公开(公告)号：US06376054B1

公开(公告)日：2002-04-23

申请号：US09249985

申请日：1999-02-10

申请人： Scott I. Langenthal ,  Thomas E. Lombardi ,  Richard Francis Indyk ,  John Ulrich Knickerbocker ,  Srinivasa S. N. Reddy ,  Richard A. Shelleman ,  Rao V. Vallabhaneni ,  Donald Rene Wall

发明人： Scott I. Langenthal ,  Thomas E. Lombardi ,  Richard Francis Indyk ,  John Ulrich Knickerbocker ,  Srinivasa S. N. Reddy ,  Richard A. Shelleman ,  Rao V. Vallabhaneni ,  Donald Rene Wall

IPC分类号： B32B300

CPC分类号： G01R1/0466 ,  G01R1/0408 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A cost-effective surface metallization structure of a TCA carrier is produced by using a high-grit conducting paste to fill TSM vias in the TSM of the TCA carrier. This concept can be applied to alumina substrates with refractory metal conductors or to LCGC substrates with more noble metal conductors.

摘要翻译： 通过使用高粒度导电膏来填充TCA载体的TSM中的TSM通孔，制造了TCA载体的经济有效的表面金属化结构。 该概念可以应用于具有难熔金属导体的氧化铝衬底或具有更贵贵金属导体的LCGC衬底。

公开(公告)号：US06312791B1

公开(公告)日：2001-11-06

申请号：US09648862

申请日：2000-08-25

申请人： Benjamin V. Fasano ,  David H. Gabriels ,  Richard F. Indyk ,  Sundar M. Kamath ,  Scott I. Langenthal ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

发明人： Benjamin V. Fasano ,  David H. Gabriels ,  Richard F. Indyk ,  Sundar M. Kamath ,  Scott I. Langenthal ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

IPC分类号： B32B300

CPC分类号： H05K3/4092 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/4053 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09781 ,  H05K2201/0979 ,  Y10T428/24917 ,  Y10T428/24926

摘要： Disclosed is a multilayer ceramic substrate having an outer pad, for example an I/O pad, which is anchored to a middle pad of the multilayer ceramic substrate by a plurality of vias which in turn is anchored to an inner pad of the multilayer ceramic substrate by a second plurality of vias. The middle and outer pads and vias are made of high metal material, preferably 100% metal, so they won't adhere very well to the ceramic substrate. The inner pad is a composite metal/ceramic material which will bond very well to the ceramic substrate.

摘要翻译： 公开了一种多层陶瓷基板，其具有外焊盘，例如I / O焊盘，其通过多个通孔锚定到多层陶瓷基板的中间焊盘，所述多个通孔又固定到多层陶瓷基板的内焊盘 通过第二多个通孔。 中间和外部焊盘和通孔由高金属材料制成，优选为100％金属，因此它们不会很好地粘附到陶瓷基板上。 内垫是复合金属/陶瓷材料，其将很好地结合到陶瓷基底上。

公开(公告)号：US06187418B1

公开(公告)日：2001-02-13

申请号：US09356944

申请日：1999-07-19

申请人： Benjamin V. Fasano ,  David H. Gabriels ,  Richard F. Indyk ,  Sundar M. Kamath ,  Scott I. Langenthal ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

发明人： Benjamin V. Fasano ,  David H. Gabriels ,  Richard F. Indyk ,  Sundar M. Kamath ,  Scott I. Langenthal ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

IPC分类号： B32B300

CPC分类号： H05K3/4092 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/4053 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09781 ,  H05K2201/0979 ,  Y10T428/24917 ,  Y10T428/24926

摘要： Disclosed is a multilayer ceramic substrate having an outer pad, for example an I/O pad, which is anchored to an inner pad of the multilayer ceramic substrate by either a plurality of vias or one large via. The outer pad and vias are made of high metal material, preferably 100% metal, so they won't adhere very well to the ceramic substrate. The inner pad is a composite metal/ceramic material which will bond very well to the ceramic substrate.

