公开(公告)号：US08343085B2

公开(公告)日：2013-01-01

申请号：US12680298

申请日：2009-12-15

Applicant: Masahiro Toyoda ,  Satoshi Takeuchi

Inventor： Masahiro Toyoda ,  Satoshi Takeuchi

IPC: A61M37/00

CPC classification number: A61M1/3643 ,  A61M1/3626 ,  A61M1/3644 ,  A61M1/3646 ,  A61M1/3649

Abstract: The present invention relates to a blood purification apparatus for extracorporeally circulating the blood of a patient so as to purify the blood for medical treatment incorporating a dialyzer and a method for priming the blood purification apparatus, wherein the present invention provides a blood purification apparatus and its priming method which can simply and easily automate the priming operation and also can surely and smoothly perform the bubble purging of the dialyzer.

Abstract translation: 本发明涉及一种血液净化装置，其用于体外循环患者的血液，以净化包含透析器的医疗用血液，以及用于引导血液净化装置的方法，其中本发明提供一种血液净化装置及其 起动方法，其可以简单且容易地自动化起动操作，并且还可以可靠和平稳地执行透析器的气泡吹扫。

公开(公告)号：US07889510B2

公开(公告)日：2011-02-15

申请号：US11797206

申请日：2007-05-01

Applicant: Satoshi Takeuchi ,  Hiroki Kamiya ,  Katsunori Kubota ,  Motoki Shimizu

Inventor： Satoshi Takeuchi ,  Hiroki Kamiya ,  Katsunori Kubota ,  Motoki Shimizu

IPC: H05K1/18

CPC classification number: G01R31/2818 ,  G01R31/2812 ,  H05K1/0268 ,  H05K1/186 ,  H05K3/4614 ,  H05K3/4617 ,  H05K2201/0394 ,  H05K2201/09254 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611

Abstract: A component-embedded board device has a wiring board in which an electronic component is embedded, a connection member which is conductive and arranged at a surface of the wiring board, and an inner wiring unit which is arranged in the wiring board and connects an electrode of the electronic component with the connection member. The component-embedded board device is further provided with an inspection connection member for an inspection of a faulty wiring of the inner wiring unit, and an inspection wiring unit which is arranged in the wiring board and connects the inspection connection member with one of the electrode and a predetermined portion of the inner wiring unit. The inspection connection member is conductive and arranged at a surface of the wiring board.

Abstract translation: 组件嵌入式板装置具有嵌入有电子部件的布线基板，导电性配置在配线基板的表面的连接部件和配置在配线基板上的内部配线部， 的电子部件。 组件嵌入式板装置还具有用于检查内部布线单元的故障布线的检查连接构件和布置在布线板中并将检查连接构件与电极之一连接的检查布线单元 和内部布线单元的预定部分。 检查连接构件是导电的并且布置在布线板的表面上。

公开(公告)号：US5153706A

公开(公告)日：1992-10-06

申请号：US676370

申请日：1991-03-28

Applicant: Isao Baba ,  Satoshi Takeuchi ,  Kazunori Hayashi

Inventor： Isao Baba ,  Satoshi Takeuchi ,  Kazunori Hayashi

IPC: H01L21/52 ,  H01L23/495 ,  H01L23/50

CPC classification number: H01L23/49582 ,  H01L23/49503 ,  H01L2224/45144 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01322

Abstract: In a lead frame for use in a plastic mold type semiconductor device having a frame, a die pad on which a semiconductor element is mounted, a tie bar for connecting the die pad to said frame and for supporting the die pad, a plurality of leads whose inner ends of the leads are disposed around the die pad and the leads have inner leads portions which are portions to be sealed in a mold, metal plated region applied only to cover the inner lead and opposite end portions of the the die pad respectively confronting the inner leads, but the tie bar is not plated.

