公开(公告)号：US20100134979A1

公开(公告)日：2010-06-03

申请号：US12540880

申请日：2009-08-13

申请人： Yoshiko Obiraki ,  Seiji Oka ,  Takeshi Oi

发明人： Yoshiko Obiraki ,  Seiji Oka ,  Takeshi Oi

IPC分类号： H05K7/20 ,  H01R9/00

CPC分类号： H01L23/3735 ,  H01L23/4334 ,  H01L23/49811 ,  H01L25/072 ,  H01L25/115 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30107 ,  H02M7/003 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power semiconductor apparatus has: plural power semiconductor units, sealed by a transfer mold resin so that insertion holes of conductive tubular sockets in which plural external terminals can be insertion-connected are exposed in one surface thereof and a metal heat dissipation surface is exposed in another surface thereof; and a conductive connecting member having the plural external terminals. The surfaces of the power semiconductor units that have the insertion holes of tubular sockets are arrayed in the same direction in the plural power semiconductor units. Electrical wiring connection between the plural power semiconductor units is effected by inserting the external terminals of the conductive connecting member into the respective insertion holes of the tubular sockets of the plural power semiconductor units.

摘要翻译： 功率半导体装置具有：多个功率半导体单元，其由转移树脂密封，使得能够插入多个外部端子的导电管状插座的插入孔在其一个表面露出，金属散热面露出 其另一表面; 以及具有多个外部端子的导电连接构件。 具有管状插座的插入孔的功率半导体单元的表面在多个功率半导体单元中以相同的方向排列。 通过将导电连接构件的外部端子插入到多个功率半导体单元的管状插座的各个插入孔中，实现多个功率半导体单元之间的电连接。

公开(公告)号：US08610261B2

公开(公告)日：2013-12-17

申请号：US12582246

申请日：2009-10-20

申请人： Seiji Oka ,  Yoshiko Obiraki ,  Takeshi Oi

发明人： Seiji Oka ,  Yoshiko Obiraki ,  Takeshi Oi

IPC分类号： H01L23/48

CPC分类号： H01L23/3735 ,  H01L23/041 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/072 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power semiconductor device includes a power semiconductor module having cylindrical conductors which are joined to a wiring pattern so as to be substantially perpendicular to the wiring pattern and whose openings are exposed at a surface of transfer molding resin, and an insert case having a ceiling portion and peripheral walls, the ceiling portion being provided with external terminals that are fitted into, and passed through, the ceiling portion, the external terminals having outer-surface-side connecting portions at the outer surface side of the ceiling portion and inner-surface-side connecting portions at the inner surface side of the ceiling portion. The power semiconductor module is set within the insert case such that the inner-surface-side connecting portions of the external terminals are inserted into the cylindrical conductors.

摘要翻译： 功率半导体器件包括功率半导体模块，该功率半导体模块具有圆柱形导体，其连接到布线图案，以便基本上垂直于布线图案，并且其开口在传输模塑树脂的表面处露出;以及插入壳体，其具有顶部 以及周壁，所述顶部设置有外部端子，所述外部端子嵌入并通过所述顶部，所述外部端子在所述顶部的外表面侧具有外表面侧连接部， 在顶棚部分的内表面侧的侧连接部分。 功率半导体模块设置在插入壳体内，使得外部端子的内表面侧连接部分插入圆柱形导体中。

公开(公告)号：US08299601B2

公开(公告)日：2012-10-30

申请号：US12535222

申请日：2009-08-04

申请人： Seiji Oka ,  Yoshiko Obiraki ,  Takeshi Oi

发明人： Seiji Oka ,  Yoshiko Obiraki ,  Takeshi Oi

IPC分类号： H01L23/48

CPC分类号： H01L23/3735 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01068 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

摘要： A power semiconductor module includes: a circuit board having a metal base plate, a high thermal conductive insulating layer, and a wiring pattern; power semiconductor elements electrically connected to the wiring pattern; tubular external terminal connection bodies provided to the wiring pattern for external terminals; and a transfer mold resin body encapsulated to expose through-holes in the metal base plate and used to fixedly attach cooling fins to the face of the metal base plate on the other side with attachment members, the face of the metal base plate on the other side, and top portions of the tubular external terminal connection bodies, to form insertion holes for the attachment members communicating with the through-holes and having a larger diameter than the through-holes, and to cover the one side and side faces of the metal base plate and the power semiconductor elements.