摘要翻译： 公开了一种多层陶瓷基板，其具有外焊盘，例如I / O焊盘，其通过多个通孔或一个大通孔锚定到多层陶瓷基板的内焊盘。 外垫和通孔由高金属材料制成，优选为100％金属，因此它们将不能很好地粘附到陶瓷基片上。 内垫是复合金属/陶瓷材料，其将很好地结合到陶瓷基底上。

公开(公告)号：US5073180A

公开(公告)日：1991-12-17

申请号：US672517

申请日：1991-03-20

申请人： Shaji Farooq ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Richard A. Shelleman ,  Nancy C. Stoffel ,  Rao V. Vallabhaneni

发明人： Shaji Farooq ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Richard A. Shelleman ,  Nancy C. Stoffel ,  Rao V. Vallabhaneni

IPC分类号： C03B32/02 ,  C03C3/064 ,  C03C10/00 ,  C03C17/10 ,  C04B35/622 ,  C04B35/64 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46

CPC分类号： H05K3/4629 ,  H05K3/4611 ,  H05K1/0306 ,  H05K1/092 ,  Y10T29/49126 ,  Y10T29/49163

摘要： A method for forming a co-fired glass ceramic structure including the steps of:forming at least one green sheet of a first crystallizable glass in a thermally decomposable binder;metallizing the green sheet with a pattern of conductive paste including conductive metal, a second crystallizable glass and a thermally decomposable binder, the pattern including at least one via;firing the green sheet according to the following firing cycle steps:a. preheating the green sheet to a first temperature in a furnace with a neutral or reducing ambient so as to effect pyrolysis of the thermally decomposable binders, wherein the first temperature is insufficient to coalesce the first crystallizable glass or the conductive paste;b. introducing a steam ambient into the furnace and then heating the green sheet in the furnace at the first temperature to burn off the pyrolyzed binders;c. replacing the steam ambient with a neutral or reducing ambient and raising the temperature to a second temperature to effect densification and crystallization of the first and second glasses;d. maintaining the second temperature for a predetermined time to effect sealing of the at least one via wherein for a first portion of the predetermined time, the ambient in said furnace is a neutral or reducing ambient and for a second portion of the predetermined time, the neutral or reducing ambient is replaced with a steam ambient; ande. cooling the structure.

公开(公告)号：US06974358B2

公开(公告)日：2005-12-13

申请号：US10462275

申请日：2003-06-16

申请人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

发明人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

IPC分类号： H01F1/09 ,  H01F41/02 ,  H01J1/62 ,  H01J29/64 ,  H01J29/68

CPC分类号： H01J29/68

摘要： The present invention relates generally to a new dielectric forming metal/ceramic laminate magnet and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area laminate magnet with a significant number of holes, integrated dielectric forming metal plate(s) and electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display and electron beam source and methods of manufacture thereof.

摘要翻译： 本发明一般涉及一种新的电介质形成金属/陶瓷层叠磁体及其工艺。 更具体地，本发明包括用于制造具有大量孔的大面积层压磁体，用于电子和电子束控制的集成电介质形成金属板和电极的新方法。 本发明还涉及磁矩阵显示器和电子束源及其制造方法。

公开(公告)号：US06319829B1

公开(公告)日：2001-11-20

申请号：US09376599

申请日：1999-08-18

申请人： Robert W. Pasco ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

发明人： Robert W. Pasco ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

IPC分类号： H01L2144

CPC分类号： H01L23/49827 ,  H01L2224/16225 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/068 ,  H05K2201/10378 ,  Y02P70/613

摘要： A semiconductor chip interposer increases fatigue life of interconnections between a first component having a relatively high thermal coefficient of expansion (TCE) and a second component having a relatively low TCE. The semiconductor chip interposer includes a thin metal plate having a plurality of through holes, the thin metal plate having a TCE intermediate the relatively high TCE and the relatively low TCE. An insulation coating on the thin metal plate is also included on walls of the through holes. An electrical conductive material fills each of the insulated through holes for electrical interconnection between the first component and the second component.