Abstract translation: 在用于具有框架的塑料模具型半导体器件的引线框架中，安装有半导体元件的管芯焊盘，用于将管芯焊盘连接到所述框架并用于支撑管芯焊盘的连接杆，多个引线 其引线的内端设置在芯片焊盘周围，并且引线具有内部引线部分，其是要被密封在模具中的部分，金属镀覆区域仅施加以覆盖分别面对的管芯焊盘的内引线和相对端部 内部引线，但是连接条没有电镀。

公开(公告)号：US4856857A

公开(公告)日：1989-08-15

申请号：US249194

申请日：1988-09-26

Applicant: Satoshi Takeuchi ,  Koutaro Danjo ,  Shigehiko Tahara ,  Yoshiharu Yui ,  Satoshi Ikeda

Inventor： Satoshi Takeuchi ,  Koutaro Danjo ,  Shigehiko Tahara ,  Yoshiharu Yui ,  Satoshi Ikeda

IPC: B42D15/10 ,  G03H1/02 ,  G06K19/16

CPC classification number: G03H1/0252 ,  B42D25/324 ,  B42D25/328 ,  B42D25/373 ,  B42D25/415 ,  B42D25/42 ,  B42D25/425 ,  G03H1/0244 ,  G06K19/16 ,  B42D2033/04 ,  B42D2033/10 ,  B42D2033/20 ,  B42D2033/30 ,  B42D2033/32 ,  B42D2035/06 ,  B42D2035/08 ,  B42D2035/16 ,  B42D2035/34 ,  B42D25/47 ,  G03H1/0248 ,  G03H2250/10 ,  G03H2250/12 ,  G03H2250/36 ,  G03H2250/40 ,  G03H2270/52 ,  Y10S283/904

Abstract: A transparent-type hologram comprising a transparent hologram-forming layer and a holographic effect-enhancing layer comprising a thin transparent film, the holographic effect-enhancing layer being laminated on the hologram-forming portion of the transparent hologram-forming layer. The holographic effect-enhancing layer has a refractive index different from that of the transparent hologram-forming layer.

Abstract translation: 包括透明全息图形成层和包括薄透明膜的全息效果增强层的透明型全息图层叠在透明全息图形成层的全息图形成部分上的全息效果增强层。 全息效果增强层的折射率与透明全息图形成层的折射率不同。

公开(公告)号：US4579804A

公开(公告)日：1986-04-01

申请号：US468689

申请日：1983-02-22

Applicant: Satoshi Takeuchi ,  Masanori Akada ,  Ryohei Takiguchi ,  Yoshiaki Hida ,  Hideki Takematsu

Inventor： Satoshi Takeuchi ,  Masanori Akada ,  Ryohei Takiguchi ,  Yoshiaki Hida ,  Hideki Takematsu

IPC: G03C5/58 ,  H05K3/10 ,  G03C1/62 ,  G03C5/34

CPC classification number: H05K3/106 ,  G03C5/58

Abstract: An image forming material comprises an image forming layer disposed on a support and comprising (a) aqueous composition comprising a hydrophilic binder layer containing metal developing nuclei or their precursor compound, and water and (b) an organic composition comprising an oil-soluble development inhibitor which is a compound having a diazo group or azide group and a water-miscible organic solvent. An image is formed by exposing the image forming layer to patternized light and then contacting it with a developer containing reducible metal ions and a reducing agent thereby to form an image constituted by metal particles grown at the light-exposed parts.

Abstract translation: 图像形成材料包括设置在载体上的成像层，并且包含（a）包含含有金属显影核的亲水性粘合剂层或其前体化合物的水性组合物和水，和（b）包含油溶性显影抑制剂的有机组合物 其为具有重氮基或叠氮基的化合物和水混溶性有机溶剂。 通过将图像形成层暴露于图案化光，然后使其与含有可还原金属离子和还原剂的显影剂接触而形成图像，从而形成由在曝光部分生长的金属颗粒构成的图像。

公开(公告)号：US3944330A

公开(公告)日：1976-03-16

申请号：US399481

申请日：1973-09-21

Applicant: Ichiro Tsunoda ,  Satoshi Takeuchi ,  Yoichiro Hirao ,  Takeo Suzuki ,  Yoshihiro Nishiue ,  Katsumasa Tadokoro ,  Toshimasa Fukagawa ,  Isamu Harada ,  Akira Misawa ,  Kazuo Watanabe

