公开(公告)号：US06312791B1

公开(公告)日：2001-11-06

申请号：US09648862

申请日：2000-08-25

申请人： Benjamin V. Fasano ,  David H. Gabriels ,  Richard F. Indyk ,  Sundar M. Kamath ,  Scott I. Langenthal ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

发明人： Benjamin V. Fasano ,  David H. Gabriels ,  Richard F. Indyk ,  Sundar M. Kamath ,  Scott I. Langenthal ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

IPC分类号： B32B300

CPC分类号： H05K3/4092 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/4053 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09781 ,  H05K2201/0979 ,  Y10T428/24917 ,  Y10T428/24926

摘要： Disclosed is a multilayer ceramic substrate having an outer pad, for example an I/O pad, which is anchored to a middle pad of the multilayer ceramic substrate by a plurality of vias which in turn is anchored to an inner pad of the multilayer ceramic substrate by a second plurality of vias. The middle and outer pads and vias are made of high metal material, preferably 100% metal, so they won't adhere very well to the ceramic substrate. The inner pad is a composite metal/ceramic material which will bond very well to the ceramic substrate.

摘要翻译： 公开了一种多层陶瓷基板，其具有外焊盘，例如I / O焊盘，其通过多个通孔锚定到多层陶瓷基板的中间焊盘，所述多个通孔又固定到多层陶瓷基板的内焊盘 通过第二多个通孔。 中间和外部焊盘和通孔由高金属材料制成，优选为100％金属，因此它们不会很好地粘附到陶瓷基板上。 内垫是复合金属/陶瓷材料，其将很好地结合到陶瓷基底上。

公开(公告)号：US06187418B1

公开(公告)日：2001-02-13

申请号：US09356944

申请日：1999-07-19

申请人： Benjamin V. Fasano ,  David H. Gabriels ,  Richard F. Indyk ,  Sundar M. Kamath ,  Scott I. Langenthal ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

发明人： Benjamin V. Fasano ,  David H. Gabriels ,  Richard F. Indyk ,  Sundar M. Kamath ,  Scott I. Langenthal ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

IPC分类号： B32B300

CPC分类号： H05K3/4092 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/4053 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09781 ,  H05K2201/0979 ,  Y10T428/24917 ,  Y10T428/24926

摘要： Disclosed is a multilayer ceramic substrate having an outer pad, for example an I/O pad, which is anchored to an inner pad of the multilayer ceramic substrate by either a plurality of vias or one large via. The outer pad and vias are made of high metal material, preferably 100% metal, so they won't adhere very well to the ceramic substrate. The inner pad is a composite metal/ceramic material which will bond very well to the ceramic substrate.

摘要翻译： 公开了一种多层陶瓷基板，其具有外焊盘，例如I / O焊盘，其通过多个通孔或一个大通孔锚定到多层陶瓷基板的内焊盘。 外垫和通孔由高金属材料制成，优选为100％金属，因此它们将不能很好地粘附到陶瓷基片上。 内垫是复合金属/陶瓷材料，其将很好地结合到陶瓷基底上。

公开(公告)号：US6136419A

公开(公告)日：2000-10-24

申请号：US320532

申请日：1999-05-26

申请人： Benjamin V. Fasano ,  Richard F. Indyk ,  Sundar M. Kamath ,  John U. Knickerbocker ,  Scott I. Langenthal ,  Daniel P. O'Connor ,  Srinivasa S. N. Reddy

发明人： Benjamin V. Fasano ,  Richard F. Indyk ,  Sundar M. Kamath ,  John U. Knickerbocker ,  Scott I. Langenthal ,  Daniel P. O'Connor ,  Srinivasa S. N. Reddy

IPC分类号： H05K1/11 ,  B32B18/00 ,  H01L23/12 ,  H01L23/498 ,  H05K1/03 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46 ,  B32B3/00

CPC分类号： H05K3/4061 ,  B32B18/00 ,  C04B37/021 ,  H01L23/49822 ,  H01L23/49827 ,  C04B2237/343 ,  C04B2237/345 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/407 ,  C04B2237/408 ,  C04B2237/706 ,  C04B2237/708 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0272 ,  H05K1/0306 ,  H05K2201/0347 ,  H05K2201/0352 ,  H05K2201/096 ,  H05K3/246 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T428/24926

摘要： Disclosed is a multilayer ceramic substrate, and a method for forming same, which has an outer unsealed layer having a metallic via, an inner sealed layer having a composite via of metallic and ceramic materials and a further unsealed layer having a metallic via.