摘要翻译： 功率半导体模块包括：具有金属基板，高导热绝缘层和布线图案的电路板; 电连接到所述布线图案的功率半导体元件; 提供给外部端子的布线图案的管状外部端子连接体; 以及转印模塑树脂体，其被封装以暴露在金属基板中的通孔，并用于将冷却翅片固定地附接到具有附接构件的另一侧上的金属基板的表面，金属基板的另一面 侧面和顶部，以形成用于与通孔连通并且具有比通孔更大的直径的附接构件的插入孔，并且覆盖金属的一侧和侧面 基板和功率半导体元件。

公开(公告)号：US20100133684A1

公开(公告)日：2010-06-03

申请号：US12535222

申请日：2009-08-04

申请人： Seiji OKA ,  Yoshiko Obiraki ,  Takeshi Oi

发明人： Seiji OKA ,  Yoshiko Obiraki ,  Takeshi Oi

IPC分类号： H01L23/34 ,  H01L21/56

CPC分类号： H01L23/3735 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01068 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

摘要： A power semiconductor module includes: a circuit board having a metal base plate, a high thermal conductive insulating layer, and a wiring pattern; power semiconductor elements electrically connected to the wiring pattern; tubular external terminal connection bodies provided to the wiring pattern for external terminals; and a transfer mold resin body encapsulated to expose through-holes in the metal base plate and used to fixedly attach cooling fins to the face of the metal base plate on the other side with attachment members, the face of the metal base plate on the other side, and top portions of the tubular external terminal connection bodies, to form insertion holes for the attachment members communicating with the through-holes and having a larger diameter than the through-holes, and to cover the one side and side faces of the metal base plate and the power semiconductor elements.

摘要翻译： 功率半导体模块包括：具有金属基板，高导热绝缘层和布线图案的电路板; 电连接到所述布线图案的功率半导体元件; 提供给外部端子的布线图案的管状外部端子连接体; 以及转印模塑树脂体，其被封装以暴露在金属基板中的通孔，并用于将冷却翅片固定地附接到具有附接构件的另一侧上的金属基板的表面，金属基板的另一面 侧面和顶部，以形成用于与通孔连通并且具有比通孔更大的直径的附接构件的插入孔，并且覆盖金属的一侧和侧面 基板和功率半导体元件。

公开(公告)号：US20100127383A1

公开(公告)日：2010-05-27

申请号：US12582025

申请日：2009-10-20

申请人： Seiji OKA ,  Yoshiko Obiraki ,  Takeshi Oi

发明人： Seiji OKA ,  Yoshiko Obiraki ,  Takeshi Oi

IPC分类号： H01L23/522 ,  H01L25/16 ,  H01L23/34

CPC分类号： H01L24/40 ,  H01L24/37 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/73263 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： In the power semiconductor module, a wiring metal plate electrically connects between power semiconductor elements joined to the circuit pattern, and between the power semiconductor elements and the circuit pattern. Cylindrical main terminals are joined, substantially perpendicularly, to the wiring metal plate and the circuit pattern, respectively. A cylindrical control terminal is joined, substantially perpendicularly, to one of the power semiconductor elements.