Inventor： Ichiro Tsunoda ,  Satoshi Takeuchi ,  Yoichiro Hirao ,  Takeo Suzuki ,  Yoshihiro Nishiue ,  Katsumasa Tadokoro ,  Toshimasa Fukagawa ,  Isamu Harada ,  Akira Misawa ,  Kazuo Watanabe

IPC: G01R13/40 ,  G02F1/133 ,  H04M15/30 ,  G02F1/13

CPC classification number: H04M15/30 ,  G01R13/40 ,  G02F1/133

Abstract: An electro-optic device comprises a plurality of first electrodes provided on a top substrate and a second electrode provided on a bottom substrate, the first electrodes confronting the second electrode through electro-optical matter which will show electro-optical phenomena by the application of electric field, the first and second electrodes being connected through electrical elements such as resistors or capacitors to a variable voltage source. In this electro-optic device, the electric field applied between the first and second electrodes are partially changed by various means, for instance, by making the areas of the first electrodes different, or by varying the values of the electrical elements such as resistors or capacitors, as a result of which the electro-optical matter shows various electro-optical phenomena.

Abstract translation: 电光装置包括设置在顶部基板上的多个第一电极和设置在底部基板上的第二电极，第一电极通过电光物质面对第二电极，该电光物质将通过施加电气而显示电光现象 第一和第二电极通过电气元件例如电阻器或电容器连接到可变电压源。 在该电光装置中，施加在第一和第二电极之间的电场通过各种方式被部分地改变，例如通过使第一电极的面积不同，或者通过改变电气元件的值例如电阻器或 电容器，其结果是电光物质表现出各种电光学现象。

公开(公告)号：US07931065B2

公开(公告)日：2011-04-26

申请号：US12385895

申请日：2009-04-23

Applicant: Satoshi Takeuchi ,  Atusi Sakaida ,  Toshihisa Taniguchi ,  Toshikazu Harada ,  Maki Chiba

Inventor： Satoshi Takeuchi ,  Atusi Sakaida ,  Toshihisa Taniguchi ,  Toshikazu Harada ,  Maki Chiba

IPC: B32B37/00

CPC classification number: B30B15/061 ,  B30B15/024 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2203/065 ,  H05K2203/068

Abstract: In a printed circuit board manufacturing equipment, a pressing die includes a first pressing part, a second pressing part, and a frame part. A buffer member is disposed between a first surface of a laminated body and the first pressing part. The second pressing part has a portion facing a second surface of the laminated body and a portion facing the buffer member. The frame part surrounds a whole area of a side surface of the buffer member. Before pressing and heating, the laminated body, the second pressing part, and the buffer member define an escape space therebetween for escaping the buffer member deformed due to the pressing. A lip protrudes from the frame part toward the laminated body. The lip is deformed following the deformation of the buffer member and comes in contact with a surface of the second pressing part facing the buffer member.

Abstract translation: 在印刷电路板制造装置中，压模包括第一按压部，第二按压部和框部。 缓冲构件设置在层叠体的第一表面和第一按压部之间。 第二按压部具有面向层叠体的第二面的部分和面向缓冲部件的部分。 框架部分围绕缓冲构件的侧表面的整个区域。 在加压之前，层叠体，第二按压部和缓冲部件在其间限定了由于按压而变形的缓冲部件的逸出空间。 唇缘从框架部分朝向层叠体突出。 在缓冲构件的变形之后唇部变形，并且与第二按压部的面向缓冲构件的表面接触。

公开(公告)号：US07879656B2

公开(公告)日：2011-02-01

申请号：US12659712

申请日：2010-03-18

Applicant: Hiroki Kamiya ,  Motoki Shimizu ,  Satoshi Takeuchi

Inventor： Hiroki Kamiya ,  Motoki Shimizu ,  Satoshi Takeuchi

IPC: H01L21/44 ,  H01L21/48

CPC classification number: H05K1/186 ,  H05K1/183 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/091 ,  H05K2201/09781 ,  H05K2201/09909 ,  H05K2201/1059 ,  H05K2201/10636 ,  H05K2201/2036 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A multilayer substrate includes an insulating base member having a plurality of resin films, an electric element embedded in the insulating base member, and a spacer. The resin films are made of a thermoplastic resin and stacked and attached to each other. At least one resin film has a through hole for inserting the electric element. The one resin film further has a plurality of protruding members. One protruding member opposes to another one protruding member so that the one and the another one contact and sandwich the electric element. The spacer is arranged between the one resin film and an adjacent resin film and is disposed at a base portion of one of the protruding members.

