated around an origin and disposed to pass over the base section, the additional section is formed to extend from the base section of any one of the lands in a direction along the spiral curve.

摘要翻译： 布线板具有形成在基板上的基板和布线图案。 互连图案包括多个焊盘。 每个焊盘包括基部和从基部延伸的附加部分，每个焊盘的基部具有相同的形状。 当螺旋曲线围绕原点旋转并且设置成越过基部时，附加部分形成为沿着沿着螺旋曲线的方向从任意一个焊盘的基部延伸。