摘要翻译： 半导体芯片插入器增加具有相对较高的热膨胀系数（TCE）的第一部件和具有相对较低TCE的第二部件之间的互连的疲劳寿命。 半导体芯片插入件包括具有多个通孔的薄金属板，该薄金属板具有TCE中间相对高的TCE和相对较低的TCE。 薄金属板上的绝缘涂层也包括在通孔的壁上。 导电材料填充每个绝缘通孔，用于第一部件和第二部件之间的电互连。

公开(公告)号：US5525761A

公开(公告)日：1996-06-11

申请号：US466559

申请日：1995-06-06

申请人： Lawrence D. David ,  Shaji Farooq ,  Anthony Mastreani ,  Srinivasa S-N. Reddy ,  Rao V. Vallabhaneni

发明人： Lawrence D. David ,  Shaji Farooq ,  Anthony Mastreani ,  Srinivasa S-N. Reddy ,  Rao V. Vallabhaneni

IPC分类号： H01B1/16 ,  H01L23/498 ,  H05K1/09 ,  H05K3/46

CPC分类号： H05K1/092 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4629

摘要： A copper-based paste for multilayer ceramic substrate vias and lines including copper particles as the majority constituent of the paste, a refractory metal additive selected from the group consisting of chromium, tantalum, and tungsten, and organic materials.This copper-based paste has particular applicability to the formation of vias and lines in ceramic packages wherein the vias and lines would have a composition principally of copper with additions of the refractory metal.

公开(公告)号：US06653776B1

公开(公告)日：2003-11-25

申请号：US09605694

申请日：2000-06-28

申请人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

发明人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

IPC分类号： H01J2964

CPC分类号： H01J29/68

摘要： The present invention relates generally to a new dielectric forming metal/ceramic laminate magnet and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area laminate magnet with a significant number of holes, integrated dielectric forming metal plate(s) and electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display and electron beam source and methods of manufacture thereof.

公开(公告)号：US06494758B1

公开(公告)日：2002-12-17

申请号：US09364842

申请日：1999-07-30

申请人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

发明人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

IPC分类号： H01J924

CPC分类号： H01F1/0027 ,  H01J9/244

摘要： The present invention relates generally to a new metal/ceramic laminate magnet and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area laminate magnet with a significant number of holes, integrated metal plate(s) and electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display and electron beam source and methods of manufacture thereof.

摘要翻译： 本发明一般涉及新的金属/陶瓷层叠磁体及其工艺。 更具体地，本发明包括用于制造具有大量孔的大面积层压磁体，用于电子和电子束控制的集成金属板和电极的新方法。 本发明还涉及磁矩阵显示器和电子束源及其制造方法。

公开(公告)号：US5512711A

公开(公告)日：1996-04-30

申请号：US258896

申请日：1994-06-10

申请人： Lawrence D. David ,  Shaji Farooq ,  Anthony Mastreani ,  Srinivasa S-N. Reddy ,  Rao V. Vallabhaneni

发明人： Lawrence D. David ,  Shaji Farooq ,  Anthony Mastreani ,  Srinivasa S-N. Reddy ,  Rao V. Vallabhaneni

IPC分类号： H01B1/16 ,  H01L23/498 ,  H05K1/09 ,  H05K3/46

CPC分类号： H05K1/092 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4629

摘要： A copper-based paste for multilayer ceramic substrate vias and lines including copper particles as the majority constituent of the paste, a refractory metal additive selected from the group consisting of chromium, tantalum, and tungsten, and organic materials. This copper-based paste has particular applicability to the formation of vias and lines in ceramic packages wherein the vias and lines would have a composition principally of copper with additions of the refractory metal.

摘要翻译： 用于多层陶瓷基板通孔的铜基糊料和包括作为糊料的主要成分的铜颗粒的管线，选自铬，钽和钨的难熔金属添加剂和有机材料。 这种铜基糊料特别适用于在陶瓷包装中形成通孔和管线，其中通孔和管线将具有主要由铜组成的添加难熔金属的组合物。