摘要翻译： 公开了一种多层陶瓷基板及其形成方法，其具有具有金属通孔的外部未密封层，具有金属和陶瓷材料的复合通孔的内密封层和具有金属通孔的另外的未密封层。

公开(公告)号：US06258191B1

公开(公告)日：2001-07-10

申请号：US09153988

申请日：1998-09-16

申请人： Benjamin V. Fasano ,  Lewis S. Goldmann ,  Richard F. Indyk ,  Sundar M. Kamath ,  Scott I. Langenthal ,  Srinivasa S. Reddy

发明人： Benjamin V. Fasano ,  Lewis S. Goldmann ,  Richard F. Indyk ,  Sundar M. Kamath ,  Scott I. Langenthal ,  Srinivasa S. Reddy

IPC分类号： B32B3126

CPC分类号： H01L23/15 ,  H01L21/481 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/901 ,  H01L2924/00

摘要： Multilayer glass ceramic substrate electronic components having enhanced flexibility and strength are prepared using greensheets as a top and/or bottom layer, which greensheets are made from a glass-ceramic greensheet casting composition comprising crystallizable glass, a binder resin and a solvent system, and preferably a plasticizer. The top and/or bottom greensheets have a lower coefficient of thermal expansion (CTE) than the greensheets used to make the internal layers of the MLC and both greensheets are characterized by having, after sintering, a microstructure which is greater than 99% crystalline. A crystalline matrix forming material such as P2O5 is preferably used in the composition. This type structure, in combination with the lower CTE, has been found to provide an MLC having enhanced strength and flexibility.

摘要翻译： 具有增强的柔韧性和强度的多层玻璃陶瓷基片电子元件是使用绿叶作为顶层和/或底层制备的，所述毛坯由包含可结晶玻璃，粘合剂树脂和溶剂体系的玻璃陶瓷毛坯流延组合物制成， 增塑剂。 顶部和/或底部毛坯的热膨胀系数（CTE）比用于制造MLC的内层的毛坯厚度都要小，并且在烧结后具有大于99％结晶度的微观结构。 在组合物中优选使用诸如P 2 O 5的结晶基质形成材料。 已经发现这种类型结构与较低CTE组合提供了具有增强的强度和柔性的MLC。

公开(公告)号：US6139666A

公开(公告)日：2000-10-31

申请号：US320535

申请日：1999-05-26

申请人： Benjamin V. Fasano ,  Richard F. Indyk ,  Sundar M. Kamath ,  Scott I. Langenthal ,  Srinivasa S. Reddy

发明人： Benjamin V. Fasano ,  Richard F. Indyk ,  Sundar M. Kamath ,  Scott I. Langenthal ,  Srinivasa S. Reddy

IPC分类号： B32B18/00 ,  C04B35/111 ,  C04B35/64 ,  H01L21/48 ,  H01L23/13 ,  H05K1/03 ,  H05K3/46 ,  B32B31/00 ,  C03B29/00

CPC分类号： B32B18/00 ,  B32B37/26 ,  C04B35/111 ,  C04B35/64 ,  H01L21/481 ,  H01L23/13 ,  H05K3/4629 ,  B32B2315/02 ,  C04B2235/5224 ,  C04B2235/5445 ,  C04B2235/6567 ,  C04B2235/658 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/525 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/09154 ,  H05K2203/308

摘要： A method for making multilayer ceramic substrates having substantially reduced planar shrinkage and distortion resulting from the firing or sintering process. Contact sheets are employed in the fabrication process on the surface of the multilayer ceramic substrate to be fired with the contact sheets being prepared from a composition containing a non-sinterable non-metallic inorganic material such as alumina having an average particle size approximately about 1 micron or less and an organic binder and preferably a plasticizer. In a preferred embodiment of the invention, the multilayer structure to be fired containing the contact sheet of the invention is provided with a beveled or chamfered edge at an angle of greater than about 60 degrees. A fabrication process employing only chamfering of the edge or the use of a contact sheet of the invention also provides improved multilayer ceramic substrate products. A further feature is a method to control the surface topography of surface metallization by adjusting the compressibility of the contact sheets during fabrication of the substrate.