摘要翻译： 在功率半导体模块中，布线金属板将连接到电路图案的功率半导体元件之间以及功率半导体元件与电路图案之间电连接。 圆柱形主端子分别基本上垂直地接合到布线金属板和电路图案。 圆柱形控制端子基本垂直地连接到功率半导体元件中的一个。

公开(公告)号：US08952520B2

公开(公告)日：2015-02-10

申请号：US12504250

申请日：2009-07-16

申请人： Yoshiko Obiraki ,  Seiji Oka ,  Osamu Usui ,  Yasushi Nakayama ,  Takeshi Oi

发明人： Yoshiko Obiraki ,  Seiji Oka ,  Osamu Usui ,  Yasushi Nakayama ,  Takeshi Oi

IPC分类号： H01L23/48 ,  H01L23/373 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L23/3735 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power semiconductor device with improved productivity, reduced size and reduction of amounting area therefore is provided. In the provided power semiconductor device, an external terminal does not limit an increase in current. The power semiconductor device is sealed with transfer molding resin. In the power semiconductor device, a cylindrical external terminal communication section is arranged on a wiring pattern so as to be substantially perpendicular to the wiring pattern. An external terminal can be inserted and connected to the cylindrical external terminal communication section. The cylindrical external terminal communication section allows the inserted external terminal to be electrically connected to the wiring pattern. A taper is formed at, at least, one end of the cylindrical external terminal communication section, which one end is joined to the wiring pattern.

摘要翻译： 因此，提供了具有提高的生产率，减小的尺寸和减少面积的功率半导体器件。 在所提供的功率半导体器件中，外部端子不限制电流的增加。 功率半导体器件用传递模塑树脂密封。 在功率半导体装置中，圆筒状的外部端子连通部布置在布线图案上，使其大致垂直于布线图形。 外部端子可以插入并连接到圆筒形外部端子通信部分。 圆筒形外部终端通信部分允许插入的外部端子电连接到布线图案。 在圆筒形外部终端连通部的至少一端形成有锥形，该端部与布线图案相接合。

公开(公告)号：US08319333B2

公开(公告)日：2012-11-27

申请号：US12582025

申请日：2009-10-20

申请人： Seiji Oka ,  Yoshiko Obiraki ,  Takeshi Oi

发明人： Seiji Oka ,  Yoshiko Obiraki ,  Takeshi Oi

IPC分类号： H01L23/48

CPC分类号： H01L24/40 ,  H01L24/37 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/73263 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： In the power semiconductor module, a wiring metal plate electrically connects between power semiconductor elements joined to the circuit pattern, and between the power semiconductor elements and the circuit pattern. Cylindrical main terminals are joined, substantially perpendicularly, to the wiring metal plate and the circuit pattern, respectively. A cylindrical control terminal is joined, substantially perpendicularly, to one of the power semiconductor elements.

摘要翻译： 在功率半导体模块中，布线金属板将连接到电路图案的功率半导体元件之间以及功率半导体元件与电路图案之间电连接。 圆柱形主端子分别基本上垂直地接合到布线金属板和电路图案。 圆柱形控制端子基本垂直地连接到功率半导体元件中的一个。

公开(公告)号：US08258618B2

公开(公告)日：2012-09-04

申请号：US12577376

申请日：2009-10-12

申请人： Yoshiko Obiraki ,  Seiji Oka ,  Takeshi Oi

发明人： Yoshiko Obiraki ,  Seiji Oka ,  Takeshi Oi

IPC分类号： H01L23/48

CPC分类号： H01L23/4334 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01078 ,  H01L2924/13055 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The power semiconductor module includes: a circuit substrate; power semiconductor elements joined to element mounting portions of the wiring pattern on the circuit substrate; the cylindrical external terminal communication section joined to the wiring pattern; circuit forming means for connecting between portions that require electrical connection therebetween; and transfer molding resin for sealing these components. The cylindrical external terminal communication section is a metal cylinder, and the cylindrical external terminal communication section has a hole filled with gel.