Abstract translation: 多层基板包括具有多个树脂膜的绝缘基底构件，嵌入绝缘基底构件中的电气元件和间隔件。 树脂膜由热塑性树脂制成并且彼此堆叠并附接。 至少一个树脂膜具有用于插入电气元件的通孔。 一个树脂膜还具有多个突出部件。 一个突出构件与另一个突出构件相对，使得一个和另一个突出构件接触并夹着电气元件。 间隔件布置在一个树脂膜和相邻的树脂膜之间，并且设置在一个突出构件的基部。

公开(公告)号：US20070263369A1

公开(公告)日：2007-11-15

申请号：US11797206

申请日：2007-05-01

Applicant: Satoshi Takeuchi ,  Hiroki Kamiya ,  Katsunori Kubota ,  Motoki Shimizu

Inventor： Satoshi Takeuchi ,  Hiroki Kamiya ,  Katsunori Kubota ,  Motoki Shimizu

IPC: H05K7/00

CPC classification number: G01R31/2818 ,  G01R31/2812 ,  H05K1/0268 ,  H05K1/186 ,  H05K3/4614 ,  H05K3/4617 ,  H05K2201/0394 ,  H05K2201/09254 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611

Abstract: A component-embedded board device has a wiring board in which an electronic component is embedded, a connection member which is conductive and arranged at a surface of the wiring board, and an inner wiring unit which is arranged in the wiring board and connects an electrode of the electronic component with the connection member. The component-embedded board device is further provided with an inspection connection member for an inspection of a faulty wiring of the inner wiring unit, and an inspection wiring unit which is arranged in the wiring board and connects the inspection connection member with one of the electrode and a predetermined portion of the inner wiring unit. The inspection connection member is conductive and arranged at a surface of the wiring board.

Abstract translation: 组件嵌入式板装置具有嵌入有电子部件的布线基板，导电性配置在配线基板的表面的连接部件和配置在配线基板上的内部配线部， 的电子部件。 组件嵌入式板装置还具有用于检查内部布线单元的故障布线的检查连接构件和布置在布线板中并将检查连接构件与电极之一连接的检查布线单元 和内部布线单元的预定部分。 检查连接构件是导电的并且布置在布线板的表面上。

公开(公告)号：US07287321B2

公开(公告)日：2007-10-30

申请号：US11211526

申请日：2005-08-26

Applicant: Satoshi Takeuchi ,  Motoki Shimizu

Inventor： Satoshi Takeuchi ,  Motoki Shimizu

CPC classification number: H05K1/186 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0394 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165

Abstract: Two types of resin films are prepared for manufacturing a multi-layer board containing a chip component. A fist type has a via hole for the chip component to be inserted into, while a second type does not have the via hole. Resin films including the two types are piled before the chip component is inserted. At least a given resin film of the first type has a via hole provided with protruding members. Of the protruding members, opposing protruding members form a gap between their tips. This gap is shorter than an outer dimension of the inserted chip component. The chip component crushes portion of the tips of the protruding members while being pressed and inserted into the via hole in the given resin film.

Abstract translation: 制备两种类型的树脂膜用于制造包含芯片部件的多层板。 第一类型具有用于芯片部件插入的通孔，而第二类型不具有通孔。 包括两种类型的树脂膜在芯片部件插入之前被堆叠。 至少一种给定的第一类树脂膜具有设置有突出构件的通孔。 在突出构件中，相对的突出构件在其尖端之间形成间隙。 该间隙比插入的芯片组件的外部尺寸短。 芯片部件在被按压并插入到给定树脂膜中的通孔中的同时粉碎突出部件的尖端的部分。