摘要翻译： 一种制造多层陶瓷基板的方法，其具有基本上减小由烧结或烧结过程引起的平面收缩和变形。 接触片用于待烧制的多层陶瓷基材的表面上的制造过程中，接触片由含有不可烧结的非金属无机材料如具有约1微米的平均粒度的氧化铝的组合物制备 以下，有机粘合剂，优选增塑剂。 在本发明的优选实施例中，包含本发明的接触片的要被烧制的多层结构以大于约60度的角度设置有斜面或倒角的边缘。 仅使用边缘的倒角或本发明的接触片的使用的制造工艺还提供改进的多层陶瓷基板产品。 另一个特征是通过在衬底的制造期间调节接触片的压缩性来控制表面金属化的表面形貌的方法。

公开(公告)号：US06835260B2

公开(公告)日：2004-12-28

申请号：US10265516

申请日：2002-10-04

申请人： Benjamin V. Fasano ,  David H. Gabriels ,  Richard F. Indyk ,  Glenn A. Pomerantz ,  Richard A. Shelleman

发明人： Benjamin V. Fasano ,  David H. Gabriels ,  Richard F. Indyk ,  Glenn A. Pomerantz ,  Richard A. Shelleman

IPC分类号： B32B3118

CPC分类号： B32B18/00 ,  B32B38/0004 ,  B32B2310/0843 ,  C04B2237/32 ,  C04B2237/341 ,  C04B2237/52 ,  C04B2237/56 ,  C04B2237/561 ,  C04B2237/562 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/702 ,  H01L21/4807 ,  H01L21/481 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4697 ,  H05K2203/063 ,  H05K2203/308 ,  Y10T156/1082

摘要： Methods to create raised pedestal parts in ceramic substrates sintered under a load. The invention uses a patterned, buried, non-sintering layer that provides the needed transfer of load during the sintering process to the raised or pedestal portion of the substrate while maintaining dimensional control of the metallized features on the surface of the pedestal base. The methods involve cutting channels in the ceramic substrate corresponding in position to the perimeter of the opening in the patterned non-sintering contact sheet. The channels may be cut either before or after the sintering of the ceramic substrates.

公开(公告)号：US07087513B2

公开(公告)日：2006-08-08

申请号：US10904138

申请日：2004-10-26

申请人： Benjamin V. Fasano ,  Richard F. Indyk ,  Kevin M. Prettyman

发明人： Benjamin V. Fasano ,  Richard F. Indyk ,  Kevin M. Prettyman

IPC分类号： H01L21/44 ,  H01L21/50

CPC分类号： G01R31/2886 ,  G01R1/0466 ,  H01L21/486 ,  H01L21/6835

摘要： The present invention provides a method for producing a temporary chip carrier for semiconductor chip burn-in test and speed sorting. A multi-layered substrate or card, usually comprised of one of various materials is made by offsetting the conductor-filled vias or holes in the outer few layers with the outer most layer not being filled with a conductor, such that a partially filled via or hole is produced. This effectively produces a smaller surface conductor feature, on which the semiconductor chip is temporarily attached, electrically tested, and subsequently removed using various methods, at forces much lower than normal chip removal processes require.

摘要翻译： 本发明提供一种用于制造用于半导体芯片老化测试和速度分选的临时芯片载体的方法。 通常由各种材料中的一种构成的多层基板或卡通过抵消外部几层中的导体填充的通孔或孔，其中最外层未填充有导体，从而使部分填充的通孔或 产生孔。 这有效地产生较小的表面导体特征，半导体芯片暂时附着，电学测试，并随后使用各种方法，以比正常的芯片去除工艺要求低得多的力除去。

公开(公告)号：US07897059B2

公开(公告)日：2011-03-01

申请号：US11937646

申请日：2007-11-09

申请人： Richard F. Indyk ,  Krystyna W. Semkow

发明人： Richard F. Indyk ,  Krystyna W. Semkow

IPC分类号： C03C15/00

CPC分类号： C23G1/10 ,  B23K1/0016 ,  B23K3/0623 ,  B23K35/262 ,  B23K35/3601 ,  B23K2103/08 ,  C23F1/30 ,  C23F1/44 ,  H05K3/26 ,  H05K3/3478 ,  H05K2203/0113 ,  H05K2203/0338

摘要： A method is provided for the removal of tin or tin alloys from substrates such as the removal of residual tin solder from the molds used in the making of interconnect solder bumps on a wafer or other electronic device. The method is particularly useful for the well-known C4NP interconnect technology and uses an etchant composition comprising cupric ions and HCl. Cupric chloride and cupric sulfate are preferred. A preferred method regenerates cupric ions by bubbling air or oxygen through the etchant solution during the cleaning process.