摘要翻译： 功率半导体模块包括：电路基板; 功率半导体元件连接到电路基板上的布线图案的元件安装部分; 所述圆筒形外部端子连通部接合到所述布线图案; 电路形成装置，用于在需要电连接的部分之间连接; 和用于密封这些组分的传递模塑树脂。 圆筒形外部端子连通部是金属圆筒，圆筒状的外部端子连通部具有填充有凝胶的孔。

公开(公告)号：US08253236B2

公开(公告)日：2012-08-28

申请号：US13086499

申请日：2011-04-14

申请人： Takeshi Oi ,  Seiji Oka ,  Yoshiko Obiraki ,  Osamu Usui ,  Yasushi Nakayama

发明人： Takeshi Oi ,  Seiji Oka ,  Yoshiko Obiraki ,  Osamu Usui ,  Yasushi Nakayama

IPC分类号： H01L23/48

CPC分类号： H05K3/32 ,  H01L23/3121 ,  H01L24/28 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L25/162 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K3/284 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/10962 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

摘要： A power semiconductor device includes power semiconductor elements joined to wiring patterns of a circuit substrate, cylindrical external terminal communication sections, and wiring means for forming electrical connection between, for example, the power semiconductor elements and the cylindrical external terminal communication sections. The power semiconductor elements, the cylindrical external terminal communication sections, and the wiring means are sealed with transfer molding resin. The cylindrical external terminal communication sections are arranged on the wiring patterns so as to be substantially perpendicular to the wiring patterns, such that external terminals are insertable and connectable to the cylindrical external terminal communication sections, and such that a plurality of cylindrical external terminal communication sections among the cylindrical external terminal communication sections are arranged two-dimensionally on each of wiring patterns that act as main circuits.

摘要翻译： 功率半导体器件包括接合到电路基板的布线图案的电力半导体元件，圆柱形外部端子连通部分和用于形成例如功率半导体元件和圆筒形外部端子连接部分之间的电连接的布线装置。 功率半导体元件，圆筒形外部端子连通部分和布线装置用传递模塑树脂密封。 圆筒形的外部端子连通部分布置在布线图案上，以便大致垂直于布线图案，使得外部端子可插入并可连接到圆柱形外部端子连通部分，并且使得多个圆柱形外部端子连通部分 在作为主电路的每个布线图案上，圆柱形外部端子通信部分二维布置。

公开(公告)号：US20100117219A1

公开(公告)日：2010-05-13

申请号：US12523948

申请日：2008-01-18

申请人： Seiji Oka ,  Osamu Usui ,  Yasushi Nakayama ,  Yoshiko Obiraki ,  Takeshi Oi

发明人： Seiji Oka ,  Osamu Usui ,  Yasushi Nakayama ,  Yoshiko Obiraki ,  Takeshi Oi

IPC分类号： H01L23/48

CPC分类号： H01L25/072 ,  H01L23/4334 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power semiconductor device in which transfer molding resin seals: a metallic circuit substrate; a power semiconductor element joined to a wiring pattern; and a side surface of a cylindrical external terminal communication section provided on the wiring pattern and to which an external terminal can be inserted and connected. The cylindrical external terminal communication section is substantially perpendicular to a surface on which the wiring pattern is formed. An outer surface of a metal plate of the metallic circuit substrate and a top portion of the cylindrical external terminal communication section are exposed from the transfer molding resin. The transfer molding resin is not present within the cylindrical external terminal communication section.

摘要翻译： 一种功率半导体器件，其中传输模塑树脂密封：金属电路基板; 连接到布线图案的功率半导体元件; 以及设置在布线图案上并且可以插入和连接外部端子的圆筒形外部端子连通部的侧表面。 圆筒形外部端子连通部分基本上垂直于其上形成有布线图案的表面。 金属电路基板的金属板的外表面和圆筒形外部端子连通部分的顶部从传递模塑树脂露出。 传递模塑树脂不存在于圆筒形外部端子连通部分内。