摘要翻译： 提供了一种用于从基底去除锡或锡合金的方法，例如从用于制造晶片或其它电子器件上的互连焊料凸块的模具中除去残留的锡焊料。 该方法对于众所周知的C4NP互连技术特别有用，并且使用包含铜离子和HCl的蚀刻剂组合物。 氯化铜和硫酸铜是优选的。 优选的方法是通过在清洁过程中通过蚀刻剂溶液鼓泡空气或氧气来再生铜离子。

公开(公告)号：US06261927B1

公开(公告)日：2001-07-17

申请号：US09302943

申请日：1999-04-30

申请人： Govindarajan Natarajan ,  Richard F. Indyk ,  Vincent P. Peterson ,  Krishna G. Sachdev

发明人： Govindarajan Natarajan ,  Richard F. Indyk ,  Vincent P. Peterson ,  Krishna G. Sachdev

IPC分类号： H01L2130

CPC分类号： H01L21/481 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  Y10S438/976 ,  H01L2924/00

摘要： This invention relates generally to a new method of forming semiconductor substrates with defect-free surface metallurgical features. In particular, the invention related to a method for providing surface protected ceramic green sheet laminates using at least one thermally depolymerizable surface layer. More particularly, the invention encompasses a method for fabricating semiconductor substrates wherein a thermally depolymerizable/decomposable surface film is placed over a ceramic green sheet stack or assembly prior to lamination and caused to conform to the surface topography of the green sheet during lamination. The invention also encompasses a method for fabricating surface protected green sheet laminates which can be sized or diced without causing process related defects on the ceramic surface. After lamination the thermally depolymerizable/decomposable film is conveniently and cleanly removed due to thermal depolymerization and burn-off of volatile species during the sintering process, thus providing surface defect-free ceramic substrates.

摘要翻译： 本发明一般涉及一种形成具有无缺陷表面冶金特征的半导体衬底的新方法。 特别地，本发明涉及使用至少一个可热解聚表面层来提供表面保护的陶瓷生片层叠体的方法。 更具体地说，本发明包括一种制造半导体衬底的方法，其中在层压之前将热可解聚/可分解的表面薄膜放置在陶瓷生片层或组件上方并使其在叠层过程中符合生片的表面形貌。 本发明还包括用于制造表面保护的生片层压板的方法，其可以在陶瓷表面上不引起工艺相关缺陷的尺寸或切割。 在层压之后，由于在烧结过程中挥发物质的热解聚和燃烧，因此可方便且清洁地除去热可分解/可分解的膜，从而提供无表面缺陷的陶瓷基材。

公开(公告)号：US08652941B2

公开(公告)日：2014-02-18

申请号：US13474090

申请日：2012-05-17

申请人： Richard F. Indyk ,  Jae-Woong Nah ,  Satoru Katsurayama ,  Daisuke Oka ,  Shigefumi Okada

发明人： Richard F. Indyk ,  Jae-Woong Nah ,  Satoru Katsurayama ,  Daisuke Oka ,  Shigefumi Okada

IPC分类号： H01L21/78 ,  H01L21/46 ,  H01L21/301 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L24/27 ,  H01L21/78 ,  H01L24/29 ,  H01L2224/2732 ,  H01L2224/27416 ,  H01L2224/27418 ,  H01L2224/278 ,  H01L2224/27831 ,  H01L2224/2784 ,  H01L2224/2919 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2224/27 ,  H01L2924/00

摘要： In one embodiment, a dielectric material layer embedding metal structures is ablated from the chip-containing substrate by laser grooving, which is performed on dicing channels of the chip-containing substrate. Subsequently, an underfill layer is formed over the dielectric material layer in a pattern that excludes the peripheral areas of the chip-containing substrate. The physically exposed dicing channels at the periphery can be employed to align a blade to dice the chip-containing substrate. In another embodiment, an underfill layer is formed prior to any laser grooving. Mechanical cutting of the underfill layer from above dicing channels is followed by laser ablation of the dicing channels and subsequent mechanical cutting to dice a chip-containing substrate.

摘要翻译： 在一个实施例中，通过在含芯片的衬底的切割通道上进行的激光切槽，将含有金属结构的电介质材料层从含芯片的衬底烧蚀。 随后，以不包括含芯片的衬底的周边区域的图案在电介质材料层上形成底部填充层。 可以使用在周边处的物理暴露的切割通道来对齐刀片以将含芯片的基底切割。 在另一个实施例中，在任何激光切槽之前形成底部填充层。 从切割通道上方对底部填充层进行机械切割，随后切割通道的激光烧蚀和随后的机械切割以切割含芯片的基底。